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Assignee: Toyoda Gosei Co., Ltd.


Location: Nishikasugai, JP
No. of patents: 517

1                      
NumberTitleIssue Date
7894931Method and apparatus for prediction of amount of deformation due to shrinkage of molded article
The method of predicting the amount of deformation due to shrinkage of a molded article of the present invention finds a support point P of the bending moment M from a distribution of shrinkage rates of a molding material forming a molded article 10 and uses ...
02/22/2011
7722076Knee airbag device
A knee airbag device includes a knee airbag that is disposed in a folded state inside a steering column cover inside which a projection body that projects downward toward one side in a vehicle-width direction is disposed in a rear area, and a cylindrical inflator th...
05/25/2010
7424899Hollow-weave airbag
A hollow-weave airbag is constituted of a bag portion (11) with a 1/1 bag structure, and a closed portion (12) that has two or more weave structures and adjoins the bag portion 11. In addition, the closed portion (12) is constituted of, i...
09/16/2008
7157746Light emitting device having a divalent-europium-activated alkaline earth metal orthosilicate phosphor
The light emitting device has a light emitting diode which is made of a nitride semiconductor and a phosphor which absorbs a part of lights emitted from the light emitting diode and emits different lights with wavelengths other than those of the absorbed lights. The...
01/02/2007
7111964LED package
An LED package has a light emitting element, a first optical section that is disposed around the light emitting element, and a second optical section that is disposed around the first optical while being separated from the first optical section. A gap is formed betw...
09/26/2006
7096873Method for manufacturing a group III nitride compound semiconductor device
A method for manufacturing a group III nitride compound semiconductor device includes irradiating a surface of a wafer with ultraviolet rays to thereby clean a resist residue from the surface of the wafer, the surface including a group III nitride compound semicondu...
08/29/2006
7014901Skin and manufacturing method thereof, manufacturing method of skin for air bag door and air bag door
The present invention intends to provide an air bag door construction in which the air bag develops smoothly and securely, the skin can be easily produced with small man-hour, and which is excellent in the surface appearance. The skin 50 is formed by a...
03/21/2006
6965126Light-emitting element
In a light-emitting element in which an n-type layer of a Group III nitride compound semiconductor, a light-emitting layer of a Group III nitride compound semiconductor and a p-type layer of a Group III nitride compound semiconductor are laminated successively on a ...
11/15/2005
6956245Group III nitride compound semiconductor light-emitting element
A Group III nitride compound semiconductor light-emitting element has a reflecting surface on a side opposite to a main light-emitting surface of the element viewed from a light-emitting layer. The reflecting surface is inclined to surfaces of growth of semiconducto...
10/18/2005
6946788Light-emitting element
A light-emitting element has a light-emitting layer and at lease one light-extracting portion. At least a partial part of the light-extracting portion is formed into a concave or convex surface for enhancing the efficiency of extracting light. Another light-emitting...
09/20/2005
6943380Light emitting device having phosphor of alkaline earth metal silicate
The light emitting device has a light emitting diode which is made of a nitride semiconductor and a phosphor which absorbs a part of lights emitted from the light emitting diode and emits different lights with wavelengths other than those of the absorbed lights. The...
09/13/2005
6932880Method of manufacturing optical waveguide device
Transparent parallel planar plates which are members for retaining an optical waveguide are provided erectly in an optical path of light in a transparent vessel in advance. An optical fiber is fixed into the transparent vessel while the optical fiber penetrates the ...
08/23/2005
6925100Communication device
In an LED, the area of contact between an ohmic electrode formed on a contact layer and the contact layer serves as an effective light-emitting area of a light-emitting layer. Therefore, while the area of contact between the ohmic electrode and the contact layer is ...
08/02/2005
6925233Optical waveguide device manufacturing jig, method of manufacturing optical waveguide device by use of the same jig, and the same optical waveguide device
Interference filters which are optical components are erected in advance on optical paths in a transparent container, and the transparent container is filled with a photo-curable resin solution. Further, a jig is prepared for manufacturing an optical waveguide devic...
08/02/2005
6921923Group III nitride compound semiconductor device
An InGaN layer is formed on an undercoat layer of the same composition as the InGaN layer. The composition of the undercoat layer may be changed continuously or stepwise. ...
07/26/2005
6918961Group III nitride compound semiconductor device and producing method therefor
A group III nitride compound semiconductor device has a substrate and an AlN single crystal layer formed on the substrate. The AlN single crystal layer has a thickness of from 0.5 to 3 μm and has a substantially flat surface. The half-value width of an X-ray rockin...
07/19/2005
6908220Vehicle lamp
A vehicle rear lamp including first light-emitting device emitting a red light, and second light-emitting device emitting a light different from the red light, preferably blue or green, wherein the first and second light-emitting devices are provided in a region for...
06/21/2005
6900587Light-emitting diode
In an LED, when electric power is supplied to a blue light-emitting element through a pair of leads, light is emitted upward from an upper surface of the blue light-emitting element and, at the same time, light is radiated from side and lower surfaces of the blue li...
05/31/2005
6889456Illumination apparatus
An LED light source is received in a groove portion provided in a light guide plate. The groove portion is covered with a base member, and the circumferential edge of the base member is bonded to the light guide plate. Concave portions or convex portions having desi...
05/10/2005
6861663Group III nitride compound semiconductor light-emitting device
A buffer layer of aluminum nitride (AlN) about 25 nm thick is provided on a sapphire substrate. An n+ layer of a high carrier density, which is about 4.0 μm thick and which is made of GaN doped with silicon (Si), is formed on the buffer layer. An interme...
