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Assignee: Vac-Tec Systems, Inc.


Location: Boulder, CO
No. of patents: 21

NumberTitleIssue Date
5037517Method of forming layered structure for adhering gold to a substrate
A method of forming a layered structure for adhering gold to a substrate is disclosed. The layered structure includes a first layer overlying the substrate. The first layer includes a member selected from the group consisting of metal nitrides, metal carb...
08/06/1991
4981756Method for coated surgical instruments and tools
A process for producing corrosion resistant and wear resistant medical tools and instruments by coating high strength low-carbon martensitic stainless steels with a thin, hard layer of refractory metal compound, preferably via cathodic arc plasma depositi...
01/01/1991
4950365Corrosion free hard coated metal substrates
A process for making an article comprising a substrate, a first coating on the surface of said substrate of a thin, hard coated metal compound, and a second coating on the surface of said first coat of a thin uniform conformal polymeric material....
08/21/1990
4898768Layered structure for adhering gold to a substrate and method of forming such
A layered structure for adhering gold to a substrate and a method of forming such on a substrate are disclosed. An article of jewelry or the like which is formed by the disclosed method and which includes the disclosed layered structure is also disclosed....
02/06/1990
4892633Magnetron sputtering cathode
A superior method and magnetron sputtering cathode apparatus in which some of the flux lines forming the closed-loop magnetic tunnel are made to change their curvature from convex to slightly concave within a region of the tunnel intersecting the sputteri...
01/09/1990
4865708Magnetron sputtering cathode
A superior method and magnetron sputtering cathode apparatus in which some of the flux lines forming the closed-loop magnetic tunnel are made to change their curvature from convex to slightly concave within a region of the tunnel intersecting the sputteri...
09/12/1989
4814056Apparatus for producing graded-composition coatings
Apparatus for depositing a coating on at least one substrate where the coating includes at least two component materials where the relative percentages of the component materials with respect to each other varies through the thickness of the coating. The ...
03/21/1989
4724058Method and apparatus for arc evaporating large area targets
Method and apparatus for arc evaporating a large target having a surface area of at least about 20 square inches, including a device for confining the arc to the target surface and a magnetic field source for establishing at least one magnetic field in a ...
02/09/1988
4559121Method and apparatus for evaporation arc stabilization for permeable targets
Apparatus and method for evaporation arc stabilization including a permeable target having a surface of material to be evaporated; circuitry for establishing an arc on the target surface for evaporating the target material, the arc being characterized by ...
12/17/1985
4559125Apparatus for evaporation arc stabilization during the initial clean-up of an arc target
Apparatus and method for evaporation arc stabilization including a target having a surface of material to be evaporated; circuitry for establishing an arc on the target surface for evaporating the target material, the arc being characterized by the presen...
12/17/1985
4461688Magnetically enhanced sputtering device having a plurality of magnetic field sources including improved plasma trapping device and method
A magnetron sputtering device wherein a plurality of magnetic field sources are employed to enhance uniformity of cathode sputtering. Each of the magnetic field sources is independently capable of establishing a discharge at the cathode if the other magne...
07/24/1984
4434038Sputtering method and apparatus utilizing improved ion source
Method and apparatus for sputtering an element with a magnetron plasma source where a plasma is formed between two generator cathode surfaces of the source and a generator anode disposed adjacent the plasma ejects it toward the element to be sputtered. Va...
02/28/1984
4431505High rate magnetron sputtering of high permeability materials
A magnetron sputtering apparatus for high permeable materials where the target may include first and second elements separated from one another by a gap and the magnetic field source preferably exceeds 1000 gauss adjacent a pole thereof. The source is pre...
02/14/1984
4430184Evaporation arc stabilization
Apparatus and method for evaporation arc stabilization including a target having a surface of material to be evaporated; circuitry for establishing an arc on the target surface for evaporating the target material, the arc being characterized by the presen...
02/07/1984
4391697High rate magnetron sputtering of high permeability materials
Apparatus for sputtering a target including at least first and second elements spaced from one another by a gap; a plasma generator disposed in the gap; and a trapping magnetic field which confines at least some of the plasma adjacent the target where the...
07/05/1983
4361472Sputtering method and apparatus utilizing improved ion source
Method and apparatus for sputtering an element with a magnetron plasma source where a plasma is formed between two electrostatic field defining surfaces of the source and a generator anode disposed adjacent the plasma ejects it toward the element to be sp...
11/30/1982
4303489Method and apparatus for producing a variable intensity pattern of sputtering material on a substrate
Method and apparatus for producing a variable intensity pattern of sputtering material on a substrate by providing a mask having a patterned opening therein between the cathode of a sputtering device and the substrate to be coated, the mask being so posit...
12/01/1981
4265729Magnetically enhanced sputtering device
A magnetically enhanced sputtering device including magnet means for establishing a magnetic field where the lines of force thereof extend over and may pass through the cathode sputtering surface at one predetermined area thereof. Preferably, the majority...
05/05/1981
4239611Magnetron sputtering devices
A magnetically enhanced sputtering device including first magnet means for establishing a magnetic field where the lines of force thereof extend over and may pass through the cathode sputtering surface at one predetermined area thereof. The first magnet m...
12/16/1980
4180450Planar magnetron sputtering device
In a planar magnetron sputtering device including a cathode of target material having a planar sputtering surface, at least a portion of which is disposed about a center line perpendicular to said surface, an anode adapted for establishing an accelerating...
12/25/1979
4162954Planar magnetron sputtering device
A planar magnetron sputtering device where the magnetic lines of force pass through the center of the planar cathode at angles of 45° or less with respect to the planar surface of the cathode to thereby promote uniformity of cathode erosion. The magnetic...
07/31/1979
 
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