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| Number | Title | Issue Date |
| 7962864 | Stage yield prediction In one embodiment, a method for predicting yield during the design stage includes receiving defectivity data identifying defects associated with previous wafer designs, and dividing the defects into systematic defects and random defects. For each design layout of a ... | 06/14/2011 |
| 7960980 | Testing device to test plates for electronic circuits and relative method A testing device to test a plate for electronic circuits, comprising transport members able to transport the plate along an axis of feed (Y), at least from an entrance station to a testing station defining a testing plane (P′), and testing members, disposed in cor... | 06/14/2011 |
| 7960294 | Method of modifying interlayer adhesion Methods are provided for processing a substrate for depositing an adhesion layer having a low dielectric constant between two low k dielectric layers. In one aspect, the invention provides a method for processing a substrate including depositing a barrier layer on t... | 06/14/2011 |
| 7939422 | Methods of thin film process A method for forming a semiconductor structure includes forming a plurality of features across a surface of a substrate, with at least one space being between two adjacent features. A first dielectric layer is formed on the features and within the at least one space... | 05/10/2011 |
| 7938714 | Polishing pad assembly with glass or crystalline window Methods and apparatus for providing a chemical mechanical polishing pad. The pad includes a polishing layer having a top surface and a bottom surface. The pad includes an aperture having a first opening in the top surface and a second opening in the bottom surface. ... | 05/10/2011 |
| 7937179 | Dynamic inline yield analysis and prediction of a defect limited yield using inline inspection defects In one embodiment, a method for predicting yield includes calculating a criticality factor (CF) for each of a plurality of defects detected in an inspection process step of a wafer, and determining a yield-loss contribution of the inspection process step to the fina... | 05/03/2011 |
| 7935643 | Stress management for tensile films The formation of a gap-filling silicon oxide layer with reduced tendency towards cracking is described. The deposition involves the formation of a flowable silicon-containing layer which facilitates the filling of trenches. Subsequent processing at high substrate te... | 05/03/2011 |
| 7935464 | System and method for self-aligned dual patterning A system and a method for self-aligned dual patterning are described. The system includes a platform for supporting a plurality of process chambers. An etch process chamber coupled to the platform. An ultra-violet radiation photo-resist curing process chamber is als... | 05/03/2011 |
| 7935240 | Electroplating apparatus and method based on an array of anodes The present invention generally relates to apparatus and methods for plating conductive materials on a substrate. One embodiment of the present invention provides an apparatus for plating a conductive material on a substrate. The apparatus comprises a fluid basin co... | 05/03/2011 |
| 7934979 | Retaining ring with tapered inner surface A retaining ring has a generally annular body with a top surface, a bottom surface, an inner diameter surface, and an outer diameter surface. The outer diameter surface includes an outwardly projecting flange having a lower surface, and the bottom surface includes a... | 05/03/2011 |
| 7934125 | Ranged fault signatures for fault diagnosis Process data is analyzed, the process data having been generated during a manufacturing process to detect a fault. One or more process variables of the manufacturing process that contributed to the fault are determined. A relative contribution of each of the one or ... | 04/26/2011 |
| 7933009 | Method and apparatus for verifying proper substrate positioning Embodiments of methods and apparatus for detecting the proper position of a substrate in a chamber are provided herein. In some embodiments, a substrate position detection apparatus includes a substrate support having a plurality of lift pins for supporting a substr... | 04/26/2011 |
| 7931522 | Removable optical monitoring system for chemical mechanical polishing A polishing system includes a platen having a top surface to receive a polishing pad, a recess in the top surface, and a cavity inside the platen spaced from the recess, a carrier head to hold a surface of a substrate against the polishing pad on the platen, a monit... | 04/26/2011 |
| 7930061 | Methods and apparatus for loading and unloading substrate carriers on moving conveyors using feedback The present invention provides systems and methods for loading and unloading substrate carriers onto and off of a transport system. The invention includes a substrate carrier handler adapted to transfer a substrate carrier between a docking station and a transport s... | 04/19/2011 |
| 7928413 | Ion implanters The present invention relates to components in an ion implanter that may see incidence of the ion beam, such as a beam dump or a beam stop. Such components will be prone to the ions sputtering material from their surfaces, and sputtered material may become entrained... | 04/19/2011 |
| 7928411 | Linear electron source, evaporator using linear electron source, and applications of electron sources A method of charging a web or foil is described. The method includes guiding a web or foil having a thickness of 10 μm or larger with at least on roller; providing a linear electron source having a housing acting as an anode, the housing having side walls; a slit o... | 04/19/2011 |
| 7928003 | Air gap interconnects using carbon-based films A method of forming an interconnect structure comprising: forming a sacrificial inter-metal dielectric (IMD) layer over a substrate, wherein the sacrificial IMD layer comprising a carbon-based film, such as amorphous carbon, advanced patterning films, porous carbon,... | 04/19/2011 |
| 7927713 | Thin film semiconductor material produced through reactive sputtering of zinc target using nitrogen gases The present invention generally comprises a semiconductor film and the reactive sputtering process used to deposit the semiconductor film. The sputtering target may comprise pure zinc (i.e., 99.995 atomic percent or greater), which may be doped with aluminum (about ... | 04/19/2011 |
| 7927190 | Retaining ring with shaped surface A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine ... | 04/19/2011 |
| 7927182 | Polishing system with in-line and in-situ metrology A computer-implemented method for process control in chemical mechanical polishing in which an initial pre-polishing thickness of a substrate is measured at a metrology station, a parameter of an endpoint algorithm is determined from the initial thickness of the sub... | 04/19/2011 |
