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| Application No. | Application Title | Issue Date |
| 20110045642 | METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE A method of manufacturing a semiconductor package comprises: preparing a photosensitive insulating material having a first surface and a second surface opposite to the first surface; bonding a semiconductor chip to the first surface of the photosensitive insulating mate... | 02/24/2011 |
| 20110045283 | ABRASION-BLASTED CUTTING INSERT AND METHOD The invention relates to a cutting insert and a method for its production, in which a hard-metal, cermet, or ceramic substrate body is coated by means of a PVD, PCVD or CVD method with a single- or multi-layer coating of carbides, nitrides, oxides, carbonitrides, oxinit... | 02/24/2011 |
| 20110044700 | OPTICAL COMMUNICATIONS SYSTEM The present invention relates to an optical communications system that allows improving OSNR while suppressing the power increase of pumping light for distributed Raman amplification. In the optical communications system, an optical fiber is laid in a transmission secti... | 02/24/2011 |
| 20110043403 | MILLIMETER WAVE CAMERA WITH IMPROVED RESOLUTION THROUGH THE USE OF THE SAR PRINCIPLE IN COMBINATION WITH A FOCUSING OPTIC The present invention concerns an apparatus for and a method of imaging an object by means of electromagnetic very high frequency radiation. The state of the art discloses systems for and methods of imaging with a synthetic aperture, which distinguish the signals emitte... | 02/24/2011 |
| 20110042788 | PROCESS FOR PRODUCING Si(1-v-w-x)CwAlxNv BASE MATERIAL, PROCESS FOR PRODUCING EPITAXIAL WAFER, SI(1-v-w-x)CwAlxNv BASE MATERIAL, AND EPITAXIAL WAFER Si(1-v-w-x)CwAlxNv crystals in a mixed crystal state are formed. A method for manufacturing an easily processable Si(1-v-w-x)CwAlxNv substrate, a method for manufacturing an epitaxia... | 02/24/2011 |
| 20110042438 | ELECTRIC STAPLER An electric stapler is provided with: a driver unit including a driver for striking out a staple to be penetrated through sheets of paper; and a clincher unit including a clincher for bending leg portions of the staple penetrated through the sheets of paper. The driver ... | 02/24/2011 |
| 20110042116 | ROTATING DEVICE A rotating device for rotating an apparatus arranged at the outer end of a boom, which boom has a longitudinal axis, the rotating device comprising a first torque motor unit arranged to rotate the apparatus substantially around an axis in the direction of the longitudin... | 02/24/2011 |
| 20110042053 | SANDWICH MATERIAL FOR BRAZING WITH HIGH STRENGTH AT HIGH TEMPERATURE The invention relates to a sandwich material for brazing comprising a core layer of a first aluminum alloy and a barrier layer of a second aluminum alloy characterized by that: the first alloy, constituting the core layer contains (in weight %): 0.8-2% Mn, ≦1.0% Mg, 0... | 02/24/2011 |
| 20110039783 | PEPTIDE HAVING HYPOTENSIVE ACTIVITY The present invention provides a novel peptide having a physiological activity. Because of having a hypotensive activity, this novel peptide is useful in treating a disease caused by hypertension. Also, an antibody to the novel peptide is provided.... | 02/17/2011 |
| 20110039071 | METHOD OF MANUFACTURING A Si(1-v-w-x)CwAlxNv SUBSTRATE, METHOD OF MANUFACTURING AN EPITAXIAL WAFER, Si(1-v-w-x)CwAlxNv SUBSTRATE, AND EPITAXIAL WAFER There are provided a method for manufacturing a Si(1-v-w-x)CwAlxNv substrate having a reduced number of cracks and high processibility, a method for manufacturing an epitaxial wafer, a Si(1-v-w-x)CwAl 02/17/2011 | |
| 20110037272 | FRAME STRUCTURE FOR SUPPORTING A WIND POWER PLANT The present invention refers to an arrangement (“A”) related to a body of water for creating conditions for generating electric power from a prevailing force of wind (“W”). Utilized pontoon units are made up of and associated with a... | 02/17/2011 |
| 20110037149 | METHOD OF CUTTING A WAFER-LIKE OBJECT AND SEMICONDUCTOR CHIP A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on th... | 02/17/2011 |
| 20110036726 | GAS DECOMPOSITION APPARATUS AND METHOD FOR DECOMPOSING GAS [Object] To provide a gas decomposition apparatus and a gas decomposition method in which no safety problems occur in spite of the application of a relatively high voltage between an anode and a cathode for the purpose of decomposing odorous gases of many types. | 02/17/2011 |
