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| Number | Title | Issue Date |
| 5233504 | Noncollapsing multisolder interconnection An improved electrical component package comprises a component attached to a substrate by a plurality of multisolder interconnections. Each interconnection comprises a preformed spacer bump composed of a first solder alloy, preferably a lead-base tin allo... | 08/03/1993 |
| 5229070 | Low temperature-wetting tin-base solder paste A low temperature-wetting solder paste for forming a tin-base solder connection comprises a mixture of compositionally distinct first and second solder powders. The first solder is formed predominantly of tin, preferably at least 90 weight percent. The se... | 07/20/1993 |
| 5221038 | Method for forming tin-indium or tin-bismuth solder connection having increased melting temperature A solder connection (30) is formed based upon a tinindium or tin-bismuth alloy, but having a melting temperature greater than the melting temperature of the initial solder alloy. A deposit (26) of solder alloy is placed against a tin plate (24) applied, p... | 06/22/1993 |
| 5153542 | Multidielectric microstrip filter A multidielectric electrical filter is adapted for passing a primary electrical signal at a first frequency while attenuating higher frequency signals, most notably harmonic spurs. The filter comprises an elongated transmission line and one or more radial... | 10/06/1992 |
| 5088007 | Compliant solder interconnection An improved interconnection for mounting an electrical component to a substrate, such as a printed circuit board or the like, comprises an interwoven copper film mat embedded within a solder alloy matrix. The solder alloy is bonded to the component and to... | 02/11/1992 |
| 5086966 | Palladium-coated solder ball A body formed of a lead-tin solder alloy is pretreated to deposit palladium thereon prior to soldering to a metallic substrate. It is found that the palladium deposit enhances wetting of the substrate by the solder liquid during reflow and thereby, upon c... | 02/11/1992 |
