Did You Know...
...that the Eveready Battery began as an invention called the "electric flowerpot," which was a tube with a battery and light bulb inside? The idea was to fasten this gizmo to the side of a flowerpot so it would illuminate the flowers from the bottom. The idea died on the vine and the businessman who licensed the flower pot, Conrad Huber, was left with a pile of useless tubes -- until he found a way to market them as batteries to light the world!
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| Number | Title | Issue Date |
| 8072085 | Semiconductor device with plastic package molding compound, semiconductor chip and leadframe and method for producing the same A semiconductor device with a plastic package molding compound, a semiconductor chip and a leadframe is disclosed. In one embodiment, the semiconductor chip is embedded in a plastic package molding compound. The upper side of the semiconductor chip and the plastic p... | 12/06/2011 |
| 7989885 | Semiconductor device having means for diverting short circuit current arranged in trench and method for producing same A semiconductor device has a first semiconductor layer of a first conductivity type and a second semiconductor layer of a second conductivity type complementary to the first conductivity type arranged in or on the first semiconductor layer. The semiconductor device ... | 08/02/2011 |
| 7988794 | Semiconductor device and method A semiconductor device having a topology adjustment and a method for adjusting the topology of a semiconductor device. The semiconductor device includes a semiconductor wafer having first and second opposing sides with an active area formed on a first portion of the... | 08/02/2011 |
| 7968919 | Integrated circuit including a charge compensation component A charge compensation component having a drift path between two electrodes, an electrode and a counterelectrode, and methods for producing the same. The drift path has drift zones of a first conduction type and charge compensation zones of a complementary conduction... | 06/28/2011 |
| 7956446 | Semiconductor device and method A chip carrier includes first, second and third layers with the second layer situated between the first and third layers. The first and third layers are formed of a first material and the second layer is formed of a second material. The second layer has a plurality ... | 06/07/2011 |
| 7952350 | Circuit that provides output voltages in a homogenous magnetic field A circuit including Hall plates and an amplifier. The Hall plates are configured to provide Hall voltages in a homogenous magnetic field such that a first Hall plate has a first positive voltage and a first negative voltage and a second Hall plate has a second posit... | 05/31/2011 |
| 7952200 | Semiconductor device including a copolymer layer A semiconductor device including a chip including an integrated circuit, a conductive layer, a copolymer layer and metal elements. The conductive layer is disposed over the chip and electrically coupled to the integrated circuit. The copolymer is disposed on the con... | 05/31/2011 |
| 7951676 | Semiconductor device and method for the production of a semiconductor device The semiconductor device has a semiconductor body with a semiconductor device structure. The semiconductor device structure has a first electrode, a second electrode and a gate electrode. The gate electrode is designed to form a conductive channel region. An insulat... | 05/31/2011 |
| 7947990 | Light emitting diode with side electrodes A semiconductor device including a wafer-level LED includes a semiconductor structure coupled to first and second electrodes. The semiconductor includes a P-doped portion of a first layer to an N-doped portion of a second layer. The first layer includes a surface co... | 05/24/2011 |
| 7946167 | Constant temperature hot-conductor anemometer A constant temperature hot-conductor anemometer includes a set of electrically conductive pins including a pair of inner pins and a pair of outer pins. A conductor is electrically and mechanically coupled to the pins. A current source is coupled to the inner pins. T... | 05/24/2011 |
| 7940582 | Integrated circuit that stores defective memory cell addresses An integrated circuit including an array of memory cells, a circuit, volatile storage, and non-volatile storage. The circuit is configured to detect defective memory cells in the array of memory cells and provide addresses of the defective memory cells. The volatile... | 05/10/2011 |
| 7939850 | Semiconductor device and method for producing a semiconductor device A semiconductor device has a semiconductor body with a semiconductor device structure including at least a first electrode and a second electrode. Between the two electrodes, a drift region is arranged, the drift region including charge compensation zones and drift ... | 05/10/2011 |
