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Attorney: Dicke, Billig & Czaja, PLLC


Number of patents: 1235
Last date: May 22, 2012

1                      
NumberTitleIssue Date
8185788Semiconductor device test system with test interface means
A semiconductor device test system has an interface for use with a semiconductor device test method, and a semiconductor device test method. In a first mode of an interface, in reaction to test signals corresponding to a test standard, for example, a JTAG test stand...
05/22/2012
8183982System including reply signal that at least partially overlaps request
A system including a receiver and a transmitter. The receiver is configured to transmit a request. The transmitter is configured to transmit a reply signal that at least partially overlaps the request. ...
05/22/2012
8183856System including signal offset estimation
A system includes a first circuit configured to convert a first analog signal to a first digital signal. The system includes a second circuit configured to determine an area of the first digital signal above a set value and an area of the first digital signal below ...
05/22/2012
8183677Device including a semiconductor chip
A device including a semiconductor chip. One embodiment provides a device, including a metal layer having a first layer face. A semiconductor chip includes a first chip face. The semiconductor chip is electrically coupled to and placed over the metal layer with the ...
05/22/2012
8183676Memory circuit having memory chips parallel connected to ports and corresponding production method
A memory circuit includes multiple memory chips configured to store data and disposed in at least one stack. The memory circuit includes multiple ports configured to receive and transmit control signals and data to and from the memory chips and to supply energy to t...
05/22/2012
8183666Semiconductor device including semiconductor zones and manufacturing method
A semiconductor device includes first semiconductor zones of a first conductivity type having a first dopant species of the first conductivity type and a second dopant species of a second conductivity type different from the first conductivity type. The semiconducto...
05/22/2012
8183125Semiconductor device and manufacturing method
A semiconductor device and manufacturing method is disclosed. One embodiment provides a common substrate of a first conductivity type and at least two wells of a second conductivity type. A buried high resistivity region and at least an insulating structure is provi...
05/22/2012
8178390Semiconductor component and production method
A semiconductor component is disclosed. In one embodiment, the semiconductor component includes a semiconductor chip, which is arranged on a substrate, and a housing, which at least partially surrounds the semiconductor chip. The substrate is at least partly provide...
05/15/2012
8177878Bonding material with exothermically reactive heterostructures
A bonding material including a meltable joining material and a plurality of heterostructures distributed throughout the meltable joining material, the heterostructures comprising at least a first material and a second material capable of conducting a self-sustaining...
05/15/2012
8175774Capacitive object recognition using adjustable electrode
A system for capacitive object recognition including a pair of electrodes, one of the electrodes having an adjustable parameter, and a controller modeling current pathways formed by interaction of an object with an electric field between the pair electrodes as a net...
05/08/2012
8175372Wafer edge inspection and metrology
Some aspects of the present invention relate to a wafer inspection method. A plurality of images is acquired about an edge portion of a wafer. Each of the images comprises a pixel array having a first dimension and a second dimension. A composite image of compressed...
05/08/2012
8174260Integrated circuit with magnetic material magnetically coupled to magneto-resistive sensing element
An integrated circuit including a first magneto-resistive sensing element, magnetic material and a spacer. The magnetic material is situated laterally to the first magneto-resistive sensing element. The spacer is situated between the first magneto-resistive sensing ...
05/08/2012
8173534Method for producing a semiconductor wafer with rear side identification
A semiconductor wafer with rear side identification and to a method for producing the same is disclosed. In one embodiment, the rear side identification has a multiplicity of information regarding the monocrystalline and surface and also rear side constitution. A mu...
05/08/2012
8169285Semiconductor device with integrated coils
A semiconductor device with a number of integrated coils is disclosed. In one embodiment, a first coil portion and a second coil portion are at least in part overlapping each other. Another embodiment provides a process for manufacturing a semiconductor device havin...
05/01/2012
8169070Semiconductor device
The semiconductor device comprises a semiconductor chip defining a first face and a second face opposite to the first face, the semiconductor chip comprising at least one contact element on the first face of the semiconductor chip, an encapsulating body encapsulatin...
05/01/2012
8169063Semiconductor component and method for producing the same
A semiconductor component of semiconductor chip size includes a semiconductor chip. The semiconductor chip has a metallic coating that completely covers the side edges, the rear side and the top side, on which surface-mountable external contacts are arranged. One em...
05/01/2012
8167743Football training system
A football training system which allows for the quick and easy movement of the target unit, i.e., a blocking dummy. The training system comprises one or more combinations of a base, a flexible support member mountable at one of three locations on the base, and a pad...
05/01/2012
D658713Industrial printer cartridge
05/01/2012
D658550Motorcycle trunk keyhole trim
05/01/2012
D658349Cutout collar
05/01/2012
8164931Rectifier circuit with a voltage sensor
A rectifier circuit with a synchronously controlled semiconductor element comprising at least one field effect transistor with a control electrode and two switching electrodes. The control electrode operates the reverse state and the forward state between the switch...
