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Vladimir Zworykin, television pioneer ; Talking about an invention in which he played a critical role.
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| Application No. | Application Title | Issue Date |
| 20090140761 | METHOD OF TESTING SEMICONDUCTOR DEVICE A method of testing a semiconductor device, which can reduce a period of time for testing a packaged semiconductor chip. First, semiconductor chips to be tested are classified in a lot unit. The semiconductor chips are fist tested in units of lots. The defective semicon... | 06/04/2009 |
| 20090140758 | TEST CARRIER A test carrier includes an insert body, a first latch assembly including one or more first latches pivotally attached to the insert body, and a second latch assembly including one or more second latches pivotally attached to the insert body. The second latch assembly is... | 06/04/2009 |
| 20090139548 | Apparatus and method of rinsing and drying semiconductor wafers An apparatus for rinsing and drying semiconductor wafers includes a rinsing bath, a drying bath and a drying chamber. The rinsing bath and drying bath are connected by a tunnel unit which prevents semiconductor wafers from being exposed to air while being transferred fr... | 06/04/2009 |
| 20090139446 | PROCESS FOR PRODUCING POLYCRYSTALLINE SILICON INGOT Provided is a process in which a polycrystalline silicon ingot improved in life time characteristics, which are correlated with the conversion efficiency of solar wafers, is inexpensively produced by the ordinary-pressure hydrogen-atmosphere melting method. In the proce... | 06/04/2009 |
| 20090139124 | COLLAPSIBLE SIGN A collapsible sign comprising a pivotal sign carrying member, an upright member hingedly attached to the pivotal sign carrying member, and a foldable support member adapted to stabilize the upright member and the pivotal sign carrying member. The pivotal sign carrying m... | 06/04/2009 |
| 20090138972 | RESISTING THE SPREAD OF UNWANTED CODE AND DATA A method or system of receiving an electronic file containing content data in a predetermined data format, the method comprising the steps of: receiving the electronic file, determining the data format, parsing the content data, to determine whether it conforms to the p... | 05/28/2009 |
| 20090134528 | SEMICONDUCTOR PACKAGE, ELECTRONIC DEVICE INCLUDING THE SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING THE SEMICONDUCTOR PACKAGE Provided are a semiconductor package, an electronic device including the semiconductor package and a method of manufacturing the semiconductor package. The semiconductor package includes semiconductor chips mounted on a carrier, a first insulating layer sealing the semi... | 05/28/2009 |
| 20090134202 | REFLOW APPARATUS AND METHOD Provided are a reflow apparatus and method. The reflow apparatus includes a loader unit, a heating unit, an unloader unit, and a moving unit. The loader unit has an input module and an input stacker. Processing objects are stored in vertical stacks in magazines, and a p... | 05/28/2009 |
| 20090133722 | APPARATUS AND METHOD FOR CLEANING A SUBSTRATE Provided is an apparatus for cleaning a substrate. The substrate cleaning apparatus includes a spin head for supporting the substrate, a first cleaning unit for cleaning the substrate by a polishing process, and a second cleaning unit for cleaning the substrate by injec... | 05/28/2009 |
| 20090133336 | POLISHING SLURRY, METHOD OF PRODUCING SAME, AND METHOD OF POLISHING SUBSTRATE Disclosed is a polishing slurry, particularly, a slurry for chemical mechanical polishing, which is used in a chemical mechanical polishing process for flattening a semiconductor laminate. More particularly, the present invention provides a method of producing a slurry ... | 05/28/2009 |
| 20090127633 | NON-VOLATILE MEMORY DEVICES AND METHODS OF FORMING THE SAME In one embodiment, a semiconductor memory device includes a substrate having first and second active regions. The first active region includes a first source and drain regions and the second active region includes a second source and drain regions. A first interlayer di... | 05/21/2009 |
| 20090126979 | SEMICONDUCTOR PACKAGE CIRCUIT BOARD AND METHOD OF FORMING THE SAME A semiconductor package circuit board has an indicator for specifying a location of a defective circuit board unit. The semiconductor package circuit board includes circuit board units arranged in an m-by-n matrix pattern. The indicator has marking areas arranged in an ... | 05/21/2009 |
| 20090039403 | SEMICONDUCTOR DEVICE INCLUDING AN IMPROVED CAPACITOR AND METHOD FOR MANUFACTURING THE SAME In a semiconductor device according to embodiments of the invention, a capacitor includes a storage electrode having a cylindrical storage conductive layer pattern and connecting members formed on the upper portion of the cylindrical storage conductive layer pattern. Th... | 02/12/2009 |