03/01/2005
6835966Method for manufacturing gallium nitride compound semiconductor
An Al0.15Ga0.85N layer 2 is formed on a silicon substrate 1 in a striped or grid pattern. A GaN layer 3 is formed in regions A where the substrate 1 is exposed and in regions B which are defined above the layer 2....
12/28/2004
6824290Illumination device
An illumination device is composed by arranging a shutter member on a light emitting side of an LED light source, capable of changing a condition of light illuminating the outside when a position or the shutter member is changed by slide or rotation. ...
11/30/2004
6821800Semiconductor light-emitting device and manufacturing method thereof
In a method of manufacturing a semiconductor light-emitting device involving the steps of: forming a first semiconductor layer; forming a light-emitting layer of superlattice structure by laminating a barrier layer being made of InY1Ga1-Y1N (Y1...
11/23/2004
6800685Polyester resin composition for engine peripheral parts
The present invention provides a polyester resin composition for engine peripheral parts, the resin composition comprising at least one polymer selected from the group consisting of polyethylene terephthalate and an ethylene terephthalate copolymer; an inorganic rei...
10/05/2004
6794690Group III nitride compound semiconductor light-emitting element
A Group III nitride compound semiconductor light-emitting element (flip chip type light-emitting element) provided with a p-side electrode and an n-side electrode formed on one surface side, wherein the p-side electrode includes: a first metal layer containing Ag an...
09/21/2004
6781648Liquid-crystal display device
A light source in a backlight portion is composed of red LEDs, green LEDs, and blue LEDs. The numbers of respective kinds of LEDs used are selected so that the number of blue LEDs is not smaller than the number of red LEDs and the number of blue LEDs is not smaller ...
08/24/2004
6777805Group-III nitride compound semiconductor device
An object of the present invention is to provide a large-size light-emitting device from which uniform light emission can be obtained. That is, in the present invention, in a device having an outermost diameter of not smaller than 700 μm, a distance from an ...
08/17/2004
6777453Method of reclaiming crosslinked rubber, and molded article of reclaimed rubber
The object of the present invention is to provide a method of reclaiming crosslinked rubber wherein a reduction of qualities due to generation of decomposed products hardly occurs, and a molding of reclaimed rubber. In a reclamation step of reclaiming crossli...
08/17/2004
6762070Method of manufacturing group III nitride compound semiconductor light emitting device having a light emission output of high light intensity
A cap layer of GaN about 140 Å thick and a p-type clad layer of Mg-doped p-type AlxGa1-xN (x=0.12) about 200 Å thick are formed successively on an MQW active layer about 230 Å thick. A p-type contact layer of Mg-doped p-type Aly
07/13/2004
6734468Devices related to electrode pads for p-type group III nitride compound semiconductors
An electrode pad for a Group III nitride compound semiconductor having p-type conduction includes a triple layer structure having first, second, and third metal layers, formed on an electrode layer. A protection film with a window exposing a central portion of the t...
05/11/2004
6717355Light-emitting unit
A light-emitting device with an emission wavelength range of from 360 nm to 550 nm and a fluorescent material made of Ca—Al—Si—O—N oxynitride activated with Eu2+ are used so that a part of light emitted from the light-emitting device is emitted wh...
04/06/2004
6623998Method for manufacturing group III nitride compound semiconductor device
A method of manufacturing a group III nitride compound semiconductor device, includes providing a substrate, forming a group III nitride compound semiconductor layer having a device function, and forming an undercoat layer between the substrate and the gr...
09/23/2003
6617668Methods and devices using group III nitride compound semiconductor
A layer comprising silicon oxide (SiO2) is formed on (111) plane of a silicon (Si) substrate in a striped pattern which is longer in the [1-10] axis direction perpendicular to the [110] axis direction. Then a group III nitride compound semicond...
09/09/2003
6617061Group III nitride compound semiconductor device and group III nitride compound semiconductor light-emitting device
A clad layer is provided as a multilayer structure made of an alternate laminate of 20 layers of Al0.2 Ga0.8 N 50 nm thick and 20 layers of Ga0.99 In0.01 N 20 nm thick. The clad layer about 1.4 μm thick has a l...
09/09/2003
6617787Light-emitting system with alicyclic epoxy sealing member
An alicyclic epoxy resin is used as a material for forming a member for sealing a Group III nitride compound semiconductor light-emitting device....
09/09/2003
6589808GaN type semiconductor device
A GaN type semiconductor layer having a new structure is provided which incorporates a substrate having surface which is opposite to a GaN type semiconductor layer and which is made of Ti....
07/08/2003
6583550Fluorescent tube with light emitting diodes
A fluorescent tube is constituted by a fluorescent tubular body having a transparent glass tube coated with a fluorescent layer containing a fluorescent material on its inner surface, and an ultraviolet LED substrate inserted in the fluorescent tubular bo...
06/24/2003
6580098Method for manufacturing gallium nitride compound semiconductor
An Al0.15 Ga0.85 N layer 2 is formed on a silicon substrate 1 in a striped or grid pattern. A GaN layer 3 is formed in regions A where the substrate 1 is exposed and in regions B which are defined above the layer 2. At this time, the...
06/17/2003
6570186Light emitting device using group III nitride compound semiconductor
A wafer comprising a semiconductor layer formed on a substrate is diced on the back surface of the substrate to a depth of about 3/4 thickness of the substrate. Thus a separation groove 21 is formed in a direction of a dicing line. A groove 22 is formed a...
05/27/2003
6550940Lighting device
A lighting device has an LED light source and a lens. The lens includes a light emitting surface arranged substantially parallel to a wall of a container when the device is attached to the wall, and a first light receiving surface. The first light receivi...
04/22/2003
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