Bizarre Patents
Decorative Jeweled Wheel Cover
An improved wheel is provided wherein decorative items such as gem stones are embedded in either the wheel surface, a special mounting section attached to the wheel surface, or to a spoke strap that wraps around each spoke and positions embedded gem stones on the outside surface of the spoke.
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| Number | Title | Issue Date |
| 5604831 | Optical module with fluxless laser reflow soldered joints An optic module contains a flexible circuit board forming a cable which connects between an optical sub-assembly and a rigid interconnect structure within the optic module. One end of the cable includes lands proximate to through holes for soldered connec... | 02/18/1997 |
| 5591941 | Solder ball interconnected assembly High melting temperature Pb/Sn 95/5 solder balls are connected to copper pads on the bottom of a ceramic chip carrier substrate by low melting temperature eutectic Pb/Sn solder. The connection is made by quick reflow to prevent dissolving Pb into the eute... | 01/07/1997 |
| 5592593 | Printing in data processing systems Fonts for use in printing documents are dynamically generated as they are required for printing. Preferably only those characters from the font which have been used in the document are dynamically generated in bitmap form and sent to the printer prior to ... | 01/07/1997 |
| 5586252 | System for failure mode and effects analysis A team is selected to perform failure mode and effects analysis (FMEA) in a meeting moderated by a trained facilitator. A combination of group-ware, data bases, bridge programs and report generators configure RAM in a network of workstations in a meeting ... | 12/17/1996 |
| 5567884 | Circuit board assembly torsion tester and method A torsion tester for circuit board assemblies (boards) clamps opposite edges of the board and cyclicly twists the board to provide substantially pure sheer stress in interconnection joints to SMT components for replicating failure modes due to thermal cyc... | 10/22/1996 |
| 5539181 | Circuit board A process with several variants is presented which permits the layer thickness of the conductive layers on a circuit board to be independent of the layer thickness of the conductive layers in the holes. To this end, the surface structure of the circuit bo... | 07/23/1996 |
| 5535526 | Apparatus for surface mounting flip chip carrier modules A process for handling and storing surface-mount, encapsulated flip-chip carrier modules to prevent the formation of amoeba-like solder bridges between the flip-chip C4 connections along the boundary between the encapsulant and the chip surface and/or bet... | 07/16/1996 |
| 5533398 | Method and apparatus for testing lead connections of electronic components To test the quality of solder bonded lead connections of a package by applying a shearing force to the leads using ultrasonic vibration and by measuring the resultant strain. A probe 32 is pressed against the surface of a lead 12 and vibrated by a piezoel... | 07/09/1996 |
| 5524989 | Print element assignment in printing apparatus The invention relates to a printing apparatus in which at least two printing elements are arranged a predetermined distance apart in a line parallel to the print direction. When two dots to be printed are the same predetermined distance apart as the print... | 06/11/1996 |
| 5520967 | Solder application to a circuit board Solder is applied to a circuit board 7 by dipping the board into a bath 1 of molten solder 3, the molten solder having a layer of oil 5 on top. The board is dipped into the bath by rotating it along a path that is substantially coplanar with the circuit b... | 05/28/1996 |
| 5490638 | Ribbon tension control with dynamic braking and variable current sink A pair of ribbon spools are independently operated by respective motors to rotate in one direction until the ribbon end and then in the opposite direction, and so forth. Spools alternately function as feed and take-up spools and motors as a drive and drag... | 02/13/1996 |
| 5488200 | Interconnect structure with replaced semiconductor chips A face-down bonded semiconductor chip 4 encapsulated with a resin 14 is removed from the substrate 2 with a cutting end mill 26. The resin 14 and bump electrodes 6 remaining on the substrate 2 are then cut with a finishing end mill to a height of about on... | 01/30/1996 |