| 20090041960 | METHOD FOR MAKING A SILICA GLASS CRUCIBLE A rotating mold has a plurality of air channels that communicate with a cavity formed in the mold. Silica grain is deposited in the rotating mold and then formed into the shape of a crucible having a lower portion that comprises a substantially uniformly thick wall. An ... | 02/12/2009 |
| 20090040853 | METHOD OF PRECHARGING LOCAL INPUT/OUTPUT LINE AND SEMICONDUCTOR MEMORY DEVICE USING THE METHOD A method and semiconductor memory device for precharging a local input/output line. The semiconductor memory device, which may have an open bit line structure, transmits data through local input/output lines that are coupled to bit lines of first to n-th memory cell arr... | 02/12/2009 |
| 20090039491 | SEMICONDUCTOR PACKAGE HAVING BURIED POST IN ENCAPSULANT AND METHOD OF MANUFACTURING THE SAME In one embodiment, a semiconductor package includes a first insulating body and a first semiconductor chip having a first active surface and a first back surface opposite the first active surface. The first semiconductor chip is disposed within the first insulating body... | 02/12/2009 |
| 20090039909 | SEMICONDUCTOR DEVICE HAVING CONTACT FAILURE DETECTOR A semiconductor device having a circuit for detecting a defective connection to the semiconductor device. A semiconductor device including multiple internal circuits; multiple pads respectively connected to the internal circuits; and a contact failure detector coupled b... | 02/12/2009 |
| 20090039404 | CAPACITOR FOR A SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME In a capacitor having a high dielectric constant, the capacitor includes a cylindrical lower electrode, a dielectric layer and an upper electrode. A metal oxide layer is formed on inner, top and outer surfaces of the lower electrode as the dielectric layer. A first sub-... | 02/12/2009 |
| 20090028671 | IN-LINE SYSTEM AND METHOD FOR MANUFACTURING A SEMICONDUCTOR PACKAGE An in-line system for manufacturing a semiconductor package according to principles of the present invention can prevent wafer warpage due to a back-lap process and die defects due to sticking of the die. In one embodiment, the in-line system adheres a semiconductor chi... | 01/29/2009 |
| 20090026596 | LEAD FRAME, SEMICONDUCTOR PACKAGE, AND STACKED SEMICONDUCTOR PACKAGE HAVING THE SAME In certain embodiments, a lead frame includes a paddle, a plurality of inner leads, first outer leads, and a second outer lead. The plurality of inner leads can be arranged at a side face of the paddle. The first outer leads can extend from the inner leads along a first... | 01/29/2009 |
| 20090025565 | AIR FILTERING DEVICE AND CLEANING SYSTEM OF SEMICONDUCTOR MANUFACTURING APPARATUS WITH THE SAME An air filtering device and an air cleaning system of a semiconductor manufacturing apparatus to reduce cost and increase manufacturing productivity. The air filtering device may include a frame having an open aperture coupled to an air supply line. A buffer frame confi... | 01/29/2009 |
| 20090026628 | ELECTRICAL CONNECTIONS FOR MULTICHIP MODULES A semiconductor package includes a first semiconductor chip mounted on a substrate and a second semiconductor chip mounted on top of the first semiconductor chip. A plurality of metal lines is deposited on the top of the first chip, and the metal lines are isolated from... | 01/29/2009 |
| 20090020884 | SURFACE TREATMENT METHOD, SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SEMICONDUCTOR DEVICE Provided are methods of surface treatment, semiconductor devices and methods of forming the semiconductor device. The methods of forming the semiconductor device include forming a first oxide layer and a second oxide layer on a substrate. The first and second oxide laye... | 01/22/2009 |
| 20090020816 | SEMICONDUCTOR DEVICE AND METHOD OF FORMING THE SAME One embodiment generally described herein can be characterized as a semiconductor device. The semiconductor device can include a first transistor on a semiconductor substrate. A first interlayer insulating layer may be disposed over the first transistor and includes a f... | 01/22/2009 |
| 20090020878 | SEMICONDUCTOR PACKAGES AND METHODS OF FABRICATING THE SAME A semiconductor package is provided. The semiconductor package includes a semiconductor device having a bonding pad and an interlayer insulating layer disposed on the semiconductor device. The interlayer insulating layer has an opening which exposes the bonding pad and ... | 01/22/2009 |
| 20090020871 | SEMICONDUCTOR CHIP WITH SOLDER BUMP SUPPRESSING GROWTH OF INTER-METALLIC COMPOUND AND METHOD OF FABRICATING THE SAME A semiconductor chip having a solder bump and a method of fabricating the same are provided. Conventionally, an inter-metallic compound (IMC) unexpectedly grows at an interface of the solder bump by means of heat generated during operation of the semiconductor chip, the... | 01/22/2009 |
