Bizarre Patents
Decorative Jeweled Wheel Cover
An improved wheel is provided wherein decorative items such as gem stones are embedded in either the wheel surface, a special mounting section attached to the wheel surface, or to a spoke strap that wraps around each spoke and positions embedded gem stones on the outside surface of the spoke.
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| Number | Title | Issue Date |
| 6762118 | Package having array of metal pegs linked by printed circuit lines An integrated circuit package structure having an array of metal pegs connected by printed circuit lines. The package includes a die pad having a die positioned above and an area array distribution of external metal pegs surrounding the die. The package also contain... | 07/13/2004 |
| 6650005 | Micro BGA package A micro BGA package comprises a die, a wiring board, a plurality of metal bonding wires, a plurality of solder balls, and a package body. The wiring board has a die-attaching surface, a surface-mounting surface with solder balls, and lateral surfaces betw... | 11/18/2003 |
| 6521485 | Method for manufacturing wafer level chip size package A method for manufacturing a wafer level chip size package and the method comprises the steps of: securing wafer to a partly etched lead frame, drilling blind hole and filling conductive material after packaging the lead frame to electrically connect the ... | 02/18/2003 |
| 6486564 | Heat dissipation module for a BGA IC An improved heat dissipation module for BGA IC's is a thin metal module used for heat dissipation in an encapsulated IC device. It has an annular base with several supports extending from its inner rim upwards to support a top plate. At least one protrudi... | 11/26/2002 |
| 6380624 | Stacked integrated circuit structure A stacked integrated circuit structure, in which main package bodies of a plurality of integrated circuits are stacked on each other. Connections between leads of the stacked integrated circuits are made by means of a stacking substrate. Therein, each of ... | 04/30/2002 |
| 6380062 | Method of fabricating semiconductor package having metal peg leads and connected by trace lines A method for forming ball grid array package. The ball grid array package has internal trace lines and exposed metal pegs. A metal substrate is provided. Electroplated layers are formed over metal peg regions and a die pad region on the surface of the met... | 04/30/2002 |
| 6337510 | Stackable QFN semiconductor package A stackable QFN semiconductor package comprises a die, a lead frame, an electrical connection device, and a molding compound. The die has a plurality of bonding pads on its topside. The lead frame consists of a plurality of inner leads around edge of the ... | 01/08/2002 |
| 6278182 | Lead frame type semiconductor package A semiconductor package containing a silicon chip, a lead frame, a plurality of conductive wires, a heat sink and some packaging material. Both the silicon chip and the heat sink are mounted on the lead frame, and the silicon chip is located between the h... | 08/21/2001 |
| 6262475 | Lead frame with heat slug The addition of a heat slug to a lead frame establishes a heat conduction path from a silicon chip on the lead frame to the heat slug. Hence, when a semiconductor package that encloses the lead frame and the silicon chip is formed, heat produced by the si... | 07/17/2001 |
| 6204553 | Lead frame structure A lead frame for a semiconductor package. The lead frame includes a die pad and a plurality of leads. One surface of the die pad supports a silicon chip while the other surface has a plurality of annular grooves all having the same geometric center. The i... | 03/20/2001 |
