Quotables
"The abolishment of pain in surgery is a chimera. It is absurd to go on seeking it...knife and pain are two words in surgery that must forever be associated in the consciousness of the patient."
Dr. Alfred Velpeau, French surgeon ; 1839
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Application No. | Application Title | Issue Date |
| 20110047604 | COMPUTING INPUT SYSTEM WITH SECURE STORAGE AND METHOD OF OPERATION THEREOF A method (700) of operation of a computing input system (100) includes: entering a memory access code (118) with a button (102), a wheel (106), or a device transceiver (612) for a non-physical mechanism (614); verifying t... | 02/24/2011 |
| 20110042757 | INTEGRATED CIRCUIT SYSTEM WITH BAND TO BAND TUNNELING AND METHOD OF MANUFACTURE THEREOF A method of manufacture of an integrated circuit system includes: providing a semiconductor substrate; implanting a well region, having a first conductivity, on the semiconductor substrate; patterning a gate oxide layer on the well region; implanting a source, having a ... | 02/24/2011 |
| 20110040958 | METHOD OF SWITCHING COMPUTER OPERATING SYSTEMS The present invention relates to a method of switching operating systems in a computer, with which the computer executes the procedure of switching different operating systems. A first operating system executes a process of switching to a second operating system. A proc... | 02/17/2011 |
| 20110037157 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE-ON-PACKAGE AND METHOD OF MANUFACTURE THEREOF A method of manufacture of an integrated circuit packaging system includes: providing a substrate; mounting a component over a side of the substrate; forming an interface module having a module via in any location for connectivity to the substrate; and mounting the enti... | 02/17/2011 |
| 20110037152 | DROP-MOLD CONFORMABLE MATERIAL AS AN ENCAPSULATION FOR AN INTEGRATED CIRCUIT PACKAGE SYSTEM AND METHOD FOR MANUFACTURING THEREOF A method for manufacturing an integrated circuit package system includes: providing an integrated circuit; mounting a lead on the periphery of the integrated circuit; connecting the integrated circuit to the lead with an interconnect; and forming a conformable material ... | 02/17/2011 |
| 20110037140 | INTEGRATED CIRCUIT SYSTEM WITH SEALRING AND METHOD OF MANUFACTURE THEREOF A method of manufacture an integrated circuit system includes: forming an insulation region in a base layer; filling an insulator in the insulation region around a perimeter of a main chip region; forming a contact directly on and within planar extents of the insulator;... | 02/17/2011 |
| 20110037136 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH IMAGE SENSOR SYSTEM An integrated circuit package system includes: an integrated circuit die including an image sensor system having interconnects connected thereto; and a transparent encapsulant on the integrated circuit die with portions of the interconnects exposed and with only the tra... | 02/17/2011 |
| 20110035587 | DATA PROGRAMMING CONTROL SYSTEM WITH SECURE DATA MANAGEMENT AND METHOD OF OPERATION THEREOF A method of operation of a data programming control system includes: providing a secure data management host server coupled to a network; encrypting a contract manufacturer job by the secure data management host server, including: providing a memory image file, creating... | 02/10/2011 |
| 20110035142 | NAVIGATION SYSTEM WITH SINGLE INITIATION MECHANISM AND METHOD OF OPERATION THEREOF A method of operation of a navigation system includes: receiving a single selection for a desired item; generating a destination for the desired item with a prioritization and a learned knowledge of a user's behavior for improving an accuracy of the destination that is ... | 02/10/2011 |
| 20110030568 | PRESS-FITTING DIE Provided is a press-fitting die including two removable templates each having two opposing surfaces (front and back) with molds provided thereon, respectively. A first pattern is impressed with the templates pivoted into contact with each other under user-applied pressu... | 02/10/2011 |
| 20110029104 | AUTOMATED PROGRAMMIING SYSTEM EMPLOYING NON-TEXT USER INTERFACE An automated programming system that includes configuring the automated programming system to include an input module, a programming module, and an output module. Employing a non-text user interface system for real-time representation of the input module, the programmin... | 02/03/2011 |
| 20110024887 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH THROUGH SILICON VIA BASE AND METHOD OF MANUFACTURE THEREOF A method of manufacture of an integrated circuit packaging system includes: providing a base having a through-conductor spanning the height of the base, and having an insulator protecting the base and the through-conductor; mounting a chip over the base and connected to... | 02/03/2011 |
| 20110018084 | ENCAPSULANT CAVITY INTEGRATED CIRCUIT PACKAGE SYSTEM AND METHOD OF FABRICATION THEREOF A method for fabricating an encapsulant cavity integrated circuit package system includes: forming a first integrated circuit package with an inverted bottom terminal having an encapsulant cavity and an interposer, and attaching a component on the interposer in the enca... | 01/27/2011 |
