...that the Slinky toy was the result of a failed attempt by engineer Richard James to produce an antivibration device for ship instruments? His goal was to develop a spring that would instantaneously counterbalance the wave motion that rocks a ship at sea. Instead, he developed the Slinky.
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| Number | Title | Issue Date |
| 8142895 | Heat stable aryl polysiloxane compositions A curable aryl siloxane composition is disclosed. A heat stable cured aryl polysiloxane composition is further disclosed, along with a method of making that heat stable cured aryl polysiloxane composition from the curable aryl siloxane composition. An encapsulated s... | 03/27/2012 |
| 8029904 | Aryl (thio)ether aryl polysiloxane composition and methods for making and using same A curable aryl (thio)ether aryl silicon composition is disclosed. A cured aryl (thio)ether aryl polysiloxane composition is further disclosed, along with a method of making that cured aryl (thio)ether aryl polysiloxane composition from the curable aryl (thio)ether a... | 10/04/2011 |
| 7968268 | Compositions and processes for immersion lithography New photoresist compositions are provided that are useful for immersion lithography. Preferred photoresist compositions of the invention comprise one or more materials that can be substantially non-mixable with a resin component of the resist. Further preferred phot... | 06/28/2011 |
| 7956125 | (Thio)phenoxy phenyl silane compostion and method for making same A (thio)phenoxyphenyl phenyl silane composition is disclosed. A method of making the (thio)phenoxyphenyl phenyl silane composition is also disclosed, the method further including a step of purification. A high purity (thio)phenoxyphenyl phenyl silane composition sui... | 06/07/2011 |
| 7955778 | Compositions and processes for photolithography Overcoating layer compositions are provided that are applied above a photoresist composition including for immersion lithography processing as well as non-immersion imaging. ... | 06/07/2011 |
| 7955531 | Patterned light extraction sheet and method of making same A light extraction encapsulant sheet having a patterned encapsulant region is disclosed. A method of making that light extraction encapsulant sheet and of affixing that light extraction encapsulant sheet to a luminous stack surface of a multi-layer stack is also dis... | 06/07/2011 |
| 7932016 | Photosensitive composition Photoresist compositions and methods suitable for depositing a thick photoresist layer in a single coating application are provided. Such photoresist layers are particularly suitable for use in chip scale packaging, for example, in the formation of metal bumps. ... | 04/26/2011 |
| 7723850 | Electronic devices having air gaps A method of forming air gaps within a solid structure is provided. In this method, a sacrificial material is covered by an overlayer. The sacrificial material is then removed through the overlayer to leave an air gap. Such air gaps are particularly useful as insulat... | 05/25/2010 |
| 7693383 | Silicon-containing polymers and polymers and optical waveguides formed therefrom Provided are polymers comprising the condensation product of silicon-containing reactants. Also provided are compositions suitable for use in forming optical waveguides which include such polymers, as well as optical waveguides formed from such polymers. The polymer... | 04/06/2010 |
| 7615130 | Methods of forming printed circuit boards Provided are methods of forming a printed circuit board having optical functionality. The methods involve: (a) providing a first, printed circuit board substrate; (b) forming an optical waveguide structure comprising a clad and a core structure on a second substrate... | 11/10/2009 |
| 7583880 | Methods of forming printed circuit boards having optical functionality Provided are methods of forming printed circuit boards having optical functionality. The methods involve applying a dry-film to a printed circuit board substrate and forming an optical waveguide over the dry-film. The invention finds particular applicability in the ... | 09/01/2009 |
| 7521727 | Light emitting device having improved light extraction efficiency and method of making same A light emitting device including a multi-layer stack and an encapsulant layer having a patterned encapsulant region in optical proximity to a luminous stack surface of the multi-layer stack is disclosed. A method of making that encapsulant layer and of affixing tha... | 04/21/2009 |
| 7504191 | Photosensitive resin composition and method for the formation of a resin pattern using the composition A photosensitive resin composition and a method for the formation of a resin pattern using the photosensitive resin composition are provided. The photosensitive resin composition contains, as a catalyst precursor, a catalytic metal element with a metal-deposition ca... | 03/17/2009 |
| 7410304 | Optical fiber right angle transition A fiber optic termination and method for the fabrication thereof are provided. The fiber optic termination (325) is configured to provide coupling of light between the fiber core (326) and an external optical element from a direction other than the dir... | 08/12/2008 |
| 7405638 | Coaxial waveguide microstructures having an active device and methods of formation thereof Provided are coaxial waveguide microstructures. The microstructures include a substrate and a coaxial waveguide disposed above the substrate. The coaxial waveguide includes: a center conductor; an outer conductor including one or more walls, spaced apart from and di... | 07/29/2008 |
| 7378646 | Optical device package having optical feedthrough An optical microbench configured to facilitate wafer-level testing of opto-electronic devices is provided. The optical microbench includes an optoelectronic device mounted to a wafer in which the optical microbench is provided. The optical microbench also includes a... | 05/27/2008 |
| 7355166 | Optoelectronic component having electrical connection and formation method thereof Provided are optoelectronic components which include an optoelectronic device and a structure for self-aligning the optoelectronic device. Also provided are optoelectronic modules and methods of forming optoelectronic components. ... | 04/08/2008 |
| 7352924 | Micro-optical device The present invention provides a micro-optical device which may be used as an optical pigtailing assembly for waveguides. In an exemplary configuration the assembly includes a first chip which includes an optoelectronic component and an optical fiber. The optical fi... | 04/01/2008 |
| 7348550 | Optoelectronic component with front to side surface electrical conductor Provided are optoelectronic components which include an optoelectronic device and a structure for self-aligning the optoelectronic device. Also provided are optoelectronic modules and methods of forming optoelectronic components. ... | 03/25/2008 |