| 7935622 | Support with solder ball elements and a method for populating substrates with solder balls A support with solder ball elements for loading substrates with ball contacts is disclosed. One embodiment provides a system for loading substrates with ball contacts and a method for loading substrates with ball contacts. The support has a layer of adhesive applied... | 05/03/2011 |
| 7932587 | Singulated semiconductor package A semiconductor device includes a singulated semiconductor package having a leadframe, a chip electrically coupled to the leadframe, encapsulating material covering the chip and a portion of the leadframe, and a material layer disposed over opposing ends of the lead... | 04/26/2011 |
| 7932180 | Manufacturing a semiconductor device via etching a semiconductor chip to a first layer A method of manufacturing a semiconductor device. The method includes providing a semiconductor chip including contact elements on a first face and a first layer between the first face and a second face opposite the first face. Placing the semiconductor chip on a ca... | 04/26/2011 |
| 7923827 | Semiconductor module for a switched-mode power supply and method for its assembly Semiconductor module for a Switched-Mode Power Supply comprises at least one semiconductor power switch, a control semiconductor chip and a leadframe comprising a die pad and a plurality of leads disposed on one side of the die pad. The die pad comprises at least tw... | 04/12/2011 |
| 7923772 | Semiconductor device with a semiconductor body and method for producing it A semiconductor device with a semiconductor body and to a method for producing it. In one embodiment, the semiconductor body has first electrodes which contact first highly doped semiconductor zones and complementary-conduction body zones surrounding the first semic... | 04/12/2011 |
| 7923350 | Method of manufacturing a semiconductor device including etching to etch stop regions A method of manufacturing a semiconductor device. The method includes providing a wafer having a first face and a second face opposite the first face, selectively doping the wafer via the first face to selectively form etch stop regions in the wafer and etching the ... | 04/12/2011 |
| 7915885 | Sensor system and method A sensing system includes a conductor with a current flow path therethrough. A first location of the conductor defines a first cross-sectional area and a second location defines a second cross-sectional area, wherein a current flowing through the conductor establish... | 03/29/2011 |
| 7915089 | Encapsulation method A method and apparatus for encapsulating items such as electronic devices. A mold material is dispensed onto the electronic device and the device is situated between first and second molds. One mold is moved towards the other so as to vary the size of a cavity defin... | 03/29/2011 |
| 7912667 | Electrical circuit and method for testing electronic component An electrical test circuit is disclosed. In one embodiment, the electrical test circuit includes a first input for receiving a test signal of an integrated circuit, a second input for receiving a control signal and a third input for receiving a normalized reference ... | 03/22/2011 |
| 7834609 | Semiconductor device with compensation current A semiconductor device is disclosed. In one embodiment, the semiconductor device includes a first resistor, a second resistor, and a transistor. The second resistor is configured to receive a current via the first resistor. The transistor is configured to be driven ... | 11/16/2010 |
| 7816229 | Semiconductor device with channel stop trench and method A semiconductor device is provided which includes a semiconductor substrate having a first surface, an active area and a peripheral area. The semiconductor device further includes least one channel stop trench formed in the semiconductor substrate, wherein the chann... | 10/19/2010 |
| 7681063 | Clock data recovery circuit with circuit loop disablement A clock data recovery circuit includes a first circuit, a second circuit, and a third circuit. The first circuit is configured to receive data and a clock signal and to detect transitions in the data and provide a first signal based on the clock signal and the trans... | 03/16/2010 |
| 7655939 | Memory cell, memory device and method for the production thereof A nonvolatile memory cell, a memory device and a corresponding production method are disclosed. In one embodiment, a memory material region is in this case provided as memory element between a first electrode device and a second electrode device. The memory material... | 02/02/2010 |
