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| Application No. | Application Title | Issue Date |
| 20110045242 | MULTILAYER CERAMIC SUBSTRATE AND METHOD FOR PRODUCING THE SAME When a multilayer ceramic substrate with a cavity is reduced in thickness, a bottom wall portion defining the bottom of the cavity is reduced in thickness, thereby leading to the problem that the bottom wall portion is likely to be broken. A bottom wall portion defining... | 02/24/2011 |
| 20110043338 | WIRELESS IC DEVICE SYSTEM AND METHOD OF DETERMINING AUTHENTICITY OF WIRELESS IC DEVICE An accessory device to be mounted on a main device is provided with a wireless IC device. The main device is provided with a reader/writer that is an interrogator that communicates with the wireless IC device of the accessory device. When the accessory device is mounted... | 02/24/2011 |
| 20110038088 | SUBSTRATE INCLUDING AN ESD PROTECTION FUNCTION A substrate including an ESD protection function includes an insulating substrate, at least one of circuit elements or a wiring pattern and an ESD protection portion. In the ESD protection portion, facing portions of at least one pair of discharge electrodes are dispose... | 02/17/2011 |
| 20110037540 | LAMINATED FILTER A laminated filter includes a first insulation layer including first and second coil patterns and a first capacitor pattern and a second insulation layer including third and fourth coil patterns and second and third capacitor patterns. The first and second coil patterns... | 02/17/2011 |
| 20110037535 | ELASTIC WAVE FILTER DEVICE An elastic wave filter device includes first and second inductance elements included in a laminated substrate and first and second elastic wave filter chips mounted on the laminated substrate by flip-chip bonding. The first and second inductance elements provided in the... | 02/17/2011 |
| 20110037344 | BOUNDARY ACOUSTIC WAVE DEVICE A boundary acoustic wave device includes a piezoelectric substrate made of single-crystalline LiTaO3, a first medium layer disposed on the piezoelectric substrate and made of a dielectric, a second medium layer disposed on the first medium layer and made of a... | 02/17/2011 |
| 20110036622 | LAMINATED CERAMIC ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME In a method for manufacturing a laminated ceramic electronic component, in order to form a green ceramic laminate to be fired, first ceramic green layers which include first conductor patterns including Ag as a main component and which include a first ceramic material i... | 02/17/2011 |
| 20110035915 | METHOD FOR MANUFACTURING SURFACE ACOUSTIC WAVE ELEMENT A method for manufacturing a surface acoustic wave element that prevents curvature of a piezoelectric substrate when forming an electrode pattern includes a first step of bonding to a first principal surface of a piezoelectric substrate a support member having a linear ... | 02/17/2011 |
| 20110031320 | WIRELESS IC DEVICE A wireless IC device includes a wireless IC chip arranged to process a radio signal, a power-supply circuit board that is connected to the wireless IC chip and that includes a power supply circuit including at least one coil pattern, and a radiation plate arranged to ra... | 02/10/2011 |
| 20110024510 | WIRELESS IC DEVICE A wireless IC device prevents deviations of the resonant frequency from the desired value. An antenna coil has an end portion positioned in a connector provided on the negative-most side in the z-axis direction and an end portion positioned in a connector provided on th... | 02/03/2011 |
| 20110018130 | SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE MODULE A semiconductor package is provided with a functionally necessary minimum number of components with which stress concentrated on specific solder bumps is reduced and ruptures of the bumps are prevented even when stress caused by physical bending or a difference in therm... | 01/27/2011 |
| 20110014069 | PIEZOELECTRIC FAN DEVICE AND AIR-COOLING APPARATUS USING THE PIEZOELECTRIC FAN DEVICE A piezoelectric fan device includes four piezoelectric fans that are arranged side-by-side in their width direction, and ends of the piezoelectric fans opposite to other ends in which the blades extend are coupled side-by-side and supported by a support. The piezoelectr... | 01/20/2011 |
| 20110013349 | ELECTRONIC COMPONENT MODULE AND METHOD OF MANUFACTURING THE ELECTRONIC COMPONENT MODULE An electronic component module includes a circuit substrate including surface mount components mounted thereon, a resin layer embedding the surface mount components, and a conductor layer provided on a surface of the resin layer, wherein a conductive post is provided on... | 01/20/2011 |
