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| Application No. | Application Title | Issue Date |
| 20110042933 | RECIPIENT VERIFICATION SYSTEMS AND METHODS OF USE, INCLUDING PATIENT IDENTIFICATION A recipient verification system including a strap, a pocket, a tether, and a label strip. The strap is configured for placement about a wearer's appendage (e.g., wrist, ankle, etc.). The pocket is coupled to the strap and forms an interior region that is exteriorly acce... | 02/24/2011 |
| 20110042791 | METHOD FOR TREATING AN OXYGEN-CONTAINING SEMICONDUCTOR WAFER, AND SEMICONDUCTOR COMPONENT A method for treating an oxygen-containing semiconductor wafer, and semiconductor component. One embodiment provides a first side, a second side opposite the first side. A first semiconductor region adjoins the first side. A second semiconductor region adjoins the secon... | 02/24/2011 |
| 20110037163 | DEVICE INCLUDING A RING-SHAPED METAL STRUCTURE AND METHOD A device includes a semiconductor chip with a ring-shaped metal structure extending along the contour of a first main surface of the semiconductor chip. An encapsulation body encapsulates the semiconductor chip and defines a second main surface. An array of external con... | 02/17/2011 |
| 20110037126 | SEMICONDUCTOR ARRANGEMENT INCLUDING A LOAD TRANSISTOR AND SENSE TRANSISTOR A semiconductor arrangement including a load transistor and a sense transistor that are integrated in a semiconductor body. One embodiment provides a number of transistor cells integrated in the semiconductor body, each transistor cell including a first active transisto... | 02/17/2011 |
| 20110037014 | METHOD FOR PRODUCING MEMORY HAVING A SOLID ELECTROLYTE MATERIAL REGION A method for producing a solid electrolyte material region for a memory element of a solid electrolyte memory cell. A first material is formed in substantially pure form. A thermal treatment is carried out in the presence of at least one second material, and the chalcog... | 02/17/2011 |
| 20110034966 | ELECTRICAL BUSHING FOR AN IMPLANTABLE MEDICAL DEVICE One aspect relates to an electrical bushing for an implantable medical device, having an annulus-like holding element for holding the electrical bushing in the implantable medical device, whereby the holding element includes a through-opening, at least one elongated con... | 02/10/2011 |
| 20110034965 | CERMET-CONTAINING BUSHING FOR AN IMPLANTABLE MEDICAL DEVICE One aspect relates to an electrical bushing for an implantable medical device, having an annulus-like holding element for holding the electrical bushing in the implantable medical device, whereby the holding element includes a through-opening, at least one elongated con... | 02/10/2011 |
| 20110033335 | PRODUCING AN ALLOY WITH A POWDER METALLURGICAL PRE-MATERIAL One aspect is a method for producing an alloy, whereby the alloy includes at least a first metal and a second metal, whereby firstly a powder metallurgical route and subsequently a melt metallurgical route is used sequentially in order to generate the alloy from the, at... | 02/10/2011 |
| 20110031611 | EMBEDDED LAMINATED DEVICE An electronic device includes at least one semiconductor chip, each semiconductor chip defining a first main face and a second main face opposite to the first main face. A first metal layer is coupled to the first main face of the at least one semiconductor chip and a s... | 02/10/2011 |
| 20110031602 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE The method comprises providing multiple chips attached to a first carrier, stretching the first carrier so that the distance between adjacent ones of the multiple chips is increased, and applying a laminate to the multiple chips and the stretched first carrier to form a... | 02/10/2011 |
| 20110031597 | SEMICONDUCTOR DEVICE AND METHOD INCLUDING FIRST AND SECOND CARRIERS A semiconductor device and method. One embodiment provides an integral array of first carriers and an integral array of second carries connected to the integral array of first carriers. First semiconductor chips are arranged on the integral array of first carriers. The ... | 02/10/2011 |
| 20110031344 | HIGH VOLTAGE FLYING APPARATUS EMPLOYING MULTIPLE MOTORS A flying apparatus having a frame configured to couple to a high voltage tether system, and at least one motor module mounted to the frame, the module including a holding structure attached to the frame, a rotating structure, including a rotor shaft, configured to rotat... | 02/10/2011 |
| 20110030575 | RAIL CAR COVER SYSTEM A rail car cover system including a rail car, a first cover section and a second cover section. The rail car has an opening. The first cover section is operably attached to the rail car. The first cover section includes a first corner hinge assembly, a first intermediat... | 02/10/2011 |
