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Assignee: Westech Systems, Inc.


Location: Phoenix, AZ
No. of patents: 5

NumberTitleIssue Date
5456627Conditioner for a polishing pad and method therefor
An axially rotating circular polishing pad is conditioned by a rotating end effector that has an abrasion disc in contact with a polishing surface of the pad. The end effector moves along a radius of the polishing pad surface at a velocity that varies to ...
10/10/1995
5257478Apparatus for interlayer planarization of semiconductor material
A pad for planarizing the surface of a semiconductor wafer. The pad includes at least two layers. One layer has a hydrostatic modulus which is different from the hydrostatic modulus of the other pad....
11/02/1993
5144711Cleaning brush for semiconductor wafer
Apparatus for cleaning an offset semiconductor wafer includes first and second opposed brushes circumscribing a common drive shaft. The wafer includes a circular peripheral edge. At any given instant, a first portion of the offset semiconductor wafer is p...
09/08/1992
5095661Apparatus for transporting wafer to and from polishing head
Apparatus for transporting a wafer into position against the pressure head of apparatus for polishing the wafer. The transport apparatus includes a dolly for positioning a wafer over a transport head assembly. The transport head assembly removes the wafer...
03/17/1992
4944119Apparatus for transporting wafer to and from polishing head
Apparatus for transporting a wafer into position against the pressure head of apparatus for polishing the wafer. The transport apparatus includes a dolly for positioning a wafer over a transport head assembly. The transport head assembly removes the wafer...
07/31/1990
 
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