Bizarre Patents
Mouse device with a built-in printer
A mouse device for use as an input device of a computer is provided that includes a housing in which recording paper is loadable, and a printer unit provided within the housing for printing on the recording paper print information received from the computer.
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| Number | Title | Issue Date |
| 6423174 | Apparatus and insertless method for forming cavity substrates using coated membrane The present invention relates generally to a new apparatus and method for forming cavities in semiconductor substrates without the necessity of using an insert. More particularly, the invention encompasses an apparatus and a method for fabricating cavitie... | 07/23/2002 |
| 6392896 | Semiconductor package containing multiple memory units A semiconductor package in which a memory module (a SIMM or DIMM, for example) is mounted edgewise on a ceramic substrate. In another embodiment, a semiconductor package in which a chip scale package is mounted edgewise on a ceramic substrate.... | 05/21/2002 |
| 6358439 | Copper-based paste containing copper aluminate for microstructural and shrinkage control of copper-filled vias A copper-based paste is disclosed for filling vias in, and forming conductive surface patterns on, ceramic substrate packages for semiconductor chip devices. The paste contains copper aluminate powder in proper particle size and weight proportion to achie... | 03/19/2002 |
| 5532031 | I/O pad adhesion layer for a ceramic substrate A ceramic substrate having an improved I/O pad adhesion layer. The ceramic substrate has an I/O pad for joining to an I/O pin. The I/O pad includes an improved adhesion layer of TiO, followed by layers of Ti (or Ti and Ni) and a solder wettable layer whic... | 07/02/1996 |
| 5530371 | Probe card assembly A carousel for a probe card assembly which includes opposed planar rings supported and spaced apart by flexible supports. The flexible supports, while supporting the planar rings, also allow the planar rings to rotate with respect to each other. Also incl... | 06/25/1996 |
| 5525761 | Copper-based paste containing refractory metal additions for densification control A copper-based paste for multilayer ceramic substrate vias and lines including copper particles as the majority constituent of the paste, a refractory metal additive selected from the group consisting of chromium, tantalum, and tungsten, and organic mater... | 06/11/1996 |
| 5520878 | Aluminum nitride body and method for forming said body utilizing a vitreous sintering additive An unsintered aluminum nitride body including: (a) 1 to 5 weight percent of a vitreous solid of boria, alumina, and calcia in the proportions of (1) boria between 3 and 25 weight percent, (2) alumina between 10 and 50 weight percent, and (3) calcia between 40 ... | 05/28/1996 |
| 5512711 | Copper-based paste containing refractory metal additions for densification control A copper-based paste for multilayer ceramic substrate vias and lines including copper particles as the majority constituent of the paste, a refractory metal additive selected from the group consisting of chromium, tantalum, and tungsten, and organic mater... | 04/30/1996 |
| 5509556 | Process for forming apertures in a metallic sheet A process of forming an aperture in a metallic sheet including the steps of: a) defining at least one feature in a sheet of metallic material; b) laser drilling the at least one feature but not entirely removing it from the metallic sheet, the at least one fea... | 04/23/1996 |
| 5468445 | Ceramic via composition, multilayer ceramic circuit containing same, and process for using same A novel metal filled via composition for use with ceramics. The via composition can be formulated to have a volume shrinkage approximating that of the ceramic material, and thus overcomes the problem of volume shrinkage mismatch between the via (particula... | 11/21/1995 |
| 5462897 | Method for forming a thin film layer A method for forming a thin film layer on a dielectric substrate. A nonconducting layer of material is blanket deposited on the dielectric substrate followed by a layer of polymeric dielectric material which is then patterned to partially expose the under... | 10/31/1995 |
| 5439636 | Large ceramic articles and method of manufacturing A large ceramic substrate article for electronic applications including at least one layer of sintered ceramic material, the layer including a plurality of greensheet segments of ceramic material joined edge to edge. Also disclosed is a method of fabricat... | 08/08/1995 |
