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| Number | Title | Issue Date |
| 8021483 | Flowable chips and methods for the preparation and use of same, and apparatus for use in the methods A method for recharging a crucible with polycrystalline silicon comprises adding flowable chips to a crucible used in a Czochralski-type process. Flowable chips are polycrystalline silicon particles made from polycrystalline silicon prepared by a chemical vapor depo... | 09/20/2011 |
| 7935327 | Silicon production with a fluidized bed reactor integrated into a siemens-type process A fluidized bed reactor and a Siemens reactor are used to produce polycrystalline silicon. The process includes feeding the vent gas from the Siemens reactor as a feed gas to the fluidized bed reactor. ... | 05/03/2011 |
| 7927984 | Silicon production with a fluidized bed reactor utilizing tetrachlorosilane to reduce wall deposition Silicon deposits are suppressed at the wall of a fluidized bed reactor by a process in which an etching gas is fed near the wall of the reactor. The etching gas includes tetrachlorosilane. A Siemens reactor may be integrated into the process such that the vent gas f... | 04/19/2011 |
| 7649068 | Polymer particles and encapsulated compositions using organoborane amine complexes A polymerized product is obtained from a mixture containing (i) a free radical polymerizable monomer, oligomer or polymer; (ii) an organoborane amine complex, (iii) a poor or non-solvent for the polymerized product of (i); and (iv) an amine reactive compound. The mi... | 01/19/2010 |
| 7551830 | Impact resistant optical waveguide and method of manufacture thereof An impact resistant waveguide includes a clad surrounding a core. A reinforcing filler is incorporated in a curable silicone composition used to prepare the core, thereby imparting impact resistance to the core. A method of manufacture of the waveguide includes inje... | 06/23/2009 |
| 7541264 | Temporary wafer bonding method for semiconductor processing A method for temporary wafer bonding employs an addition reaction curable adhesive composition. The adhesive composition may include (A) a polyorganosiloxane containing an average of at least two silicon-bonded unsaturated organic groups per molecule, (B) an organos... | 06/02/2009 |
| 7527870 | Organosiloxane compositions A moisture curable composition capable of cure to an elastomeric body, the composition comprising (a) an organopolysiloxane having not less than two silicon-bonded hydroxyl or hydrolyzable groups; (b) a silane of the general formula G2-Si—R1 | 05/05/2009 |
| 7521125 | Adhesives having improved chemical resistance and curable silicone compositions for preparing the adhesives This invention relates to a composition that can be cured to form an adhesive. The adhesive is useful in the electronics industry. The composition is prepared by mixing components including: (I) a polyorganosiloxane having an avera... | 04/21/2009 |
| 7521124 | Silicones having improved chemical resistance and curable silicone compositions having improved migration resistance A composition is prepared by mixing components including: (I) a polyorganosiloxane having an average of at least two unsaturated organic groups per molecule, with the proviso that component (I) is free of fluorine atoms; optionally (II) an organohydrogenpolysiloxane... | 04/21/2009 |
| 7517808 | Method for forming and removing a patterned silicone film A method for reworking semiconductor materials includes: (i) applying a silicone composition to a surface of a substrate to form a film, (ii) exposing a portion of the film to radiation to produce a partially exposed film having non-exposed regions covering a portio... | 04/14/2009 |
| 7485202 | Method for making a flat-top pad A method for preparing flat-top pads in electronic components includes the steps of: a) stencil printing a flat-top deposit of a curable silicone composition onto a first electronic substrate, where the first electronic substrate is selected from a semiconductor die... | 02/03/2009 |
| 7270706 | Roll crusher to produce high purity polycrystalline silicon chips A single roll crusher for comminuting high purity materials includes a roll with teeth spaced around the circumference of the roll. The roll is rotatably mounted inside a housing. The housing has a top with an entrance port, sides, and bottom with an exit port. The ... | 09/18/2007 |
| 7080742 | Method and apparatus for improving silicon processing efficiency A method for processing polycrystalline silicon workpieces to form size distributions of polycrystalline silicon pieces suitable for use in a Czochralski-type process includes: (1) preparing a polycrystalline silicon workpiece by a chemical vapor deposition process;... | 07/25/2006 |
| 7074490 | Thermally conductive phase change materials A phase change composition comprises: a matrix comprising an organofunctional silicone wax, and a thermally conductive filler. The composition can be used as a thermal interface material in electronic devices. The composition is formulated to have any desired phase ... | 07/11/2006 |
| 7045586 | Adhesives having improved chemical resistance and curable silicone compositions for preparing the adhesives This invention relates to a composition that can be cured to form an adhesive. The adhesive is useful in the electronics industry. The composition is prepared by mixing components including: (I) a polyorganosiloxane having an avera... | 05/16/2006 |
| 7033561 | Process for preparation of polycrystalline silicon A process for preparing polycrystalline silicon comprising the steps of (A) reacting trichlorosilane with hydrogen thereby forming silicon and an effluent mixture comprising tetrachlorosilane and disilane described by formula HnCl6—nSi2 where n is a value of 0 to ... | 04/25/2006 |
| 6940177 | Semiconductor package and method of preparing same A semiconductor package comprising a semiconductor wafer having an active surface comprising at least one integrated circuit, wherein each integrated circuit has a plurality of bond pads; and at least one cured silicone member covering at least a portion of the acti... | 09/06/2005 |
| 6874713 | Method and apparatus for improving silicon processing efficiency A method for processing polycrystalline silicon workpieces to form size distributions of polycrystalline silicon pieces suitable for use in a Czochralski-type process includes: (1) preparing a polycrystalline silicon workpiece by a chemical vapor deposition process;... | 04/05/2005 |
