Bizarre Patents
Method and apparatus for making a drink hop along a bar or counter
A method for generating a drink which appears to hop from a remote spot on the bar or counter and take one or more leaps, before landing in a patron's glass.
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| Number | Title | Issue Date |
| 8183999 | Emergency locating system and method using spread-spectrum transceiver An emergency locating system can include emergency transceivers and locator transceivers. The emergency transceivers can be capable of transmission of spread-spectrum encoded messages, and can be actuated by a user to send a distress message. A locator transceiver c... | 05/22/2012 |
| 8175134 | Radio communications system and method having decreased capability for detection by an adversary Decreased capability for detection of communications signals by an adversary is provided by applying frequency hopping, frequency chirping, and direct sequence spreading to the signals. The frequency hopping and frequency chirping can be driven by pseudo random func... | 05/08/2012 |
| 8174461 | Antenna mounting system and method A transportable directional antenna system includes an antenna pedestal, a plurality of outriggers, and an earth anchor. The earth anchor can be coupled to a horizontally centered point on the pedestal. Tension can be applied between the earth anchor and the pedesta... | 05/08/2012 |
| 8130680 | Method for timing a pulsed communication system A method for timing a full duplex pulsed wireless communication system between first and second transceivers is disclosed. At least one of the transceivers is mobile. A propagation time between the first and second transceivers is calculated. A pulse period of the f... | 03/06/2012 |
| 8107982 | Method and apparatus for FDD and TDD terminal entry into a wireless communication network Entry of a terminal into a wireless communications network is facilitated for terminals which may operate in either frequency-division duplex or time-division duplex mode. Join request messages transmitted by the terminals include a duplex capability indicator defin... | 01/31/2012 |
| 8102897 | Direct sequence spread spectrum system and method with plural chipping rates Direct sequence spread spectrum communications can use composite codes and can operate at a plurality of different chipping rates. The composite codes can be formed using a plurality of component codes, wherein the component codes can be relatively prime and at leas... | 01/24/2012 |
| 8095859 | Encoder for low-density parity check codes Encoding of a low-density parity check code uses a block-circulant encoding matrix built from circulant matrices. Encoding can include partitioning data into a plurality of data segments. The data segments are each circularly rotated. A plurality of XOR summations a... | 01/10/2012 |
| 8073084 | Correlation apparatus and method for accommodating spreading code frequency offset An apparatus and method for correlating a signal over a correlation interval while accommodating spreading code frequency offset is described. In one embodiment, the apparatus includes a plurality of correlators, where each correlator forms a correlation result corr... | 12/06/2011 |
| 8036255 | Waveform design hopping system and method A method of transmitting a spread spectrum signal in a single communication session between a transmitter and a receiver, stores a series of N unique waveform designs and a hopping sequence in a transmitter memory. A signal is transmitted to a receiver according to ... | 10/11/2011 |
| 8023530 | Physical layer quality of service for wireless communications Physical layer quality of service is provided for a wireless communication system by operationally adapting the physical layer format to the quality of service requirements of transmitted data. The physical layer formats for the data packets are selected based on th... | 09/20/2011 |
| 7808259 | Component assembly and alignment A method or an apparatus for aligning a plurality of structures can include applying a first force in a first plane to a first structure. The method can also include constraining in the first plane the first structure with respect to a second structure such that the... | 10/05/2010 |
| 7782072 | Single support structure probe group with staggered mounting pattern A probe group can include multiple probes for testing devices having contact pads. The probes can comprise beams, contact tip structures, and mounting portions. The beams can provide for controlled deflection of the probes. The contact tip structures can be connecte... | 08/24/2010 |
| 7772863 | Mechanical decoupling of a probe card assembly to improve thermal response A stiffener structure, a wiring substrate, and a frame having a major surface disposed in a stack can be part of a probe card assembly. The wiring substrate can be disposed between the frame and the stiffener structure, and probe substrates can be coupled to the fra... | 08/10/2010 |
