Did You Know...
...that after Parker Brothers executives turned down the game of Monopoly because it had "52 fundamental errors" (including taking too long to play), a copy of the game wound up in the home of the company president who stayed up until 1 a.m. to finish playing it? He was so impressed by the game that the next day he wrote to inventor Charles Darrow and offered to buy it!
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| Number | Title | Issue Date |
| 8082938 | Collapsible shelters with and without a floating hub Collapsible portable self-supporting shelter structures having from at least two component quad sections to seven or more component quad sections, which joined end to end form the width of the structure; and, said entire component sections optionally being joined si... | 12/27/2011 |
| 8005834 | Method and apparatus to map associations with BitSets Database systems using BitSets to model and manage relationships between and/or among entities describing the corresponding fast user defined scalar and column functions used for BitSets, including a technique to model categorization and steps to perform rule evalua... | 08/23/2011 |
| 7994450 | Debris minimization and improved spatial resolution in pulsed laser ablation of materials A method and an apparatus of minimizing the deposition of debris onto a sample being ablated. The method comprising the steps of: 1) reducing a laser pulse energy to approximately a threshold level for ablation; and 2) ablating a region of the sample using a multitu... | 08/09/2011 |
| 7982312 | Method for fabricating dual damascene structures using photo-imprint lithography, methods for fabricating imprint lithography molds for dual damascene structures, materials for imprintable dielectrics and equipment for photo-imprint lithography used in dual damascene patterning The process of producing a dual damascene structure used for the interconnect architecture of semiconductor chips. More specifically the use of imprint lithography to fabricate dual damascene structures in a dielectric and the fabrication of dual damascene structure... | 07/19/2011 |
| 7975379 | Method of making a land-grid-array (LGA) interposer LGA connectors are fabricated with buttons or spring contacts preformed to different heights to accommodate the initial topography of a typical module or PCB of a particular product type. This is accomplished during fabrication by measuring topographies of mating su... | 07/12/2011 |
| 7932169 | Interconnection for flip-chip using lead-free solders and having improved reaction barrier layers An interconnection structure suitable for flip-chip attachment of microelectronic device chips to packages, comprising a two, three or four layer ball-limiting metallurgy including an adhesion/reaction barrier layer, and having a solder wettable layer reactive with ... | 04/26/2011 |
| 7925813 | Method of fabricating a portable computer apparatus with thermal enhancements and multiple power modes of operation A portable computer adapted for electrical connection to a docking station having multiple power modes of operation is described. The portable computer has one or more CPU chips which have at least two power modes of operation, a low power mode and a high power mode... | 04/12/2011 |
| 7902323 | Methods of fabricating plasticized, antiplasticized and crystalline conducting polymers and precursors thereof Methods of forming materials containing precursors to electrically conductive polymers and electrically conductive polymers are described which have a high degree of crystallinity. The high degree of crystallinity is achieved by preparing the materials under conditi... | 03/08/2011 |
| 7901977 | Data protection by detection of intrusion into electronic assemblies Electronic assemblies, especially one containing volatile memory, used a flexible membrane with conducting lines which acts as an intrusion sensor against chemical and mechanical attacks. The lines are fabricated from inherently conducting polymers which are solutio... | 03/08/2011 |
| 7880305 | Technology for fabrication of packaging interface substrate wafers with fully metallized vias through the substrate wafer The invention is the technology of providing a packaging intermediate product that can serve as an interface substrate that is to be positioned between different circuitry types where the dimensions are approaching the sub 100 micrometer range. The invention involve... | 02/01/2011 |
| 7862989 | Method for fabricating dual damascene structures using photo-imprint lithography, methods for fabricating imprint lithography molds for dual damascene structures, materials for imprintable dielectrics and equipment for photo-imprint lithography used in dual damascene patterning The process of producing a dual damascene structure used for the interconnect architecture of semiconductor chips. More specifically the use of imprint lithography to fabricate dual damascene structures in a dielectric and the fabrication of dual damascene structure... | 01/04/2011 |