| 7344970 | Plating method Photoresist compositions and methods suitable for depositing a very thick photoresist layer in a single coating process are provided. Such photoresist layers are particularly suitable for use in chip scale packaging. ... | 03/18/2008 |
| 7345316 | Wafer level packaging for optoelectronic devices An optical device package includes a substrate having an upper surface, a distal end, a proximal end, and distal and proximal longitudinally extending notches co-linearly aligned with each other. A structure is mounted to the substrate and has at least one recessed ... | 03/18/2008 |
| 7329056 | Device package and methods for the fabrication and testing thereof Provided are optoelectronic device packages. The packages include a base substrate having an optoelectronic device mounting region on a surface of the base substrate and a lid mounting region. An optoelectronic device is mounted on the optoelectronic device mounting... | 02/12/2008 |
| 7294453 | Electronic device manufacture Disclosed are methods of manufacturing electronic devices, particularly integrated circuits. Such methods include the use of low dielectric constant material prepared by using a removable porogen material. ... | 11/13/2007 |
| 7294280 | External cavity semi-conductor laser and method for fabrication thereof The present invention concerns a design for an external cavity single mode laser wherein a short optical path length for the optical cavity (e.g., ˜3 to 25 mm) provides sufficient spacing of the longitudinal modes allowing a single wavelength selective element, suc... | 11/13/2007 |
| 7292756 | Optical interface assembly and method of formation Optical interface assemblies are provided. The optical interface assemblies include a first portion having a plurality of optical waveguides. The first portion is configured for mating engagement with an optical fiber connector. A second portion is mated to the firs... | 11/06/2007 |
| 7290321 | Alignment apparatus and method for aligning stacked devices An apparatus for passively aligning first and second substrates having micro-components disposed thereon when the substrates do not include patterned surfaces which face each other. The apparatus includes a first depression which cooperates with an alignment sphere ... | 11/06/2007 |
| 7291833 | Optoelectronic component Provided are optoelectronic components which include an optoelectronic device mounted on a silicon substrate and a flexible circuit electrically connected to the optoelectronic device. ... | 11/06/2007 |
| 7288758 | Wafer-level optoelectronic device substrate Provided are optoelectronic components which include an optoelectronic device and a structure for self-aligning the optoelectronic device. Also provided are optoelectronic modules and methods of forming optoelectronic components. ... | 10/30/2007 |
| 7288756 | Optoelectronic component having passively aligned optoelectronic device Provided are optoelectronic components which include an optoelectronic device and a substrate having a first surface, a second surface opposite the first surface and a trench in the first surface, the trench including a bottom surface. An optoelectronic device is in... | 10/30/2007 |
| 7267781 | Method of fabricating optical filters A method of fabricating optical filter is disclosed. The method includes providing the substrate and selectively etching the substrate to form a plurality of freestanding layers. A plurality of dielectric layers is disposed over an outer surface of each of the frees... | 09/11/2007 |
| 7256127 | Air gap formation A method of forming air gaps within a solid structure is provided. In this method, a sacrificial material is covered by an overlayer. The sacrificial material is then removed through the overlayer to leave an air gap. Such air gaps are particularly useful as insulat... | 08/14/2007 |
| 7255978 | Multi-level optical structure and method of manufacture A multi-level optical device includes a substrate having a baseline level. At least one feature is disposed at a level above the baseline level. At least one feature is disposed at a level below the baseline level, or in the feature above the baseline level is locat... | 08/14/2007 |
| 7251405 | Optical dry-films and methods of forming optical devices with dry films Provided is a dry-film suitable for use in forming an optical component. The dry-film includes a carrier substrate having a front surface and a back surface. A non-photoimageable, thermally curable polymeric layer is provided over the front surface of the carrier su... | 07/31/2007 |
| 7251404 | Optical dry-films and methods of forming optical devices with dry films Provided is a dry-film suitable for use in forming an optical component. The dry-film includes a carrier substrate having a front surface and a back surface. A negative-working photoimageable polymeric layer is disposed over the front surface of the carrier substrat... | 07/31/2007 |
| 7251406 | Optical waveguide termination with vertical and horizontal mode shaping An optical device is disclosed which includes a single-mode waveguide (700) which supports a first optical mode in a first region and a second optical mode in a second region. The waveguide includes a guiding layer (703) having at least one wing (75... | 07/31/2007 |
| 7246953 | Optical device package An optical device package includes a substrate having a top portion with an a recess for receiving an optical semiconductor component and an elongated linear groove for receiving an optical fiber. The optical fiber is positioned within the groove in said substrate s... | 07/24/2007 |
| 7208725 | Optoelectronic component with encapsulant Provided are optoelectronic components which include a substrate having a front surface, a back surface and a trench in the front surface, an optoelectronic device in the trench, and an encapsulant filling the trench frush to the front surface, wherein the encapsula... | 04/24/2007 |
| 7198727 | Etching process for micromachining materials and devices fabricated thereby The present invention provides an optical microbench having intersecting structures etched into a substrate. In particular, microbenches in accordance with the present invention include structures having a planar surfaces formed along selected crystallographic plane... | 04/03/2007 |
| 7195858 | Negative type photosensitive resin composition containing a phenol-biphenylene resin Negative type photosensitive resin compositions are provided. Such negative photosensitive resin compositions contain a novolac resin and a phenol-biphenylene resin as well as an epoxy compound. These resin compositions have excellent heat-impact resistance for the ... | 03/27/2007 |
| 7195855 | Negative-type photosensitive resin composition containing epoxy compound A negative-type photosensitive resin compositions containing an epoxy compound are provided. These compositions use poly(p-vinylphenol) as the base resin and have good development performance when using an aqueous developer, such as tetramethylammonium hydroxide sol... | 03/27/2007 |