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A vest or belt is integrally formed with tubular, pet receiving passageways which extend around the wearer's body and terminate in pocket-like chambers for feeding and retrieval.
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| Number | Title | Issue Date |
| 7241675 | Attachment of integrated circuit structures and other substrates to substrates with vias Vias (210, 210B) are formed in a surface of a substrate. At least portions of contact pads (139, 350) are located in the vias. Contact pads (150, 340) of an integrated circuit structure are inserted into the vias and attached to the contact pads... | 07/10/2007 |
| 7241641 | Attachment of integrated circuit structures and other substrates to substrates with vias Vias (210, 210B) are formed in a surface of a substrate. At least portions of contact pads (139, 350) are located in the vias. Contact pads (150, 340) of an integrated circuit structure are inserted into the vias and attached to the contact pads... | 07/10/2007 |
| 7186586 | Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities A packaging substrate (310) includes a semiconductor interposer (120) and at least one other intermediate substrate (110), e.g. a BT substrate. The semiconductor interposer has first contact pads (136C) attachable to dies (124) abo... | 03/06/2007 |
| 7179397 | Plasma processing methods and apparatus To move an article in and out of plasma during plasma processing, the article is rotated by a first drive around a first axis, and the first drive is itself rotated by a second drive. As a result, the article enters the plasma at different angles for different posit... | 02/20/2007 |
| 7104579 | Detection and handling of semiconductor wafers and wafer-like objects An end effector has one or more vortex chucks to support a wafer, and at least two detectors for detecting different portions of the wafer before the wafer is picked up. If one of the detectors detects a wafer and the other one does not, an alarm is generated to ale... | 09/12/2006 |
| 7052229 | Alignment of semiconductor wafers and other articles A wafer or some other article is aligned while being held by an end-effector. ... | 05/30/2006 |
| 6639303 | Integrated circuits and methods for their fabrication To fabricate back side contact pads that are suitable for use in a vertical integrated circuit, vias are made in the face side of a wafer, and dielectric and contact pad metal are deposited into the vias. Then the wafer back side is etched until the metal... | 10/28/2003 |