| 20090017629 | METHOD OF FORMING CONTACT STRUCTURE WITH CONTACT SPACER AND METHOD OF FABRICATING SEMICONDUCTOR DEVICE USING THE SAME A method of forming a contact structure with a contact spacer and a method of fabricating a semiconductor device using the same. In the method of forming a contact structure, an interlayer dielectric layer is formed on a semiconductor substrate. The interlayer dielectri... | 01/15/2009 |
| 20090017583 | DOUBLE ENCAPSULATED SEMICONDUCTOR PACKAGE AND MANUFACTURING METHOD THEREOF A double encapsulated semiconductor package and manufacturing methods of forming the same are provided. Embodiments of the semiconductor package include a complex chip having normal and random pads formed on its active surface, the complex chip being attached to a first... | 01/15/2009 |
| 20090016114 | CIRCUIT AND METHOD OF GENERATING HIGH VOLTAGE FOR PROGRAMMING OPERATION OF FLASH MEMORY DEVICE Provided is a high voltage generator for a flash memory device including a voltage pumping unit configured to generate a high voltage in response to a pumping clock signal, a transistor having a gate coupled to the high voltage and a source coupled to a program voltage,... | 01/15/2009 |
| 20090013867 | Radial counterflow carbon capture and flue gas scrubbing Carbon capture is effected by mechanical means, producing out of flue gas a concentrated, cleaned, and cooled stream of carbon dioxide. This is a new method of carbon capture which avoids the limitations of known cryogenic, membrane, or chemical capture methods. | 01/15/2009 |
| 20090014766 | NON-VOLATILE MEMORY DEVICE AND FABRICATION METHOD THEREOF In one embodiment, a non-volatile memory device includes an isolation film defining an active region in a semiconductor substrate; a tunnel insulating film located on the active region; a control gate located on the isolation film; an inter-gate dielectric film parallel... | 01/15/2009 |
| 20090014833 | SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME An exemplary semiconductor device includes a semiconductor substrate on which lower electrodes are formed. The lower electrodes are arranged in an array including a rows extending substantially parallel to one another along a first direction. A stripe-shaped capacitor s... | 01/15/2009 |
| 20090016022 | SEMICONDUCTOR MODULE A semiconductor module includes a base plate, a circuit substrate coupled to a side face of the base plate, a first semiconductor package mounted on the circuit substrate and a radiation channel portion inside the base plate. The radiation channel portion includes at le... | 01/15/2009 |
| 20090017404 | STOVETOP/RANGE WARNING AND CONTROL FIRE SAFETY SYSTEM In a stove (100) with a burner area (102), a burner (104) within the burner area (102), and either a gas supply line (144a) or an electrical line (144b), the system monitors conditions in or around the burner area ... | 01/15/2009 |
| 20090017603 | METHOD OF FORMING EPITAXIAL LAYER A method of forming an epitaxial layer on a silicon substrate includes (a) providing a silicon substrate; (b) performing a wet-cleaning process onto the silicon substrate; (c) performing a first plasma cleaning process onto the wet-cleaned silicon substrate by providing... | 01/15/2009 |
| 20090011595 | METHOD OF FORMING A LAYER ON A SEMICONDUCTOR SUBSTRATE AND APPARATUS FOR PERFORMING THE SAME In a method of forming a thin layer for a semiconductor device through an ALD process and a CVD process in the same chamber, a semiconductor substrate is introduced into a processing chamber, and an interval between a showerhead and the substrate is adjusted to a first ... | 01/08/2009 |
| 20090009249 | Input Stage An input stage receives a differential input signal at first and second input nodes and provides a differential output current at first and second output nodes. The differential output current includes a component taken from the input nodes through first and second impe... | 01/08/2009 |
| 20090008790 | SEMICONDUCTOR DEVICE HAVING THROUGH ELECTRODE AND METHOD OF FABRICATING THE SAME A semiconductor device having a through electrode and a method of fabricating the same are disclosed. In one embodiment, a semiconductor device includes a first insulating layer formed on a semiconductor substrate. A wiring layer having a first aperture to expose a port... | 01/08/2009 |
| 20090008763 | SEMICONDUCTOR PACKAGE A semiconductor package, which may include a structure of a semiconductor package having a minimized mounting area and height. The semiconductor package may include a board, a first package comprising at least one first semiconductor chip, and disposed on the board so a... | 01/08/2009 |
| 20090008696 | SEMICONDUCTOR MEMORY DEVICE AND METHOD OF FORMING THE SAME According to one embodiment, a semiconductor memory device can be generally characterized as including a gate insulating layer on a semiconductor substrate, a floating gate on the gate insulating layer and a word line disposed on one side of the floating gate. A first s... | 01/08/2009 |