| 5473814 | Process for surface mounting flip chip carrier modules A process for handling and storing surface-mount, encapsulated flip-chip carrier modules to prevent the formation of amoeba-like solder bridges between the flip-chip C4 connections along the boundary between the encapsulant and the chip surface and/or bet... | 12/12/1995 |
| 5450158 | Optical sensor for a jam-free continuous-forms printer Tractor drives of a high speed printer move a length of continuous-form paper longitudinally up from a box of fanfold stacked paper, through a print mechanism, across paper directing means, and downward to refold onto a fanfold stack. A misfold detector i... | 09/12/1995 |
| 5445313 | Solder particle deposition Solder particles 220 are deposited onto metallized contacts of a direct chip attach (DCA) site located on a substrate 301. The contacts 302 are coated with a layer of flux 303. A pick up head 211 is positioned in a reservoir 201 of solder particles 220 an... | 08/29/1995 |
| 5429442 | Print hammer coil current control A low cost, integrated circuit compatible, circuit for constantly controlling the current in a print hammer coil is provided. The circuit is suitable for use with a hammer coil driven from the low voltage side (bottom drive) and in series with a sense res... | 07/04/1995 |
| 5415479 | Postal bar code printing with engraved character impact printer An impact printing device for printing postal bar code patterns on an information carrier. The patterns are a combination of parallel tall and short bars separated by spaces. The type elements are attached to a movable type carrier, each element comprised... | 05/16/1995 |
| 5355580 | Method for replacing semiconductor chips A face-down bonded semiconductor chip 4 encapsulated with a resin 14 is removed from the substrate 2 with a cutting end mill 26. The resin 14 and bump electrodes 6 remaining on the substrate 2 are then cut with a finishing end mill to a height of about on... | 10/18/1994 |
| 5350246 | High speed continuous-forms printer Tractor drives of a high speed printer move a length of continuous-form paper longitudinally up from a box of fanfold stacked paper, through a print mechanism and downward for refolding onto a fanfold stack. A set of bead chains hang vertically from the p... | 09/27/1994 |
| 5324124 | Guide system for feed roll entry A printing device has paper feed devices upstream and downstream of a printing station. The downstream paper feed devices uses pairs of pressure feed rolls which frictionally feed the paper when received. A tapered guide channel positioned in side by side... | 06/28/1994 |
| 5321464 | Jam-free continuous-forms printer Tractor drives of a high speed printer move a length of continuous-form paper longitudinally up from a box of fanfold stacked paper, through a print mechanism, across paper directing means, and downward to refold onto a fanfold stack. A misfold detector i... | 06/14/1994 |
| 5315928 | Band line printer with grooved platen An impact printer has a print band moving longitudinally around pulleys with one side of the band moving in contact along a rigid platen and the other side having engraved characters presented along a print line of a print medium (e.g. paper and ink ribbo... | 05/31/1994 |
| 5303824 | Solder preform carrier and use Clear thermoplastic is vacuum molded to produce rectangular, frustro-pyramidal shaped cavities in a horizontal matrix for holding rectangular solder preforms. No-clean flux liquid is dispensed onto a preform placed in each cavity, then another holder is p... | 04/19/1994 |
| 5300008 | Printer and folder with chains having light weight pendants hanging therefrom Tractor drives of a high speed printer move a length of continuous-form paper longitudinally up from a box of fanfold stacked paper, through a print mechanism and downward to refold onto a fanfold stack. A set of bead or link chains hang vertically from t... | 04/05/1994 |
| 5295214 | Optical module with tolerant wave soldered joints An optic module contains a flexible circuit board forming a cable which connects between an optical sub-assembly and a rigid interconnect structure within the optic module. The cable includes lands proximate to through holes for soldered connection to lea... | 03/15/1994 |
| 5245921 | Interposer device for impact printers An interposer device for use in an impact printer for printing at condensed pitches includes an interposer plate and a striker strip attached thereto. The interposer plate is a thin spring steel plate slotted to have a plurality of chevron flexure element... | 09/21/1993 |