| 20110012803 | ANTENNA COIL TO BE MOUNTED ON A CIRCUIT BOARD AND ANTENNA DEVICE In an antenna coil including a first magnetic core, a second magnetic core, and a flexible board, coil conductors are provided on a surface of the flexible board. By winding the flexible board around the first magnetic core and the second magnetic core, a first coil por... | 01/20/2011 |
| 20110011516 | PROCESS FOR PRODUCING CERAMIC SUBSTRATE A shrinkage suppression layer used in the production of a ceramic substrate according to a non-shrinkage process provides favorable removal performance while sufficiently ensuring the restraining performance of the shrinkage suppression layer. Resin beads, which disappe... | 01/20/2011 |
| 20110006106 | METHOD FOR MANUFACTURING ELECTRONIC COMPONENT MODULE A method for manufacturing an electronic component module is performed such that a shield layer can be formed as a thin film and an electronic component can be effectively shielded. A collective substrate including a plurality of electronic component modules including a... | 01/13/2011 |
| 20110005733 | PIEZOELECTRIC FAN AND COOLING DEVICE USING PIEZOELECTRIC FAN A piezoelectric fan includes a piezoelectric vibrator that vibrates in a bending mode when a voltage is applied thereto and a plurality of parallel or substantially parallel blades connected to or integrated with the piezoelectric vibrator. The blades are arranged betwe... | 01/13/2011 |
| 20110001399 | ELECTRONIC COMPONENT An electronic component includes an electronic component body, first and second outer electrodes, and first and second inner electrodes. The first outer electrode includes a first conductive layer that does not include silver and a second conductive layer that is deposi... | 01/06/2011 |
| 20100328843 | LAMINATED CERAMIC ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR In a method for manufacturing a laminated ceramic electronic component, after a plating layer for an external terminal electrode is formed by applying copper plating to an end surface of a component main body at which respective ends of a plurality of internal electrode... | 12/30/2010 |
| 20100328842 | MULTILAYER ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME In a method for manufacturing a multilayer electronic component, after a plating layer for forming an external electrode is formed on an end surface of a laminate, conditions for heat-treating the laminate are set such that interdiffusion layers have ends which face int... | 12/30/2010 |
| 20100327694 | SURFACE ACOUSTIC WAVE DEVICE A highly reliable surface acoustic wave device includes wiring lines that do not easily rupture at a three-dimensional wiring portion. The surface acoustic wave device includes a plurality of surface acoustic wave elements located on a piezoelectric substrate, a support... | 12/30/2010 |
| 20100320923 | DISCHARGE LAMP LIGHTING APPARATUS In a discharge-lamp lighting apparatus, a switching frequency of an AC voltage applied to an LC series circuit including an inductor and a capacitor is swept near a frequency having a value provided by dividing the resonant frequency of the LC series circuit by an odd n... | 12/23/2010 |
| 20100320866 | BOUNDARY ACOUSTIC WAVE DEVICE A boundary acoustic wave device includes a LiNbO3 substrate having a plurality of grooves provided in the upper surface thereof, electrode layers which are defined by a metal material filled in the grooves and which include IDT electrodes, and a dielectric la... | 12/23/2010 |
| 20100315795 | METHOD OF MANUFACTURING ELECTRONIC COMPONENT A method of manufacturing an electronic component including a first surface mount device and a second surface mount device is provided. The first surface mount device and the second surface mount device are joined to a substrate via joint materials such that either or b... | 12/16/2010 |
| 20100315189 | TRANSFORMER AND TRANSFORMER DEVICE A transformer that is capable of setting any characteristics of a detection voltage of a detection winding and accurately detecting an output voltage includes a bobbin, a magnetic core, a first input winding, an output winding, a second input winding, and a detection wi... | 12/16/2010 |
| 20100314455 | WIRELESS IC DEVICE A wireless IC device improves radiation characteristics or directivity of signals and reliably communicates with a reader/writer. The wireless IC device includes an electromagnetically coupled module includes a wireless IC device and a feed circuit substrate, a protecti... | 12/16/2010 |