| 20110012270 | INTEGRATED CIRCUIT PACKAGE SYSTEM EMPLOYING DEVICE STACKING AND METHOD OF MANUFACTURE THEREOF A method of manufacture of an integrated circuit package system that includes: providing an electrical interconnect system including an inner lead-finger system and an outer lead-finger system; stacking a first device, a second device, and a third device between and ove... | 01/20/2011 |
| 20110006187 | METHOD OF FORMING A KNIFE MOLD BY ETCHING ONCE AND THE KNIFE MOLD FORMED BY THE METHOD A method of forming a knife mold by etching once is provided. The method includes: providing a metal board; forming two corrosion-resistant photoresist layers on the metal board, and exposing and developing the corrosion-resistant photoresist layers, to form patterned l... | 01/13/2011 |
| 20100332847 | ENCRYPTING PORTABLE MEDIA SYSTEM AND METHOD OF OPERATION THEREOF A portable media system for a host computer system, and method of operation thereof, that includes: a controller in the portable media system for communicating clear information between the portable media system and the host computer system; and an encryption system in ... | 12/30/2010 |
| 20100327418 | INTEGRATED CIRCUIT PACKAGE SYSTEM USING HEAT SLUG An integrated circuit package system includes a substrate having an integrated circuit die thereon; a heat slug having a tie bar, the tie bar having characteristics of singulation from an adjacent heat slug; and an encapsulant molded on the substrate, the heat slug, and... | 12/30/2010 |
| 20100320621 | INTEGRATED CIRCUIT PACKAGE-IN-PACKAGE SYSTEM WITH SIDE-BY-SIDE AND OFFSET STACKING AND METHOD FOR MANUFACTURING THEREOF A method for manufacturing of an integrated circuit package-in-package system includes: mounting a first integrated circuit device over a substrate; mounting an integrated circuit package system having an inner encapsulation over the first integrated circuit device with... | 12/23/2010 |
| 20100320619 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER AND METHOD OF MANUFACTURE THEREOF A method of manufacture of an integrated circuit packaging system includes: attaching a lower integrated circuit, having a first through via, over a substrate with the first through via coupled to the substrate; mounting a pre-formed interposer, having an interposer thr... | 12/23/2010 |
| 20100320603 | INTEGRATED CIRCUIT PACKAGE SYSTEM WITH REDISTRIBUTION LAYER AND METHOD FOR MANUFACTURING THEREOF A method for manufacturing an integrated circuit package system includes: providing a base device; attaching a base interconnect to the base device; applying an encapsulant over the base device and the base interconnect; and forming a re-routing film over the encapsulan... | 12/23/2010 |
| 20100320601 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH THROUGH VIA DIE HAVING PEDESTAL AND RECESS AND METHOD OF MANUFACTURE THEREOF A method of manufacture of an integrated circuit packaging system includes: providing a structure having a via filled with conductive material completely through the structure, a recess, and a pedestal portion bordering the recess; mounting a semiconductor device inside... | 12/23/2010 |
| 20100320591 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH CONTACT PADS AND METHOD OF MANUFACTURE THEREOF A method of manufacture of an integrated circuit packaging system includes: attaching contact pads to a base structure; connecting a base die to the base structure; connecting a supporting die over the base die by conductive balls to the contact pads on two sides of the... | 12/23/2010 |
| 20100320590 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH A LEADFRAME HAVING RADIAL-SEGMENTS AND METHOD OF MANUFACTURE THEREOF A method of manufacture of an integrated circuit packaging system includes: providing inwardly converging leadfingers having continuously decreasing widths along lengths thereof to inward ends thereof; electrically connecting an integrated circuit device on the leadfing... | 12/23/2010 |
| 20100320589 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH BUMPS AND METHOD OF MANUFACTURE THEREOF A method of manufacture of an integrated circuit packaging system includes: providing a base strip having a base top side; forming a terminal body with a substantially spherical shape partially in the base strip; attaching a device adjacent the terminal body and over th... | 12/23/2010 |
| 20100320587 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH UNDERFILL AND METHOD OF MANUFACTURE THEREOF A method of manufacture of an integrated circuit packaging system includes: providing a device having a conductor with ends exposed on opposite sides of the device; forming a first surface depression on the device around the conductor; connecting a first component over ... | 12/23/2010 |
| 20100320586 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH STACKED INTEGRATED CIRCUIT AND METHOD OF MANUFACTURE THEREOF A method of manufacture an integrated circuit packaging system includes: providing a substrate; attaching a base component to the substrate by a first interconnect; attaching a stack component connected by a second interconnect to the substrate and partially over the ba... | 12/23/2010 |