| 20110036008 | PLANTING CONTAINER The present invention provides a planting container capable of sufficiently and stably supply planting water to a rhizosphere where roots of a plant grow, securing as large a space as possible for the rhizosphere, and further accelerating the growth of the stem or leave... | 02/17/2011 |
| 20110032142 | SYNTHETIC APERTURE PROCESSING SYSTEM AND SYNTHETC APERTURE PROCESSING METHOD A synthetic aperture processing system 10 includes a signal transmission unit 12 for generating a plurality of chirp waves and radiating the plurality of chirp waves to an irradiation region from a plurality of measuring sites, a signal reception unit 1... | 02/10/2011 |
| 20110031589 | GROUP III NITRIDE SUBSTRATE, SEMICONDUCTOR DEVICE COMPRISING THE SAME, AND METHOD FOR PRODUCING SURFACE-TREATED GROUP III NITRIDE SUBSTRATE A group III nitride substrate in one embodiment has a surface layer. The surface layer contains 3 at. % to 25 at. % of carbon and 5×1010 atoms/cm2 to 200×1010 atoms/cm2 of a p-type metal element. The group III nitride substr... | 02/10/2011 |
| 20110031534 | PROCESS FOR PRODUCING Si(1-v-w-x)CwAlxNv BASE MATERIAL, PROCESS FOR PRODUCING EPITAXIAL WAFER, Si(1-v-w-x)CwAlxNv BASE MATERIAL, AND EPITAXIAL WAFER There are provided a Si(1-v-w-x)CwAlxNv substrate that achieves high crystallinity and low costs, an epitaxial wafer, and manufacturing methods thereof. A method for manufacturing a Si(1-v-w-... | 02/10/2011 |
| 20110031415 | RADIATION IMAGE CONVERTING PANEL The present invention relates a radiation image converting panel with a structure capable of arbitrarily controlling a change in luminance distribution of an entire panel surface after formation of a moisture-resistant protective film. The radiation image converting pan... | 02/10/2011 |
| 20110031377 | SOLID-STATE IMAGING DEVICE A multi-port solid-state imaging device of one embodiment includes an imaging region and a plurality of units. The imaging region contains a plurality of pixel columns. The units are arrayed in a direction in which the pixel columns are arrayed, and generate signals bas... | 02/10/2011 |
| 20110029783 | METHOD AND SYSTEM FOR SECURE HARDWARE PROVISIONING Provisioning a computer related product, comprising manufacturing a product at a product manufacturing entity; maintaining a product control database at product authenticity responsible entity; assigning a first identifier to the product for the purpose of establishing ... | 02/03/2011 |
| 20110029131 | APPARATUS AND METHOD FOR MEASURING TOOL CENTER POINT POSITION OF ROBOT A measurement apparatus for determining a position of a tool center point (31) of a tool (30), which is attached to a tool attachment surface (32) of a robot (1), with respect to the tool attachment surface (32) includes: a camera (... | 02/03/2011 |
| 20110027972 | METHOD OF CUTTING A SUBSTRATE AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on th... | 02/03/2011 |
| 20110027971 | METHOD OF CUTTING A SUBSTRATE, METHOD OF PROCESSING A WAFER-LIKE OBJECT, AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on th... | 02/03/2011 |
| 20110027586 | ELECTRODE MEMBER FOR COLD CATHODE FLUORESCENT LAMP The invention offers an electrode member for a cold cathode fluorescent lamp, the member having excellent ability to attain intimate contact between the lead portion and glass, and a production method thereof. The electrode member 10 has an electrode portion 1... | 02/03/2011 |
| 20110026556 | QUANTUM CASCADE LASER A quantum cascade laser is configured to include a semiconductor substrate and an active layer which is provided on the substrate and has a cascade structure formed by multistage-laminating unit laminate structures 16 each including an emission layer 17 an... | 02/03/2011 |
| 20110025897 | SOLID-STATE IMAGE SENSING DEVICE CONTAINING ELECTRON MULTIPLICATION FUNCTION A solid state imaging device with an electron multiplying function includes an imaging region VR formed of a plurality of vertical shift registers, a horizontal shift register HR that transfers electrons from the imaging region VR, a multiplication register EM that mult... | 02/03/2011 |