| 7837459 | Method for fabricating dual damascene structures using photo-imprint lithography, methods for fabricating imprint lithography molds for dual damascene structures, materials for imprintable dielectrics and equipment for photo-imprint lithography used in dual damascene patterning The process of producing a dual damascene structure used for the interconnect architecture of semiconductor chips. More specifically the use of imprint lithography to fabricate dual damascene structures in a dielectric and the fabrication of dual damascene structure... | 11/23/2010 |
| 7827283 | System for managing and controlling storage access requirements A Resource Management and Reservation System (RMRS) for managing and reserving storage bandwidth, is a platform independent middleware layer that provides an interface to applications, their database management systems, or some other higher level data management sys... | 11/02/2010 |
| 7825516 | Formation of aligned capped metal lines and interconnections in multilevel semiconductor structures In integrated circuit technology; an electromigration and diffusion sensitive conductor of a metal such as copper and processing procedure therefore is provided, wherein, at a planarized chemical mechanical processed interfacing surface, the conductor metal is posit... | 11/02/2010 |
| 7804148 | Opto-thermal mask including aligned thermal dissipative layer, reflective layer and transparent capping layer An opto-thermal annealing mask stack layer includes a thermal dissipative layer located over a substrate. A reflective layer is located upon the thermal dissipative layer. A transparent capping layer, that may have a thickness from about 10 to about 100 angstroms, i... | 09/28/2010 |
| 7798323 | Portable medical emergency equipment pack A foldable carrying medical pack made of flexible material, adapted to store medical emergency supplies and equipment. Clear storage pouches which contain the medical supplies and equipment are attached by Velcro, for easy removal, to the interior side of the medica... | 09/21/2010 |
| 7793027 | Portable computer apparatus with thermal enhancements and multiple modes of operation A portable computer adapted for electrical connection to a docking station having multiple power modes of operation is described. The portable computer has one or more CPU chips which have at least two power modes of operation, a low power mode and a high power mode... | 09/07/2010 |
| 7788436 | Method of operation of a portable computer apparatus with thermal enhancements and multiple modes of operation A portable computer adapted for electrical connection to a docking station having multiple power modes of operation is described. The portable computer has one or more CPU chips which have at least two power modes of operation, a low power mode and a high power mode... | 08/31/2010 |
| 7776993 | Underfilling with acid-cleavable acetal and ketal epoxy oligomers A reworkable thermoset epoxy-containing material that allows for a reworkable assembly such as a reworkable waferlevel underfilled microelectronic package. A method for using the reworkable thermoset material in the formation of a microelectronic package using this ... | 08/17/2010 |
| 7761641 | Method of operation of a portable computer apparatus with thermal enhancements and multiple modes of operation A portable computer adapted for electrical connection to a docking station having multiple power modes of operation is described. The portable computer has one or more CPU chips which have at least two power modes of operation, a low power mode and a high power mode... | 07/20/2010 |
| 7739439 | Method of fabrication of a portable computer apparatus with thermal enhancements and multiple modes of operation A portable computer adapted for electrical connection to a docking station having multiple power modes of operation is described. The portable computer has one or more CPU chips which have at least two power modes of operation, a low power mode and a high power mode... | 06/15/2010 |
| 7736833 | Multilayered resist systems using tuned polymer films as underlayers and methods of fabrication thereof Multilayered resist structures including bilayer and top surface imaging which utilize tuned underlayers functioning as ARCs, planarizing layers, and etch resistant hard masks whose properties such as optical, chemical and physical properties are tailored to give a ... | 06/15/2010 |
| 7726385 | Heat dissipation interface for semiconductor chip structures The present invention is directed to a modular heat dissipating device that consists of a plurality of sheet and beam members which are connected together by heat pipes. The sheet or support fin member is constructed by folding a piece of heat conducting material wh... | 06/01/2010 |
| 7711884 | Method of operation of a portable computer apparatus with thermal enhancements and multiple modes of operation A portable computer adapted for electrical connection to a docking station having multiple power modes of operation is described. The portable computer has one or more CPU chips which have at least two power modes of operation, a low power mode and a high power mode... | 05/04/2010 |
| 7709177 | Multilayered resist systems using tuned polymer films as underlayers and methods of fabrication thereof Multilayered resist structures including bilayer and top surface imaging which utilize tuned underlayers functioning as ARCs, planarizing layers, and etch resistant hard masks whose properties such as optical, chemical and physical properties are tailored to give a ... | 05/04/2010 |
