Bizarre Patents
Mountable Printable Placard With Headband
A resilient headband in a shape for being mounted on the head of the user. The headband is equipped with a longitudinal slotted member for holding a placard.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 8143360 | Aqueous developable benzocyclobutene-based polymer composition and method of use of such compositions The invention is a composition comprising a curable arylcyclobutene based oligomer or polymer and a dissolution inhibitor which comprises a compound comprising at least two diazonaphthoquinone (DNQ) moieties each of which is pendant from different phenyl groups.... | 03/27/2012 |
| 8143324 | Benzocyclobutene based polymer formulations and methods for processing such formulations in oxidative environments The use of hindered phenol containing anti-oxidants enable arylcyclobutene-based formulations to be cured in oxygen containing environments such as air without unacceptable degradation in key properties of dielectric constant, water uptake, or transmittance. ... | 03/27/2012 |
| 8142847 | Precursor compositions and methods Compositions including an amido-group-containing vapor deposition precursor and a stabilizing additive are provided. Such compositions have improved thermal stability and increased volatility as compared to the amido-group-containing vapor deposition precursor itsel... | 03/27/2012 |
| 8012883 | Stripping method Methods are provided for manufacturing optical display devices which remove an etch resist and residual post-etch metal in a single step. These methods are particularly useful in the manufacture of LCDs. ... | 09/06/2011 |
| 8012536 | Method of forming metal-containing layer using organometallic compounds Methods of forming metal-containing layers are provided where heteroleptic organometallic compounds containing at least one formamidinate ligand are conveyed in a gaseous form to a reactor; and films comprising a metal are deposited on a substrate. These heterolepti... | 09/06/2011 |
| 7989323 | Doping method Methods of doping a III-V compound semiconductor film are disclosed. ... | 08/02/2011 |
| 7767840 | Organometallic compounds Organometallic compounds suitable for use as vapor phase deposition precursors for Group IV metal-containing films are provided. Methods of depositing Group IV metal-containing films using certain organometallic precursors are also provided. Such Group IV metal-cont... | 08/03/2010 |
| 7722720 | Delivery device Delivery devices for delivering solid precursor compounds in the vapor phase to reactors are provided. Such devices include a precursor composition of a solid precursor compound with a layer of packing material disposed thereon. Also provided are methods for transpo... | 05/25/2010 |
| 7547631 | Organometallic compounds Organometallic compounds containing a phosphoamidinate ligand are provided. Such compounds are particularly suitable for use as vapor deposition precursors. Also provided are methods of depositing thin films, such as by ALD and CVD, using such compounds. ... | 06/16/2009 |
| 7531458 | Organometallic compounds Organometallic compounds containing an electron donating group-substituted alkenyl ligand are provided. Such compounds are particularly suitable for use as vapor deposition precursors. Also provided are methods of depositing thin films, such as by ALD and CVD, using... | 05/12/2009 |
| 7413942 | T-gate formation Methods of forming T-gate structures on a substrate are provided that use only UV-sensitive photoresists. Such methods provide T-gate structures using two lithographic steps using a single wavelength of radiation. ... | 08/19/2008 |
| 7413776 | Method of depositing a metal-containing film A method of depositing a Group IV metal-containing film on a substrate by conveying one or more of certain Group IV organometallic compounds in a gaseous phase to a deposition reactor containing a substrate and decomposing the one or more Group IV organometallic com... | 08/19/2008 |
| 7390360 | Organometallic compounds Compositions useful in the manufacture of compound semiconductors are provided. Methods of manufacturing compound semiconductors using these compositions are also provided. ... | 06/24/2008 |
| 7374652 | Plating method Copper plating baths containing a leveling agent that is a reaction product of a compound including a heteroatom chosen from nitrogen, sulfur and a mixture of nitrogen and sulfur, with a polyepoxide compound containing an ether linkage that deposit copper on the sur... | 05/20/2008 |
| 7349889 | System and method for remotely diagnosing faults A method and system for diagnosing a fault that includes a decision tree having a plurality of decision points wherein at least some of the plurality of decision points terminate in a resolution point representing a diagnosis for the fault. Also included is a plural... | 03/25/2008 |
| 7333945 | Chemical product acquisition system A computerized data processing system can assist a user in locating specialty chemical products having particular intrinsic properties specified by the user. The system can query a database to identify commercially available chemical product(s) that best conform to ... | 02/19/2008 |
| 7321048 | Organometallic compound purification A method of purifying an organometallic compound by heating the organometallic compound in the presence of a trialkyl aluminum compound and a catalyst. ... | 01/22/2008 |
| 7190016 | Capacitor structure Structures including a capacitor dielectric material disposed on the surface of an electrode suitable for use in forming capacitors are disclosed. Methods of forming such structures are also disclosed. ... | 03/13/2007 |
| 7166734 | Method for making organometallic compounds Organometallic compounds of Group IIB and IIIA metals that are substantially pure and contain low levels of oxygenated impurities are provided. Also provided are methods of preparing such organometallic compounds. ... | 01/23/2007 |
| 7163780 | Electronic device manufacture Disclosed are methods of manufacturing electronic devices, particularly integrated circuits. Such methods include the use of low dielectric constant material prepared by using a removable porogen material. ... | 01/16/2007 |