| 7927062 | Methods and apparatus for transferring substrates during electronic device manufacturing In one aspect, a first apparatus is provided that is adapted to transfer a substrate between a transfer chamber and a processing chamber. The first apparatus includes a robot having a first blade, a second blade spaced from the first blade, and a central hub coupled... | 04/19/2011 |
| 7926494 | Bernoulli blade An end effector for a transport robot arm for a wafer wet cleaning system has an arm with a chuck at an end of the arm to support a wafer. The chuck also includes a cavity to spray a bottom surface of the wafer with a cleaning fluid. At least two branches extend fro... | 04/19/2011 |
| 7925377 | Cluster tool architecture for processing a substrate Embodiments generally provide an apparatus and method for processing substrates using a multi-chamber processing system (e.g., a cluster tool) that has an increased system throughput, increased system reliability, substrates processed in the cluster tool have a more... | 04/12/2011 |
| 7924419 | Illumination system for optical inspection Apparatus for generating optical radiation includes a laser, which is configured to operate in multiple transverse modes simultaneously so as to generate an input beam, which is characterized by a first speckle contrast. The transverse modes of the input beam are op... | 04/12/2011 |
| 7923933 | Lamp failure detector An apparatus and method for detecting lamp failure is described for an array of lamps used in a rapid thermal processing system. The lamp failure detection system enables identification of a failed lamp among a plurality of lamps, and also provides identification of... | 04/12/2011 |
| 7923660 | Pulsed laser anneal system architecture Disclosed is the method and apparatus for annealing semiconductor substrates. One embodiment provides a semiconductor processing chamber comprising a first substrate support configured to support a substrate, a second substrate support configured to support a substr... | 04/12/2011 |
| 7923386 | Method to improve the step coverage and pattern loading for dielectric films A method of forming a layer on a substrate in a chamber, wherein the substrate has at least one formed feature across its surface, is provided. The method includes exposing the substrate to a silicon-containing precursor in the presence of a plasma to deposit a laye... | 04/12/2011 |
| 7923354 | Methods for depositing a microcrystalline silicon film for a photovoltaic device Methods for depositing a microcrystalline silicon film layer with improved deposition rate and film quality are provided in the present invention. Also, a photovoltaic (PV) cell having a microcrystalline silicon film is provided. In one embodiment, the method produc... | 04/12/2011 |
| 7923280 | Millisecond annealing (DSA) edge protection A method and apparatus for thermally processing a substrate is provided. A substrate is disposed within a processing chamber configured for thermal processing by directing electromagnetic energy toward a surface of the substrate. An energy blocker is provided to blo... | 04/12/2011 |
| 7923069 | Multi-station deposition apparatus and method A multi-station deposition apparatus capable of simultaneous processing multiple substrates using a plurality of stations, where a gas curtain separates the stations. The apparatus further comprises a multi-station platen that supports a plurality of wafers and rota... | 04/12/2011 |
| 7923057 | Methods and apparatus for reducing irregularities in color filters Methods, apparatus and systems are disclosed for printing color filters for flat panel displays and avoiding mura effects by depositing a plurality of ink drops on a substrate within a column of pixel wells and intentionally varying the size and/or the relative late... | 04/12/2011 |
| 7922863 | Apparatus for integrated gas and radiation delivery An apparatus for photo-assisted or photo-induced processes is disclosed, comprising a process chamber having an integrated gas and radiation distribution plate. In one embodiment, the plate has one set of apertures for distributing one or more process gases, and ano... | 04/12/2011 |
| 7922440 | Apparatus and method for centering a substrate in a process chamber The present invention comprises an apparatus and method for centering a substrate in a process chamber. In one embodiment, the apparatus comprises a substrate support having a support surface adapted to receive the placement of a substrate and a reference axis subst... | 04/12/2011 |
| 7921803 | Chamber components with increased pyrometry visibility The present invention generally provides method and apparatus for non-contact temperature measurement in a semiconductor processing chamber. Particularly, the present invention provides methods and apparatus for non-contact temperature measurement for temperature be... | 04/12/2011 |
| 7919972 | Integrated substrate transfer module A system and method for supporting and transferring a substrate relative to a plurality of testing columns are provided. The system includes a testing table adapted to support and move the substrate relative to the plurality of testing columns. The testing table may... | 04/05/2011 |
| 7919722 | Method for fabricating plasma reactor parts A method of fabricating yttria parts is provided herein. In one embodiment, the method includes sintering a yttria sample, machining the sintered sample to form a part, and annealing the part by heating the part at a predetermined heating rate, maintaining the part ... | 04/05/2011 |
| 7919398 | Microcrystalline silicon deposition for thin film solar applications Embodiments of the invention as recited in the claims relate to thin film multi-junction solar cells and methods and apparatuses for forming the same. In one embodiment a method of forming a thin film multi-junction solar cell over a substrate is provided. The metho... | 04/05/2011 |
| D635597 | Lift pin | 04/05/2011 |
| 7915114 | Low temperature process for TFT fabrication Method of fabricating a thin-film transistor (TFT) in which a gate metal is deposited onto a substrate in order to form the gate of the thin-film transistor. The substrate may be an insulative substrate or a color filter. In a first method, the gate metal is subject... | 03/29/2011 |
| 7914623 | Post-ion implant cleaning for silicon on insulator substrate preparation A combination of a dry oxidizing, wet etching, and wet cleaning processes are used to remove particle defects from a wafer after ion implantation, as part of a wafer bonding process to fabricate a SOI wafer. The particle defects on the topside and the backside of th... | 03/29/2011 |