| 6831145 | Silicone composition and electrically conductive, cured silicone product A silicone composition for preparing a cured silicone product, the composition prepared by mixing: (A) an organopolysiloxane containing an average of at least two epoxy-functional organic groups per molecule; (B) a curing agent in an amount sufficient to cure the co... | 12/14/2004 |
| 6815486 | Thermally conductive phase change materials and methods for their preparation and use A phase change composition comprises: a matrix comprising a silicone-organic block copolymer, and a thermally conductive filler. The composition can be used as a thermal interface material in electronic devices. The composition is formulated to have any desired phas... | 11/09/2004 |
| 6797772 | Alkenyl polyorganosiloxane, organohydrogensiloxane, organosilicon or silane treated silver particles and Pt catalyst A composition comprises the product obtained by homogeneously blending: (A) 100 parts by weight of a polyorganosiloxane containing at least two alkenyl radicals per molecule, (B) an organohydrogensiloxane containing at least two silicon-bonded hydrogen... | 09/28/2004 |
| 6793759 | Method for creating adhesion during fabrication of electronic devices A method for creating adhesion includes plasma treating two substrates and thereafter contacting the substrates. The method can be used on a variety of dry surfaces. The method is used to adhere nonadhesive surfaces such as a cured silicone with a ceramic or semicon... | 09/21/2004 |
| 6791839 | Thermal interface materials and methods for their preparation and use A composition that can be used to prepare a thermal interface material includes: A) a curable matrix having a curing temperature, B) a metal filler having a low melting point, optionally C) a spacer, and optionally D) a conductive filler. The temperature at which co... | 09/14/2004 |
| 6783692 | Heat softening thermally conductive compositions and methods for their preparation A heat softening thermally conductive composition comprises: a matrix comprising a silicone resin, and a thermally conductive filler. The composition can be used as a thermal interface material in electronic devices. The composition is formulated to have any desired... | 08/31/2004 |
| 6779692 | Apparatus and method for increasing density of finely divided particulate matter An apparatus for removing air from finely divided particulate material comprises a housing including a vent; an inlet to the housing; an outlet from the housing; a helix, rotatably mounted in the housing, the helix being adapted upon rotation to feed a particulate m... | 08/24/2004 |
| 6761947 | Silicone-based adhesive sheet, method for manufacturing same, and semiconductor device A silicone-based adhesive sheet prepared by a process comprising (i) curing a silicone composition to form a substantially cured product while the composition lies between backing materials, wherein at least one of the backing materials has a surface comprising oxyg... | 07/13/2004 |
| 6750550 | Adhesive and semiconductor devices An adhesive composition for bonding semiconductor chips to their chip mounting components comprising a curable polymer composition comprising from 1 to 900 weight-ppm spherical filler having an average particle size of from 10 to 100 μm and a major axis-to-minor ax... | 06/15/2004 |
| 6720083 | Adhesive and semiconductor devices An adhesive composition for bonding of semiconductor chips to their chip mounting components comprising a curable polymer composition that comprises a spherical filler having an average particle size from greater than 100 to 1,000 μm and an aspect ratio of 1 to 1.5... | 04/13/2004 |
| 6635605 | Dielectric lubricant and spark plug boot including the same An improved dielectric lubricant is prepared from a (A) a phenyl-methyl siloxane having an average general formula wherein each Me represents a methyl group, each Ph represents a phenyl group, x has a value from zero to about 0.25 and x+y=1; said phenyl-methyl... | 10/21/2003 |
| 6621173 | Semiconductor device having an adhesive and a sealant A semiconductor device having a semiconductor chip; a semiconductor chip attachment element facing the semiconductor chip, at least one interconnect on the surface of the semiconductor chip attachment element; and at least one member consisting of a metal... | 09/16/2003 |
| 6620515 | Thermally conductive phase change materials A phase change composition comprises: a matrix comprising an organofunctional silicone wax, and a thermally conductive filler. The composition can be used as a thermal interface material in electronic devices. The composition is formulated to have any des... | 09/16/2003 |
| 6617674 | Semiconductor package and method of preparing same A semiconductor package comprising a wafer having an active surface comprising at least one integrated circuit, wherein each integrated circuit has a plurality of bond pads; and a cured silicone layer covering the surface of the wafer, provided at least a... | 09/09/2003 |
| 6605149 | Method of stacking polycrystalline silicon in process for single crystal production A process forms a single crystal silicon ingot from varying sized pieces of polycrystalline silicon source material according to the Czochralski method. The process comprises placing into a crucible on the bottom a generally polygonal-shaped concentric ar... | 08/12/2003 |
| 5997786 | Method for bonding rigid substrates Rigid substrates containing an adhesive composition on at least one surface are prepared by an injection molding operation. The degree of bonding between the adhesive layer and the substrate is greater than can be achieved using conventional methods for c... | 12/07/1999 |
| 5973021 | Radiation curable fluorinated organosiloxane compositions Organosiloxane compositions that cure in the presence of ultraviolet radiation comprise a alkenyl-substituted fluorinated polyorganosiloxane, a mercaptoalkyl-substituted fluorinated polyorganosiloxane and a photoinitiator. The cured compositions are parti... | 10/26/1999 |
| 5972512 | Silicone resin composites for fire resistance applications and method for fabricating same A polymer matrix composite comprises a matrix of a cured methylsilsesquioxane resin and a reinforcing material. The composite has low heat release rate, smoke yield, and carbon monoxide yield when burned. After burning, the composite has high char yield a... | 10/26/1999 |
