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| Number | Title | Issue Date |
| 5830389 | Electrically conductive compositions and methods for the preparation and use thereof Electrically conductive adhesive compositions and methods for the preparation and use thereof, in which a solder powder, a chemically protected cross-linking agent with fluxing properties and a reactive monomer or polymer are the principal components. Dep... | 11/03/1998 |
| 5716663 | Multilayer printed circuit Methods for fabricating single and multilayer printed boards which employ electronically conductive adhesive compositions are provided. The composition comprises a solder powder, a chemically protected cross-linking agent with fluxing properties and a rea... | 02/10/1998 |
| 5565267 | Composite substrates for preparation of printed circuits Substrates for printed circuit boards and the like, in the form of a substrate base layer and at least one adherent layer fixedly attached thereto. The adherent layer preferably comprises a thermoplastic material having a glass transition temperature in t... | 10/15/1996 |
| 5538789 | Composite substrates for preparation of printed circuits Substrates for printed circuit boards and the like, in the form of a substrate base layer and at least one adherent layer fixedly attached thereto. The adherent layer preferably comprises a thermoplastic material having a glass transition temperature in t... | 07/23/1996 |
