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| Number | Title | Issue Date |
| 6458907 | Organometallic polymers and use thereof Compositions comprising a polymer of organometallic polymerizable monomer acid or ester are useful as resists and are sensitive to imaging irradiation while exhibiting enhanced resistance to reactive ion etching.... | 10/01/2002 |
| 6436605 | Plasma resistant composition and use thereof The reactive ion etching resistance of radiation sensitive resist composition is enhanced by adding at least one organometallic compound to a radiation sensitive polymer. The resist composition can be patterned and used as mask for patterning an underlyin... | 08/20/2002 |
| 6346362 | Polymers and use thereof Compositions comprising a polymer having silicon, germanium and/or tin; and a protecting group grafted onto a polymeric backbone are useful as resists and are sensitive to imaging irradiation while exhibiting enhanced resistance to reactive ion etching.... | 02/12/2002 |
| 6344305 | Radiation sensitive silicon-containing resists A high-performance radiation sensitive silicon-containing negative-tone resist is provided along with a method of using the silicon-containing resist in multilayer, including bilayer, imaging for manufacturing semiconductor devices. The negative-tone sili... | 02/05/2002 |
| 6337522 | Structure employing electrically conductive adhesives A new interconnection scheme is disclosed for a tape automated bonding (TAB) package, a flip chip package and an active matrix liquid crystal display (AMLCD) panel, where an electrically conducting adhesive is used to form an electrical interconnection be... | 01/08/2002 |
| 6300164 | Structure, materials, and methods for socketable ball grid A socketable ball grid array structure is disclosed which comprises mechanically rigid (compared to solder alloys) balls coated with noble contact metals joined to the chip carrier terminals by means of a novel electrically conducting adhesive. Because of... | 10/09/2001 |
| 6297559 | Structure, materials, and applications of ball grid array interconnections A new interconnection scheme of a ball grid array (BGA) module is disclosed where a solder ball is connected to the BGA module by use of an electrically conducting adhesive The electrically conducting adhesive can be a mixture comprising a polymer resin, ... | 10/02/2001 |
| 6280901 | High sensitivity, photo-active polymer and developers for high resolution resist applications Positive lithographic patterns are produced by imagewise exposing to actinic light, x-ray or e-beam a polymer having pendant recurring groups selected from the group consisting of --COO--CH2 --CH(OH)--(CH2)x --H wherein x is 0-... | 08/28/2001 |