| 7702837 | Method of fabricating a portable computer apparatus with thermal enhancements and multiple modes of operation A portable computer adapted for electrical connection to a docking station having multiple power modes of operation is described. The portable computer has one or more CPU chips which have at least two power modes of operation, a low power mode and a high power mode... | 04/20/2010 |
| 7695776 | Transparent hard coats for optical elements The present invention related to an improved structure of an optically transparent element that can be used in optical scanners, supermarket scanners, lenses for eyeglasses, etc. The application of oxynitride PECVD films provide good hardness and optical transparenc... | 04/13/2010 |
| 7694057 | Portable computer apparatus with thermal enhancements and multiple modes of operation A portable computer adapted for electrical connection to a docking station having multiple power modes of operation is described. The portable computer has one or more CPU chips which have at least two power modes of operation, a low power mode and a high power mode... | 04/06/2010 |
| 7676620 | Portable computer systems with thermal enhancements and multiple power modes of operation A portable computer adapted for electrical connection to a docking station having multiple power modes of operation is described. The portable computer has one or more CPU chips which have at least two power modes of operation, a low power mode and a high power mode... | 03/09/2010 |
| 7676619 | Portable computer apparatus with thermal enhancements and multiple modes of operation A portable computer adapted for electrical connection to a docking station having multiple power modes of operation is described. The portable computer has one or more CPU chips which have at least two power modes of operation, a low power mode and a high power mode... | 03/09/2010 |
| 7660930 | Method of fabricating a portable computer apparatus with thermal enhancements and multiple power modes of operation A portable computer adapted for electrical connection to a docking station having multiple power modes of operation is described. The portable computer has one or more CPU chips which have at least two power modes of operation, a low power mode and a high power mode... | 02/09/2010 |
| 7650647 | Hardware-oriented configuration and locking of devices Method and device for setting basic means of access for operation of electronically operated devices (12), with the aid of a possibly transferable personal authentication system (16), essentially based on three components used in the course of the meth... | 01/19/2010 |
| 7585431 | Electrically conductive polymeric materials and use thereof This invention is concerned with an electrically conductive polymer blend composition which is a liquid compatible blend, comprising a doped product formed form blending a first solution comprising a Lewis base electrically conductive polymer in undoped form in a fi... | 09/08/2009 |
| D598141 | Telescoping camouflage pole | 08/11/2009 |
| 7546845 | Double tang design articulating hub assembly A double tang articulating hub assembly used in combination with a collapsible self-supporting structure. The double tang articulating hub assembly is used as a connector among tubular rod elements which together provide a generally tubular frame matrix used to erec... | 06/16/2009 |
| 7491286 | Patterning solution deposited thin films with self-assembled monolayers The present invention provides a method of forming a patterned thin film on a surface of a substrate having thereon a patterned underlayer of a self-assembled monolayer. The method comprises depositing a thin film material on the self-assembled monolayer to produce ... | 02/17/2009 |
| 7481235 | Articulating hub assembly A collapsible self-supporting structure used in combination with an improved articulating hub assembly. The articulating hub assembly is used as a connector among tubular rod elements which together provide a generally tubular frame matrix used to erect a collapsibl... | 01/27/2009 |
| 7467742 | Electrically conducting adhesives for via fill applications Electrically conducting adhesives having a broader selectable range of properties are provided by having random sizes of micrometer diameter range particles coated with a low melting temperature metal. The coated particles are suspended in a vehicle of a mixture of ... | 12/23/2008 |
| 7435074 | Method for fabricating dual damascence structures using photo-imprint lithography, methods for fabricating imprint lithography molds for dual damascene structures, materials for imprintable dielectrics and equipment for photo-imprint lithography used in dual damascence patterning The process of producing a dual damascene structure used for the interconnect architecture of semiconductor chips. More specifically the use of imprint lithography to fabricate dual damascene structures in a dielectric and the fabrication of dual damascene structure... | 10/14/2008 |
| D578041 | Utility support trailer | 10/07/2008 |