| 7636250 | Random access memory that selectively provides data to amplifiers A random access memory including a first amplifier, a second amplifier, a first data path, a second data path, and a first circuit. The first data path receives first data via first memory cells and the second data path receives second data via second memory cells. ... | 12/22/2009 |
| 7623401 | Semiconductor device including multi-bit memory cells and a temperature budget sensor One embodiment provides a semiconductor device including a plurality of multi-bit memory cells, a first temperature budget sensor, and a circuit. Each of the plurality of multi-bit memory cells is programmable into each of more than two states. The circuit compares ... | 11/24/2009 |
| 7619936 | System that prevents reduction in data retention One embodiment of the present invention provides a system including a tester and a back end manufacturing system. The tester tests a resistive memory and obtains configuration data for the resistive memory. The back end manufacturing system prevents temperatures in ... | 11/17/2009 |
| 7597235 | Apparatus and method for producing a bonding connection One aspect relates to a bonding apparatus for producing a bonding connection between a bonding wire and a bonding partner. The bonding apparatus includes a heel shaper, which is provided for avoiding damage to the bonding wire in the heel region during the bonding o... | 10/06/2009 |
| 7592875 | Injection-locked oscillator circuit An ILO circuit has a plurality of oscillator stages which are coupled to one another by means of a “tank lock” coupling. The coupling leads to an improved synchronization of the individual oscillator stages and thus to a reduced phase noise. Any desired LC oscil... | 09/22/2009 |
| 7586161 | Edge structure with voltage breakdown in the linear region One aspect of the invention relates to an edge structure for a semiconductor component having two electrodes arranged opposite one another on opposite sides of a semiconductor body having a doped zone of the first charge carrier type. The semiconductor body has at l... | 09/08/2009 |
| 7582513 | Electronic device and method for producing electronic devices One aspect includes an electronic device including an integrated component with a substrate. An electrically conductive first layer region is arranged at the substrate, wherein the layer thickness of the first layer region is greater than 10 micrometers or greater t... | 09/01/2009 |
| 7429035 | Equipment handling apparatus An equipment handling apparatus is described. The equipment handling apparatus includes a base and a mast coupled to the base, an equipment head coupled to and translatable along the mast, and a mounting device rotatably coupled to the equipment head. In this regard... | 09/30/2008 |
| 7378727 | Memory device and a method of forming a memory device A memory device includes a semiconductor substrate having a surface, a plurality of first and second conductive lines, a plurality of memory cells, and a plurality of landing pads. Each of the first conductive lines has a line width wb and two neighboring ones of th... | 05/27/2008 |
| 7307868 | Integrated circuit including memory cell for storing an information item and method The invention relates to a memory cell for providing an information item, having a memory element, which has a PMC resistance component with a solid electrolyte material. The solid electrolyte material may be put into a first state with a high electrical resistance ... | 12/11/2007 |
| 7306563 | Pulse diagnostic system A pulse diagnostic instrument of the present invention comprises a plurality of probes connected together and aligned laterally in series, with each probe configured for contacting a skin surface of a body limb adjacent an arterial vessel. Each probe includes a pres... | 12/11/2007 |
| 7287418 | Method of measuring interfacial adhesion properties of electronic structures A method for measuring toughness of interfacial adhesion including applying a normal force with a probe to a surface of a coating joined to a major surface of a substrate of an electronic structure, wherein the surface is substantially parallel to the major surface,... | 10/30/2007 |
| 7289335 | Force distributing spring element A force distributor is configured for disposition between a printed circuit board and a stiffening plate, which is spaced from the printed circuit board. The force distributor is configured to distribute a compressive force between the printed circuit board, an inte... | 10/30/2007 |
| 7287419 | Method of measuring interfacial adhesion properties of stents A method for measuring toughness of interfacial adhesion including applying a normal force with a probe to a surface of a coating joined to a major surface of a substrate of a medical stent, wherein the surface is substantially parallel to the major surface, and app... | 10/30/2007 |
| D546877 | Book | 07/17/2007 |