| 7768777 | Electronic package with direct cooling of active electronic components A cooling assembly includes a package with one or more dies cooled by direct cooling. The cooled package includes one or more dies with active electronic components. A coolant port allows a coolant to enter the package and directly cool the active electronic compone... | 08/03/2010 |
| 7764075 | High performance probe system A probe system for providing signal paths between an integrated circuit (IC) tester and input/output, power and ground pads on the surfaces of ICs to be tested includes a probe board assembly, a flex cable and a set of probes arranged to contact the IC's I/O pads. T... | 07/27/2010 |
| 7746937 | Efficient wired interface for differential signals A plurality of differential signal transmitters can transmit data signals differentially through a plurality of conductive signal lines. Ones of the signal lines can be shared between transmitters, and others of the signal lines need not be shared between transmitte... | 06/29/2010 |
| 7746089 | Method and apparatus for indirect planarization Methods and apparatus for indirect planarization of a substrate are provided herein. In one embodiment, an apparatus for indirectly planarizing a probe card assembly includes an adjustment portion for controlling a force applied to a probe substrate of the probe car... | 06/29/2010 |
| 7737709 | Methods for planarizing a semiconductor contactor A planarizer for a probe card assembly. A planarizer includes a first control member extending from a substrate in a probe card assembly. The first control member extends through at least one substrate in the probe card assembly and is accessible from an exposed sid... | 06/15/2010 |
| 7733106 | Apparatus and method of testing singulated dies An exemplary die carrier is disclosed. In some embodiments, the die carrier can hold a plurality of singulated dies while the dies are tested. The dies can be arranged on the carrier in a pattern that facilities testing the dies. The carrier can be configured to all... | 06/08/2010 |
| 7732975 | Biased gap-closing actuator A gap-closing actuator includes a stator having one or more first electrodes, a mover having one or more second electrodes interposed among the first electrodes, and a biasing mechanism for applying a non-capacitive bias to the mover for urging the mover to move in ... | 06/08/2010 |
| 7732713 | Method to build robust mechanical structures on substrate surfaces A robust mechanical structure is provided to prevent small foundation structures formed on a substrate from detaching from the substrate surface. The strengthened structure is formed by plating a foundation metal layer on a seed layer and then embedding the plated f... | 06/08/2010 |
| 7731546 | Microelectronic contact structure A probing apparatus can include a plurality of contact probes, which can be of a type that is disposed along an axis. Each contact probe can include a contact portion, a base portion, and resilient portion. Multiple arms can form the resilient portion, which can be ... | 06/08/2010 |
| 7731503 | Carbon nanotube contact structures A carbon nanotube contact structure can be used for making pressure connections to a DUT. The contact structure can be formed using a carbon nanotube film or with carbon nanotubes in solution. The carbon nanotube film can be grown in a trench in a sacrificial substr... | 06/08/2010 |
| 7729878 | Air bridge structures and methods of making and using air bridge structures A probe card assembly, according to some embodiments of the invention, can comprise a tester interface configured to make electrical connections with a test controller, a plurality of electrically conductive probes disposed to contact terminals of an electronic devi... | 06/01/2010 |
| 7724004 | Probing apparatus with guarded signal traces A probing apparatus can comprise a substrate, conductive signal traces, probes, and electromagnetic shielding. The substrate can have a first surface and a second surface opposite the first surface, and the electrically conductive first signal traces can be disposed... | 05/25/2010 |
| 7722371 | Electrical contactor, especially wafer level contactor, using fluid pressure An electrical interconnect assembly and methods for making an electrical interconnect assembly. In one embodiment, an interconnect assembly includes a flexible wiring layer having a plurality of first contact elements and a fluid containing structure which is couple... | 05/25/2010 |