04/24/2012
8164915System for electronic components mounted on a circuit board
A system for electronic components mounted on a circuit board is disclosed. One embodiment provides placing an elastic, anisotropically conductive material on top of a printed circuit board. An electronic component is placed over the elastic, anisotropically conduct...
04/24/2012
8159022Robust semiconductor device with an emitter zone and a field stop zone
A power semiconductor component is described. One embodiment provides a semiconductor body having an inner zone and an edge zone. A base zone of a first conduction type is provided. The base zone is arranged in the at least one inner zone and the at least one edge z...
04/17/2012
8158485Integrated circuit device having openings in a layered structure
An integrated circuit device includes a substrate with a first layer situated on the substrate. The first layer defines a first opening with a cover layer deposited on the first layer and coating a sidewall portion of the first opening. A second layer is situated on...
04/17/2012
8158046Mold apparatus and method
An apparatus and method for producing an article by molding is disclosed. In one embodiment, the apparatus includes a mold with an upper part, a lower part and at least one mold cavity, and has a vacuum clamping ring with a least one closable vent, which is arranged...
04/17/2012
8157086Financial transaction card packaging having removable portion
A financial transaction card is packaged within a carrier which contains the card and prevents access to any indicia borne on the card (e.g., magnetic stripe, barcode, and the like) prior to activation of the financial transaction account associated with the card at...
04/17/2012
8156643Semiconductor device
A method of electrically interconnecting a semiconductor chip to another electronic device including providing a carrier including contact pins and a chip attached to the carrier, the chip having a copper contact pad that faces away from the carrier, extending a cop...
04/17/2012
8155916Semiconductor component and method of determining temperature
One embodiment provides a circuit arrangement integrated in a semiconductor body. At least one power semiconductor component integrated in the semiconductor body and having a control connection and a load connection is provided. A resistance component is thermally c...
04/10/2012
8154281Sensor system wherein spinning phases of the spinning current hall sensor are lengthened in residual offset adjustment
A system including a spinning current Hall sensor and a chopping circuit. The spinning current Hall sensor is configured to provide input signals and the chopping circuit is configured to receive the input signals. Spinning phases of the spinning current Hall sensor...
04/10/2012
8154114Power semiconductor module
A power semiconductor module is disclosed. One embodiment includes a multilayer substrate having a plurality of metal layers and a plurality of ceramic layers, where the ceramic layers are located between the metal layers. ...
04/10/2012
8151801Septum port locator system and method for an implantable therapeutic substance delivery device
An implantable medical device system includes an implantable device and an external locator device for percutaneously locating detecting port opening of the implantable device. The implantable device includes a port chamber forming the port opening, a septum sealing...
04/10/2012
8151720Open eye sewing needle
An open eye needle including an elongated portion, a tip portion and an open eye portion. The tip portion is attached to the elongated portion. The open eye portion is attached to the elongated portion. The open eye portion includes a tongue portion, an eye region a...
04/10/2012
8149080Integrated circuit including inductive device and ferromagnetic material
An integrated circuit includes a substrate and an inductive device on a first side of the substrate. The integrated circuit includes a first ferromagnetic material on a second side of the substrate opposite the first side. ...
04/03/2012
8148845Circuit assembly including a power semiconductor module and a controller
A circuit assembly includes a power semiconductor module and, arranged externally thereto, a controller wherein the power semiconductor module comprises at least one controllable power semiconductor as well as at least one driver gating the latter, and controller an...
04/03/2012
8148198Method for reducing variations in the bending of rolled base plates and semiconductor module having such a base plate sensor
A method for reducing variations in the bending of rolled metal base plates for semiconductor modules is disclosed. In this method, the base plates are rolled in their longitudinal direction in a specific manner. ...
04/03/2012
8145822Computer system for electronic data processing
One aspect relates to a computer system including a first data processing unit, a second data processing unit and a data transmission/memory device. The data transmission/memory can transmit sets of data from the first data processing unit to the second data process...
03/27/2012
8144861Communication circuitry, devices and methods
A method of signal communication includes receiving a selection signal, and selecting a selected frequency range used for a multi-carrier signal communication from a set of predetermined frequency ranges for signal communication depending on the selection signal. Th...
03/27/2012
8141498Rail car extension system
A rail car extension system including a first main rail section, a second main rail section and a plurality of bow structures. The first main rail section is mounted with respect to an upper surface of the first side wall. The first main rail section includes a firs...
03/27/2012
8140047System including receiver front ends
A system including an output node and receiver front ends. The receiver front ends are configured to receive an input signal. Each of the receiver front ends is configured to receive the input signal and provide an output signal at the output node. At least one of t...
03/20/2012
8138587Device including two mounting surfaces
A device including two mounting surfaces. One embodiment provides a power semiconductor chip and having a first electrode on a first surface and a second electrode on a second surface opposite to the first surface. A first external contact element and a second exter...
03/20/2012
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