| 5436412 | Interconnect structure having improved metallization An electrical interconnect structure for connecting a substrate to the next level of packaging or to a semiconductor device. The interconnect structure includes at least two layers of polymeric material, one of the layers having a capture pad and the seco... | 07/25/1995 |
| 5404372 | Single metal level laser array A laser array for a large number of lasers which are manufactured on a single metal level is taught. Briefly stated the cavity length of the lasers are shortened so as to provide for metal lands or traces to be disposed adjacent to rear facets of the lase... | 04/04/1995 |
| 5336444 | Ceramic via composition, multilayer ceramic circuit containing same, and process for using same A novel metal filled via composition for use with ceramics. The via composition can be formulated to have a volume shrinkage approximating that of the ceramic material, and thus overcomes the problem of volume shrinkage mismatch between the via (particula... | 08/09/1994 |
| 5324892 | Method of fabricating an electronic interconnection Disclosed is a method of fabricating an electronic interconnection structure comprising at least one solder column Joined to an I/O pad of a substrate, the method including the steps of: (a) applying a quantity of solder to the solder column or I/O pad; (b) al... | 06/28/1994 |
| 5304517 | Toughened glass ceramic substrates for semiconductor devices subjected to oxidizing atmospheres during sintering A sintering process is described using a glass-ceramic slurry containing an alloy powder or flakes selected from a group of alloys consisting of: ______________________________________ Fe--Cr Cu--Ti Fe--Cr--Ni Ag--Ti Cr--... | 04/19/1994 |
| 5302562 | Method of controlling the densification behavior of a metallic feature in a ceramic material Disclosed is a method of controlling the densification behavior of a metallic feature in a ceramic material, the method including the steps of: obtaining an unsintered ceramic material having at least one metallic feature therein; providing at least the metall... | 04/12/1994 |
| 5293504 | Multilayer ceramic substrate with capped vias Disclosed is a multilayer ceramic substrate for electronic applications including: (a) at least one internal layer having vias at least partially filled with a metallic material; (b) at least one sealing layer having vias at least partially filled with a ... | 03/08/1994 |
| 5290986 | Thermally assisted shorts removal process for glass ceramic product using an RF field Thermally assisted processes for removing internal defects in glass ceramic products, specifically electrical shorts formed in a substrate during product fabrication, are set forth. According to one aspect of the invention, a method for repairing shorts b... | 03/01/1994 |
| 5277725 | Process for fabricating a low dielectric composite substrate The cracking experienced during thermal cycling of metal:dielectric semiconductor packages results from a mismatch in thermal co-efficients of expansion. The non-hermeticity associated with such cracking can be addressed by backfilling the permeable crack... | 01/11/1994 |
| 5266446 | Method of making a multilayer thin film structure A method of making a multilayer thin film structure on the surface of a dielectric substrate which includes the steps of: a. forming a multilayer thin film structure including the steps of: applying a first layer of dielectric polymeric material on the surface of a... | 11/30/1993 |
| 5264399 | Ceramic composite body A ceramic composite body which includes high purity amorphous silica fibers in a ceramic matrix. The ceramic matrix may be a glass ceramic material, a borosilicate glass material or mixtures thereof.... | 11/23/1993 |
| 5260519 | Multilayer ceramic substrate with graded vias Disclosed is a multilayer ceramic substrate for electronic applications including: (a) at least one internal layer having vias filled with a metallic material; (b) at least one sealing layer having vias filled with a composite material that is a mixture o... | 11/09/1993 |
| 5251806 | Method of forming dual height solder interconnections The present invention relates generally to a new interconnection and a method for making the same, and more particularly, to an elongated solder interconnection and a method for making the same. On an electronic carrier, a pad is formed on which a solder ... | 10/12/1993 |
| 5246885 | Deposition method for high aspect ratio features using photoablation A method for providing superior fill of features in semiconductor processing utilizes a laser ablation system. Deposition is obtained by ablating target materials which are driven off perpendicular to the target in the direction of the deposition surface.... | 09/21/1993 |