| 20110027942 | SEMICONDUCTOR PACKAGE A semiconductor package is disclosed. One embodiment provides a semiconductor package singulated from a wafer includes a chip defining an active surface, a back side opposite the active surface, and peripheral sides extending between the active surface and the back side... | 02/03/2011 |
| 20110025301 | Detection of a load state of a half-bridge Disclosed is a method for diagnosing a half-bridge having a first and a second switching element. The method includes providing a half-bridge that has a first and a second switching element connected in series with each other. The first and the second switching element ... | 02/03/2011 |
| 20110024918 | STACKED SEMICONDUCTOR CHIPS Stacked semiconductor chips are disclosed. One embodiment provides a method including a first substrate having a first surface and an opposing second surface. The first substrate includes an array of first connection elements on the first surface of the first substrate.... | 02/03/2011 |
| 20110024915 | SEMICONDUCTOR DEVICE A semiconductor device and method is disclosed. In one embodiment, the method includes placing a first semiconductor over an electrically conductive carrier. The first semiconductor is covered with a molding compound. A through hole is formed in the molding compound. A ... | 02/03/2011 |
| 20110024906 | SEMICONDUCTOR CHIP PACKAGE, SEMICONDUCTOR CHIP ASSEMBLY, AND METHOD FOR FABRICATING A DEVICE A method for fabricating a device, a semiconductor chip package, and a semiconductor chip assembly is disclosed. One embodiment includes applying at least one semiconductor chip on a first form element. At least one element is applied on a second form element. A materia... | 02/03/2011 |
| 20110024791 | BIPOLAR SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD A bipolar semiconductor device and method are provided. One embodiment provides a bipolar semiconductor device including a first semiconductor region of a first conductivity type having a first doping concentration, a second semiconductor region of a second conductivity... | 02/03/2011 |
| 20110022089 | SYSTEMS AND METHODS FOR FACET JOINT TREATMENT A system for treating a facet joint of a patient including superior and inferior resurfacing devices. The superior device includes a resurfacing body configured to conform to a shape of a superior facet articular face, and the inferior device includes a resurfacing body... | 01/27/2011 |
| 20110021720 | ENVIRONMENTALLY FRIENDLY NATURAL OIL-BASED TONER RESIN A method of synthesizing polyester toner resins comprises: polycondensing polycarboxylic acids, polyols and free fatty acids to form low molecular weight polyester resins with alkenyl group or hydroxyl group or a combination of both; wherein at least one of said polycar... | 01/27/2011 |
| 20110018029 | SEMICONDUCTOR DEVICE HAVING A FLOATING SEMICONDUCTOR ZONE A semiconductor device includes a first trench and a second trench extending into a semiconductor body from a surface. A body region of a first conductivity type adjoins a first sidewall of the first trench and a first sidewall of the second trench, the body region incl... | 01/27/2011 |
| 20110015711 | CONNECTION BETWEEN STIMULATION ELECTRODE AND CONDUCTION COIL One aspect includes a stimulation electrode including a base body. The base body encompasses a top area and an end area, and the end area encompasses a screw thread at least area by area.... | 01/20/2011 |
| 20110015710 | CRIMP CONNECTION BETWEEN STIMULATION ELECTRODE AND CONDUCTION COIL One aspect is a stimulation electrode including a base body. The base body encompasses a top area and an end area. The end area encompasses a groove-like, radially revolving coupling element, into which a connection area of a conduction coil can be pressed by means of p... | 01/20/2011 |
| 20110015709 | CONNECTION ELEMENT FOR CONDUCTION COIL One aspect is a medical electrode system including a conduction coil and a stimulation electrode. The stimulation electrode encompasses a base body having a top area and an end area. The system is characterized in that the conduction coil encompasses a connection elemen... | 01/20/2011 |
| 20110014346 | EDIBLE DESSERT PRODUCTS Edible dessert products are produced by taking a sweet baked product, such as a cake or cookie, rendering it into particulate form, and blending it, preferably hot, with a thick custard base. The particulate baked product may be pre-wetted before blending, e.g. using sw... | 01/20/2011 |
| 20110013668 | SEMICONDUCTOR CIRCUIT ARRANGEMENT AND ASSOCIATED METHOD FOR TEMPERATURE DETECTION A semiconductor circuit arrangement and a method for temperature detection is disclosed. One embodiment includes a semiconductor substrate, on which is formed a first insulating layer and thereon a thin active semiconductor region, which is laterally delimited by a seco... | 01/20/2011 |