| 20100320583 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH A DUAL SUBSTRATE PACKAGE AND METHOD OF MANUFACTURE THEREOF A method of manufacture of an integrated circuit packaging system includes: providing a base substrate having a base conductive material on opposite sides of the base substrate; connecting an internal interconnect having a substantially spherical shape on the base subst... | 12/23/2010 |
| 20100320582 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INWARD AND OUTWARD INTERCONNECTS AND METHOD OF MANUFACTURE THEREOF A method of manufacture of an integrated circuit packaging system includes: providing a base circuit assembly having an integrated circuit device; mounting a pre-formed conductive frame having an outer interconnect and an inner interconnect shorter than the outer interc... | 12/23/2010 |
| 20100320529 | INTEGRATED CIRCUIT SYSTEM WITH HIGH VOLTAGE TRANSISTOR AND METHOD OF MANUFACTURE THEREOF A method of manufacture of an integrated circuit system includes: providing a semiconductor substrate having an active region, implanted with impurities of a first type at a first concentration; forming an isolation region around the active region; forming a parasitic t... | 12/23/2010 |
| 20100320503 | STRAINED CHANNEL TRANSISTOR AND METHOD OF FABRICATION THEREOF The present invention relates to semiconductor integrated circuits. More particularly, but not exclusively, the invention relates to strained channel complimentary metal oxide semiconductor (CMOS) transistor structures and fabrication methods thereof. A strained channel... | 12/23/2010 |
| 20100319008 | PARALLEL PROCESSING METHOD FOR DUAL OPERATING SYSTEM The present invention relates to a parallel processing method for a dual operating system, comprising building a main operating system and a sub operating system on an operating system kernel; executing a first application program in the main operating system and execut... | 12/16/2010 |
| 20100314763 | INTEGRATED CIRCUIT SYSTEM EMPLOYING LOW-K DIELECTRICS AND METHOD OF MANUFACTURE THEREOF A method of manufacture of an integrated circuit system includes: fabricating a substrate having an integrated circuit; applying a low-K dielectric layer over the integrated circuit; forming a via and a trench, in the low-K dielectric layer, over the integrated circuit;... | 12/16/2010 |
| 20100314741 | INTEGRATED CIRCUIT PACKAGE STACKING SYSTEM WITH REDISTRIBUTION AND METHOD OF MANUFACTURE THEREOF A method of manufacture of an integrated circuit package stacking system including: forming a base frame includes: providing a support panel, and forming a coupling pad, a mounting pad, a base frame trace, a discrete component pad, or a combination thereof on the suppor... | 12/16/2010 |
| 20100314738 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH A STACK PACKAGE AND METHOD OF MANUFACTURE THEREOF A method of manufacture of an integrated circuit packaging system includes: providing a stack board; connecting a device over the stack board; forming a stack encapsulant having a cavity and a pedestal over the device and having a shaped perimeter side from a pedestal s... | 12/16/2010 |
| 20100314736 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH PACKAGE-ON-PACKAGE AND METHOD OF MANUFACTURE THEREOF A method of manufacture an integrated circuit packaging system includes: providing a base substrate; mounting a first base integrated circuit over the base substrate; mounting a second base integrated circuit over the first base integrated circuit; attaching a stacking ... | 12/16/2010 |
| 20100314731 | INTEGRATED CIRCUIT PACKAGING SYSTEM WITH HIGH LEAD COUNT AND METHOD OF MANUFACTURE THEREOF A method of manufacture of an integrated circuit packaging system includes: forming a leadframe with a tiebar and an outer lead having an outer lead outer pad; forming an inner lead on a peel strip; attaching the leadframe to the peel strip around the inner lead; wire b... | 12/16/2010 |
| 20100313271 | PORTABLE MEDIA SYSTEM WITH VIRUS BLOCKER AND METHOD OF OPERATION THEREOF A portable media system for a host computer system and method of operation thereof includes: the portable media system for connection with the host computer system; and a virus blocker stored on the portable media system for activating on the host computer system to blo... | 12/09/2010 |
| 20100312469 | NAVIGATION SYSTEM WITH SPEECH PROCESSING MECHANISM AND METHOD OF OPERATION THEREOF A method of operation of a navigation system includes: receiving a single utterance of a spoken input; generating a search region from the spoken input with a region language model; and generating a location identifier based on a sub-region search grammar and the search... | 12/09/2010 |
| 20100304556 | INTEGRATED CIRCUIT SYSTEM WITH VERTICAL CONTROL GATE AND METHOD OF MANUFACTURE THEREOF A method of manufacture of an integrated circuit system includes: providing a mesa over a substrate; forming a trench in the substrate adjacent the mesa; forming a second gate and a charge storage material along a trench sidewall; and forming a first gate from the mesa.... | 12/02/2010 |
| 20100302790 | LED LUMINAIRE AND METHOD FOR FABRICATING THE SAME A light emitting diode (LED) luminaire includes: a heat dissipating module having a heat conductive portion and a plurality of heat dissipating fins disposed on the heat conductive portion, the outer surfaces of the heat dissipating fins having a plurality of titanium n... | 12/02/2010 |