| 7714603 | Predictive, adaptive power supply for an integrated circuit under test A main power source supplies current through path impedance to a power terminal of an integrated circuit device under test (DUT). The DUT's demand for current at the power input terminal temporarily increases following edges of a clock signal applied to the DUT duri... | 05/11/2010 |
| 7714598 | Contact carriers (tiles) for populating larger substrates with spring contacts An interconnection apparatus and a method of forming an interconnection apparatus. Contact structures are attached to or formed on a first substrate. The first substrate is attached to a second substrate, which is larger than the first substrate. Multiple such first... | 05/11/2010 |
| 7714235 | Lithographically defined microelectronic contact structures Microelectronic contact structures (260, 360, 460) are lithographically defined and fabricated by applying a masking layer (220, 320, 420) on a surface of a substrate (202, 302, 402) such as an electronic component, creating an opening (222, ... | 05/11/2010 |
| 7701243 | Electronic device testing using a probe tip having multiple contact features An electronic device is moved into a first position such that terminals of the electronic device are adjacent probes for making electrical contact with the terminals. The electronic device is then moved horizontally or diagonally such that the terminals contact the ... | 04/20/2010 |
| 7699616 | High density planar electrical interface An apparatus including a substrate having a plurality of through holes and a plurality of cables, including wires and/or coaxial cables, extending through respective ones of the plurality of through holes of the substrate. Each of the cables comprises a conductor an... | 04/20/2010 |
| 7694246 | Test method for yielding a known good die A semiconductor wafer is cut to singulate integrated circuit dice formed on the wafer. A die pick machine then positions and orients the singulated dice on a carrier base such that signal, power and ground pads formed on the surface of each die reside at predetermin... | 04/06/2010 |
| 7692433 | Sawing tile corners on probe card substrates A composite substrate for testing semiconductor devices is formed by selecting a plurality of substantially identical individual substrates, cutting a corner from at least some of the individual substrates in accordance with their position in a final array configura... | 04/06/2010 |
| 7688090 | Wafer-level burn-in and test Techniques for performing wafer-level burn-in and test of semiconductor devices include a test substrate having active electronic components such as ASICs mounted to an interconnection substrate or incorporated therein, metallic spring contact elements effecting int... | 03/30/2010 |
| 7688085 | Contactor having a global spring structure and methods of making and using the contactor In some embodiments of the invention, a probing apparatus can comprise a substrate, a spring structure attached to the substrate, and a plurality of resilient probes attached to the spring structure. Each probe can comprise a contact portion disposed to contact a de... | 03/30/2010 |
| 7688063 | Apparatus and method for adjusting thermally induced movement of electro-mechanical assemblies A thermal adjustment apparatus for adjusting one or more thermally induced movements of an electro-mechanical assembly includes: a compensating element expanding at a first rate different from a second rate at which the electro-mechanical assembly expands for genera... | 03/30/2010 |
| 7683738 | Adjustable delay transmission line A transmission line includes a signal conductor and at least one varactor diode capacitively coupled to the signal conductor. The transmission line's signal path delay is a function of its shunt capacitance, and the varactor's capacitance forms a part of the transmi... | 03/23/2010 |
| 7681309 | Method for interconnecting an integrated circuit multiple die assembly A method is disclosed that can be used to interconnect an integrated circuit (IC) multiple die assembly to conductors on a substrate such that signals can be conveyed between the dies and the conductors on the substrate. The multiple die assembly can include a first... | 03/23/2010 |
| 7675311 | Wireless test system One or more testers wirelessly communicate with one or more test stations. The wireless communication may include transmission of test commands and/or test vectors to a test station, resulting in testing of one or more electronic devices at the test station. The wir... | 03/09/2010 |
| 7675301 | Electronic components with plurality of contoured microelectronic spring contacts An electronic component is disclosed, having a plurality of microelectronic spring contacts mounted to a planar face of the component. Each of the microelectronic spring contacts has a contoured beam, which may be formed of an integral layer of resilient material de... | 03/09/2010 |