| 5245136 | Hermetic package for an electronic device A hermetic package for an electronic device is manufactured by providing a green glass ceramic body with a green via to produce a workpiece. The workpiece is sintered at a temperature at or above 500° C., while compressing the workpiece at a pressure at ... | 09/14/1993 |
| 5239443 | Blind hole cold plate cooling system Disclosed is a blind hole cold plate cooling system including: a fluid inlet manifold having at least one jet nozzle; a heat transfer plate having a first and second principal surface, the first principal surface having a complementary cavity for receiving the ... | 08/24/1993 |
| 5224265 | Fabrication of discrete thin film wiring structures Multilayer thin film structures are fabricated in a parallel manner by creating testable sub-units and then joining them together to form a finished three-dimensional wiring matrix. Thus, there is disclosed a process for the fabrication of a thin film wir... | 07/06/1993 |
| 5219669 | Layer thin film wiring process featuring self-alignment of vias The present invention provides a packaging semiconductor structure and method for obtaining same. The structure is comprised of at least one level of dielectric and metallurgy layers. The at least one level is comprised of a wiring metallurgy plane and a ... | 06/15/1993 |
| 5215610 | Method for fabricating superconductor packages A method for promoting adhesion of cofired copper-based metallurgy and glass ceramic dielectric materials. The method includes the step of adding powder of an alloying metal to the copper based metallurgy prior to firing. A paste which exhibits superior a... | 06/01/1993 |
| 5213704 | Process for making a compliant thermally conductive compound A process for making a compliant thermally conductive, preferably dielectric, compound that enhances the power dissipation capability of high-powered electrical components such as bipolar VLSI semiconductor chips. The compound has chemically stable therma... | 05/25/1993 |
| 5213249 | Ultrasonic adhesion/dehesion monitoring apparatus with power feedback measuring means An ultrasonic adhesion/dehesion monitoring apparatus for monitoring the adhesion/dehesion between first and second substrates comprising: a. an ultrasonic source for transmitting ultrasonic energy to at least first and second substrates; b. means for meas... | 05/25/1993 |
| 5208879 | Optical signal distribution system Disclosed is an optical signal distribution system. The system comprises an electronic substrate, at least one optical component and at least one optical waveguide on but distinct from the electronic substrate for carrying an optical signal to or from the... | 05/04/1993 |
| 5199163 | Metal transfer layers for parallel processing A structure and process for forming dense multi-layer thin film structures wherein individual layers of thin film wiring which can be pre-inspected and then laminated one on top of the next to form a three dimensional wiring matrix are disclosed.... | 04/06/1993 |
| 5196251 | Ceramic substrate having a protective coating thereon and a method for protecting a ceramic substrate Disclosed is a ceramic substrate having a protective coating on at least one surface thereof which includes: a ceramic substrate having at least one electrically conductive via extending to a surface of the substrate; an electrically conductive I/O pad electri... | 03/23/1993 |
| 5194196 | Hermetic package for an electronic device and method of manufacturing same A hermetic package for an electronic device is manufactured by providing a green glass ceramic body with a green via to produce a workpiece. The workpiece is sintered at a temperature at or above 500° C., while compressing the workpiece at a pressure at ... | 03/16/1993 |
| 5192622 | Low-cost ternary composite for use in vias in glass-ceramic structures A ternary-alloy/glass composite suitable for use in vias in glass-ceramic electronic structures includes gold, palladium, and either platinum or silver in the alloy where the gold is less than 50% by weight of the alloy. The alloy is combined with glass f... | 03/09/1993 |
| 5170929 | Ultrasonic adhesion/dehesion monitoring apparatus with acoustic transducer means An ultrasonic adhesion/dehesion monitoring apparatus for monitoring the quality and/or adhesion/dehesion between first and second substrates comprising: (a) an ultrasonic source for transmitting ultrasonic energy to at least first and second substrates; (... | 12/15/1992 |
| 5168454 | Formation of high quality patterns for substrates and apparatus therefor An apparatus and method for accurately and rapidly machining a workpiece, particularly for drilling holes smaller than can be formed by other methods, by using a high power pulsed Nd:YAG laser. A low power HeNe laser is joined to the optical path of the h... | 12/01/1992 |