| 20100309595 | ESD PROTECTION DEVICE An ESD protection device has a structure that allows ESD characteristics to be easily adjusted and stabilized. The ESD protection device includes a ceramic multilayer substrate, at least a pair of discharge electrodes located in the ceramic multilayer substrate and faci... | 12/09/2010 |
| 20100308118 | WIRELESS IC DEVICE, ELECTRONIC APPARATUS, AND METHOD FOR ADJUSTING RESONANT FREQUENCY OF WIRELESS IC DEVICE A wireless IC device and an electronic apparatus are obtained, which can achieve miniaturization and improve the gain of a radiator plate (electrode) without providing a dedicated antenna. A wireless IC device is provided, in which a loop electrode is provided in a grou... | 12/09/2010 |
| 20100304693 | HIGH FREQUENCY SWITCH MODULE A high frequency switch module includes a laminated circuit component that includes an antenna electrode connected to a single antenna, a plurality of communication electrodes connected to a plurality of high frequency communication circuits to transmit, receive, or tra... | 12/02/2010 |
| 20100304125 | METHOD FOR MANUFACTURING CERAMIC SUBSTRATE AND CERAMIC SUBSTRATE When a ceramic substrate is manufactured through a constraint firing step that uses a constraining layer, the constraining layer is removed without causing significant damage to a sintered base layer or an electrode formed on the surface of the sintered base layer, and ... | 12/02/2010 |
| 20100302704 | LAMINATED ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR A method for manufacturing a laminated electronic component includes the steps of preparing a component main body having a laminated structure, the component main body including a plurality of internal electrodes formed therein, and each of the internal electrodes being... | 12/02/2010 |
| 20100302013 | RADIO FREQUENCY IC DEVICE AND RADIO COMMUNICATION SYSTEM A radio frequency IC device achieves impedance matching between a radio IC chip and a radiation plate in a wide frequency band, and achieves desired radiation characteristics over a wide range of frequencies. A radio frequency IC device and a radio communication system ... | 12/02/2010 |
| 20100301969 | ACOUSTIC WAVE DEVICE A longitudinally-coupled resonator-type acoustic wave device includes first to third IDT electrodes disposed on a piezoelectric material and first and second reflectors disposed in acoustic wave propagation directions. Each of any two IDT electrodes adjacent to each oth... | 12/02/2010 |
| 20100301964 | HIGH-FREQUENCY MODULE A high-frequency module includes at least first and second signal circuits that are each connected between a common antenna port and at least first and second signal ports. The first signal circuit includes a first inductor connected in series between the antenna port a... | 12/02/2010 |
| 20100290172 | LAMINATED ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREFOR A method for manufacturing a laminated electronic component includes the steps of preparing a component main body having a laminated structure, the component main body including a plurality of internal electrodes formed therein, and each of the internal electrodes being... | 11/18/2010 |
| 20100289600 | ELASTIC WAVE DEVICE AND METHOD FOR MANUFACTURING THE SAME An elastic wave device has a structure that prevents flux from flowing into a hollow space of the device during mounting of the device using solder bumps. The elastic wave device includes a substrate, a vibrating portion located on a first main surface of the substrate,... | 11/18/2010 |
| 20100283694 | COMPOSITE ANTENNA A composite antenna achieves favorable radiation characteristics and favorable communication performance, and can be used in short distance communication as well as long distance communication. The composite antenna includes a dipole antenna having an elongated shape, a... | 11/11/2010 |
| 20100283557 | MULTILAYER BANDPASS FILTER A multilayer bandpass filter that is capable of preventing variations in filter characteristics caused by variations in electrode formation, etc., is easily reduced in size, and performs predetermined impedance conversion between an input and an output, includes a first... | 11/11/2010 |
| 20100277255 | LC COMPOSITE COMPONENT An LC composite component has a unique structure that makes it easy to set frequency characteristics while reducing a circuit area and the number of layers. The LC composite component includes a laminated body including a plurality of dielectric layers. The laminated bo... | 11/04/2010 |
| 20100277132 | DC-DC CONVERTER A DC-DC converter includes an inductor, a capacitor, an output voltage detection circuit, and a synchronous rectification circuit including a rectifier-side synchronous rectifier element and a commutator-side synchronous rectifier element. The commutator-side synchronou... | 11/04/2010 |