| 7144488 | Electrode, electrochemical cell, and method for analysis of electroplating baths A counter electrode for use in an electrochemical cell suitable for analysis of an electroplating composition, the counter electrode comprising a conductor; a sheath disposed about the conductor; an electrolyte disposed within the sheath; and an optionally porous el... | 12/05/2006 |
| 7141488 | Method of depositing germanium-containing films Germanium compounds suitable for use as vapor phase deposition precursors for germanium films are provided. Methods of depositing films containing germanium using such compounds are also provided. Such germanium films are particularly useful in the manufacture of el... | 11/28/2006 |
| 7128822 | Leveler compounds Compounds that function to provide level or uniform metal deposits are provided. These compounds are particularly useful in providing level copper deposits. Copper plating baths and methods of copper plating using these compounds are also provided. These baths and m... | 10/31/2006 |
| 7118847 | Polymer and photoresist compositions Disclosed are spirocyclic olefin polymers, methods of preparing spirocyclic olefin polymers, photresist compositions including spirocyclic olefin resin binders and methods of forming relief images using such photoresist compositions. ... | 10/10/2006 |
| 7079910 | Manufacturing process billing system A method and system is provided for improving the efficiency of a process for manufacturing a product and begins with the step of receiving from a manufacturer a desire to manufacture a number of said products. Next, the amount of materials that is required to produ... | 07/18/2006 |
| 7056824 | Electronic device manufacture A method of manufacturing electronic devices containing one or more layers of materials that are sensitive to the strong chemicals used to remove cross-linked polymeric layers such as photoresists and antireflective coatings is provided. The cross-linked polymeric l... | 06/06/2006 |
| 7045451 | Preparation of group IVA and group VIA compounds Methods of preparing Group IVA and Group VIA organometallic compounds, particularly Group IVA organometallic compounds, are provided. Such manufacturing methods employ an amine and/or phosphine catalyst in a transalkylation step and may be performed in a batch, semi... | 05/16/2006 |
| 7041331 | Electronic device manufacture Compositions suitable for use as underfill materials in an integrated circuit assembly are provided. Also provided are methods of preparing integrated circuit assemblies containing certain underfill materials as well as electronic devices containing such integrated ... | 05/09/2006 |
| 7018678 | Electronic device manufacture Methods for depositing uniform, pinhole-defect free organic polysilica coatings are provided. These methods allow for the use of these materials as spin-on cap layers in the manufacture of integrated circuits. ... | 03/28/2006 |
| 6998148 | Porous materials Porous thermoset dielectric materials having low dielectric constants useful in electronic component manufacture are provided along with methods of preparing the porous thermoset dielectric materials. Also provided are methods of forming integrated circuits containi... | 02/14/2006 |
| 6994757 | Resistive materials Electrically resistive material including platinum and from about 5 and about 70 molar percent of iridium, ruthenium or mixtures thereof, calculated based on platinum as 100%, are disclosed. ... | 02/07/2006 |
| 6991675 | Electroless displacement gold plating solution and additive for use in preparing plating solution An object of the present invention is to provide an electroless displacement gold plating solution, an additive for use in preparing the plating solution, and a metal composite material obtained by treatment with the plating solution. The electroless displacement go... | 01/31/2006 |
| 6977035 | Method for electrolytic copper plating A method for electrolytic copper plating using an electrolytic copper plating solution including a compound containing a structure of —X—S—Y—, wherein X and Y are independently chosen from hydrogen atom, carbon atom, sulfur atom, nitrogen atom, and oxygen at... | 12/20/2005 |
| 6967222 | Porous optical materials Methods of preparing porous optical materials are provided. These methods allow for the selection of the desired pore size and level of porosity in the porous optical material. Such methods utilize a preformed polymeric porogen. ... | 11/22/2005 |
| 6956127 | Alkyl group VA metal compounds Disclosed are methods of preparing monoalkyl Group VA metal dihalide compounds in high yield and high purity by the reaction of a Group VA metal trihalide with an organo lithium reagent or a compound of the formula RnM1X3−n, where ... | 10/18/2005 |
| 6939983 | Alkyl group VA metal compounds A method of preparing Group VA organometal compounds in high yield and high purity by the reaction of a Grignard reagent with a Group VA metal halide in certain ethereal solvents is provided. A method of preparing Group VA organometal hydrides is also provided. ... | 09/06/2005 |
| 6926922 | PWB manufacture A process and composition for manufacturing printed wiring boards that reduces or eliminates the problem of depositing electroless nickel in through holes that are not designed to be metal plated is provided. Also provided by the present invention is a method and co... | 08/09/2005 |
| 6907432 | Method and system for recycling materials A system and method is provided for recycling raw materials from a plurality waste streams generated by waste stream providers and includes a waste stream monitoring module for monitoring the plurality of waste streams and determining an amount of reusable raw mater... | 06/14/2005 |
| 6903175 | Polymer synthesis and films therefrom Disclosed are methods of preparing solution polymers and compositions derived therefrom. ... | 06/07/2005 |
| 6881319 | Electrolytic copper plating solution and method for controlling the same Disclosed are an electrolytic copper plating solution containing a specific sulfur-containing compound and a thiol-reactive compound, and an electrolytic copper plating process using such an electrolytic copper plating solution. The present invention can prevent the... | 04/19/2005 |