| 20110025855 | DISPLAY DEVICE AND IMAGE OPTIMIZATION METHOD A display device and an image optimization method in which a plurality of features of a received video signal are analyzed, optimization data corresponding to the analyzed result from an optimization information server is acquired when the optimization data is present i... | 02/03/2011 |
| 20110024855 | PHOTODETECTOR An infrared detector (1) having a bolometer element (11) and a reference element (21) is provided with a bolometer thin film (22) supported on a surface of a substrate (10) while spaced apart from the surface of the substrate (10 | 02/03/2011 |
| 20110024854 | SOLID-STATE IMAGE SENSING DEVICE CONTAINING ELECTRON MULTIPLICATION FUNCTION A solid state imaging device includes a P-type semiconductor substrate 1A, a P-type epitaxial layer 1B grown on the semiconductor substrate 1A, an imaging region VR grown within the epitaxial layer 1B, and an N-type semiconductor region 1<... | 02/03/2011 |
| 20110024721 | SEMICONDUCTOR LIGHT EMITTING DEVICE A semiconductor light emitting device including a semiconductor substrate and an active layer which is formed on the substrate and has a cascade structure formed by multistage-laminating unit laminate structures 16 each including an emission layer 17 and a... | 02/03/2011 |
| 20110024607 | SOLID-STATE IMAGING DEVICE A solid-state imaging device 1 is provided with a plurality of photoelectric converting portions 3, a plurality of first transferring portions 5, a plurality of charge accumulating portions 7, a plurality of second transferring portions 9<... | 02/03/2011 |
| 20110024606 | SOLID-STATE IMAGING DEVICE A solid-state imaging device of an embodiment includes an imaging region, an output register, a corner register, a multiplication register, a first amplifier, a second amplifier, and a valve gate electrode. The output register is a transfer register that receives a char... | 02/03/2011 |
| 20110024146 | HAMMERING TOOL A hammering tool includes, within its tool main body, a piston which reciprocates by using a motor as its drive force, a hammering member which carries out its hammering operation in linking with the reciprocating motion of the piston, and an intermediate member which t... | 02/03/2011 |
| 20110024075 | SYSTEM AND METHOD FOR REGENERATING HEAT ENERGY The present invention relates to a method for regenerating heat energy with the aid of an energy system comprising n number of energy cells (121, . . . ,12n), wherein n is an integer, and n>2. The energy cells (121, . . . ,12n 02/03/2011 | |
| 20110021862 | METHOD FOR TREATING ORGANIC WASTE AND METHOD OF UTILIZING HEAT ENERGY Even an organic waste having a high water content ratio can be caused as it is to undergo accelerated microbial degradation and be composted or reduced in volume, without the need of drying with heat energy or air blowing as in conventional techniques or of adding an ag... | 01/27/2011 |
| 20110021004 | METHOD OF CUTTING A SUBSTRATE, METHOD OF CUTTING A WAFER-LIKE OBJECT, AND METHOD OF MANUFACTURING A SEMICONDUCTOR DEVICE A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on th... | 01/27/2011 |
| 20110019795 | SOLID-STATE IMAGER AND X-RAY CT APPARATUS INCLUDING SAME A solid-state imager has a structure for capturing a high-resolution image even if any of the read wiring and the column-selection wiring is disconnected. The solid-state imager (1) comprises a light-receiving part (10) having M | |
| 20110018419 | MICRO CHANNEL PLATE An MCP has a rectangular plate shape and has a porous part, to which a plurality of pores (channels) penetrating in the thickness direction are disposed, and a poreless part including a solid glass or the like to which the channels are not provided on the both sides of ... | 01/27/2011 |
| 20110018187 | APPARATUS FOR MANUFACTURE OF PV SOLAR CELLS OR THIN FILM SOLAR MODULES The present invention relates to equipment used to manufacture PV cells or modules. In some embodiments, a support structure is provided that provides support for substrates used in the manufacture of PV cells or modules. The support structure provides support for the s... | 01/27/2011 |
| 20110017936 | PIEZOELECTRIC CERAMIC AND PIEZOELECTRIC CERAMIC COMPOSITION A piezoelectric ceramic 10 composed mainly of a three-component solid solution represented by the following general formula (1), wherein x, y and z in general formula (1) satisfy the following formulas (2), (3), (4) and (5).
| 01/27/2011 |