| 20110012214 | MICROELECTROMECHANICAL SEMICONDUCTOR COMPONENT WITH CAVITY STRUCTURE AND METHOD FOR PRODUCING THE SAME One aspect of the invention relates to a semiconductor component with cavity structure and a method for producing the same. The semiconductor component has an active semiconductor chip with the microelectromechanical structure and a wiring structure on its top side. The... | 01/20/2011 |
| 20110010133 | WIRELESS DATA LOGGING SYSTEM AND METHOD A data acquisition system including a first sensor, a second sensor, and an electronic data acquisition device. The sensors can assume a variety of forms, such as analog, digital, bus, GPS, etc., and have disparate information formats. The data acquisition unit is elect... | 01/13/2011 |
| 20110006407 | SEMICONDUCTOR DEVICE WITH CHANNEL STOP TRENCH AND METHOD A semiconductor device is provided which includes a semiconductor substrate having a first surface, an active area and a peripheral area. The semiconductor device further includes least one channel stop trench formed in the semiconductor substrate, wherein the channel s... | 01/13/2011 |
| 20110005306 | ACTUATABLE CAPACITIVE TRANSDUCER FOR QUANTITATIVE NANOINDENTATION COMBINED WITH TRANSMISSION ELECTRON MICROSCOPY An actuatable capacitive transducer including a transducer body, a first capacitor including a displaceable electrode and electrically configured as an electrostatic actuator, and a second capacitor including a displaceable electrode and electrically configured as a cap... | 01/13/2011 |
| 20110003440 | METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE A method of manufacturing a semiconductor device or a substrate is described. The method includes providing a chip attached to a carrier or providing a substrate. A foil is held over the chip and the carrier or the substrate. A laser beam is directed onto the foil, and ... | 01/06/2011 |
| 20110003019 | EXTRACT FROM PALM LEAVES AND A METHOD FOR PRODUCING THE SAME A method for preparing an herbal extract comprises the steps of pre-treating foliages derive from a plant of Arecaceae family; extracting the pre-treated foliages by using a polar solvent; removing the pre-treated foliages from the used polar solvent; and concentrating ... | 01/06/2011 |
| 20100330867 | TOY CONSTRUCTION SYSTEM A toy construction system is designed based round a generally square piece having ball (32) and socket (34) connection components on its edges. In addition, its centre has a further socket connection component (35) enabling the pieces to be assemble... | 12/30/2010 |
| 20100327942 | SEMICONDUCTOR DEVICE ARRANGEMENT AND METHOD A semiconductor device arrangement and a method. One embodiment includes at least one power transistor and at least one gate resistor located between a gate of the power transistor and a connecting point in the drive circuit of the power transistor. The semiconductor de... | 12/30/2010 |
| 20100326016 | AUTOMATED PACKAGING SYSTEMS, DEVICES, AND METHODS An automated method for forming a packaged good article includes establishing a continuous path of travel for a mandrel. The mandrel defines an open interior between a package side and a loading side. With the mandrel at a first angle, a packaging material is wrapped ab... | 12/30/2010 |
| 20100321041 | Determining the dead time in driving a half-bridge Disclosed is a circuit arrangement for determining a temporal change of an output voltage of a half-bridge circuit during a dead time. In one embodiment, the circuit arrangement includes a first input for applying the output voltage. A capacitive network is provided hav... | 12/23/2010 |
| 20100320536 | TRANSISTOR COMPONENT HAVING AN AMORPHOUS SEMI-ISOLATING CHANNEL CONTROL LAYER Disclosed is a transistor component having a control structure with a channel control layer of an amorphous semiconductor insulating material extending in a current flow direction along a channel zone.... | 12/23/2010 |
| 20100320535 | TRANSISTOR COMPONENT HAVING AN AMORPHOUS CHANNEL CONTROL LAYER Disclosed is a semiconductor component, including: a drift zone arranged between a first and a second connection zone; a channel control layer of an amorphous semi-insulating material arranged adjacent to the drift zone.... | 12/23/2010 |
| 20100318106 | SUTURE LOOP ISOMETER A suture loop isometer includes an elongated body; a first loop provided at one end of the elongated body; a T-bar provided at an opposite end of the elongated body; at least one leg extended from one end of the T-bar; and a second loop provided at an end of the at leas... | 12/16/2010 |
