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| Number | Title | Issue Date |
| 5677235 | Method for forming silicon film A number of semiconductor wafers are retained in a wafer boat such that the wafers are disposed at intervals in the vertical direction. The wafer boat is loaded into a process tube of a vertical type thermal processing apparatus. The inside of the process... | 10/14/1997 |
| 5655871 | Device for transferring plate-like objects A plate-like object carrier device comprising plural arms arranged at a same pitch interval to horizontally support a wafer on each of the arms, a first motor for driving a single arm forward and backward and independently of a group of arms, a second mot... | 08/12/1997 |
| 5645391 | Substrate transfer apparatus, and method of transferring substrates In a vertical heat treatment apparatus, a transfer apparatus is used to transfer a wafer between a wafer carrier and a wafer boat. The transfer apparatus comprises a base unit, a fork, three non-contact type sensors, and a main controller. The base unit c... | 07/08/1997 |
| 5626456 | Transfer device A wafer transfer device for transferring wafers between a wafer boat having a plurality of ring-shaped support plates arranged one above another, and a cassette capable of supporting semiconductor wafers at different levels. The support plates have a hole... | 05/06/1997 |
| 5611863 | Semiconductor processing apparatus and cleaning method thereof An ECR plasma CVD apparatus includes a plasma generation chamber to which a microwave and a plasma source gas are introduced. An excitation solenoid is arranged around the plasma generation chamber to form an electron cyclotron resonance magnetic field wi... | 03/18/1997 |
| 5593608 | Temperature control method and apparatus for use in thermal processing equipment A method for controlling temperature in thermal processing equipment having a processing chamber containing members to be processed. The method comprises the steps of heating a plurality of zones of the processing chamber by heaters provided in the zones,... | 01/14/1997 |
| 5562387 | Device for transferring plate-like objects A plate-like object carrier device comprising plural arms arranged at a same pitch interval to horizontally support a wafer on each of the arms, a first motor for driving a single arm forward and backward and independently of a group of arms, a second mot... | 10/08/1996 |
| 5556275 | Heat treatment apparatus A heat treatment apparatus comprising a holder, a hollow cylindrical cover, a flat plate, and a processing chamber. The holder holds disk-shaped objects, each having an orientation flat portion at circumference. The objects are arranged coaxially and spac... | 09/17/1996 |
| 5540098 | Transfer device A transfer device an ultrasonic sensor having an oscillating section for oscillating an ultrasonic beam toward wafers which are horizontally arranged in a carrier and a receiving section for receiving a reflected ultrasonic wave, and driving mechanism for... | 07/30/1996 |
| 5533243 | Notch position aligning apparatus and process for using the apparatus to independently align individual wafers in a wafer cassette According to this invention, there is provided a notch position aligning mechanism and a process for using the mechanism including a base which can be vertically movably inserted into a cassette through a lower opening of the cassette for storing a plural... | 07/09/1996 |
| 5514196 | Air cleaning apparatus An air cleaning apparatus includes an air passage chamber having a suction port, from which air is sucked, and a discharge port from which the air sucked from the suction port is discharged, an air blower, provided in the air passage chamber, for sucking ... | 05/07/1996 |
| 5503875 | Film forming method wherein a partial pressure of a reaction byproduct in a processing container is reduced temporarily A film is formed on a substrate by supplying a plurality of processing gases into a processing container and forming the film on the substrate from the processing gases while exhausting a portion of the gases out of the processing container. Before a part... | 04/02/1996 |
| 5468112 | Wafer container and wafer aligning apparatus A container for storing a plurality of semiconductor wafers comprises two end walls and two side walls. The container has a main opening through which the wafers are inserted into or withdrawn from the container and a sub-opening through which a wafer cou... | 11/21/1995 |
| 5459943 | Air cleaning apparatus An air cleaning apparatus according to the present invention includes an apparatus body having a suction port through which air in a processing space is sucked and a discharge port through which the air sucked through the suction port is discharged into t... | 10/24/1995 |
| 5447294 | Vertical type heat treatment system A vertical heat treatment system for heat treating a large number of semiconductor wafers housed in a boat at once includes a heat treatment unit having a boat loading/unloading port, a boat section communicating with the heat treatment unit through the b... | 09/05/1995 |
| 5441076 | Processing apparatus using gas A vertical heat treatment apparatus includes a heat treatment unit for performing a heat treatment process to a semiconductor wafer using a gas and a gas supply unit for supplying the gas to the heat treatment unit. The gas supply unit includes a pluralit... | 08/15/1995 |
| 5415585 | Decompression apparatus A decompression apparatus comprises an exhaust line connected to a processing unit, an exhaust device connected to the exhaust line, whereby the processing unit is exhausted through the exhaust line, and an ambience in the processing unit can be set under... | 05/16/1995 |
| 5383984 | Plasma processing apparatus etching tunnel-type A substrate processing apparatus comprising a process tube for enclosing a plurality of semiconductor wafers, injectors for introducing process gas into the process tube, a vacuum pump for exhausting the process tube, RF electrodes arranged along the oute... | 01/24/1995 |
| 5324540 | System and method for supporting and rotating substrates in a process chamber A system for supporting and rotating substrates in a process chamber comprising a first exhaust vacuum pump for exhausting the process chamber, a shaft vertically extending into the process chamber to support wafers in it, bearings for supporting the shaf... | 06/28/1994 |
| 5296412 | Method of heat treating semiconductor wafers by varying the pressure and temperature A wafer boat on which semiconductor wafers are placed is inserted into a process tube, and a process gas is supplied into the process tube to perform heat treating. In this case, prior to the heat treating, the process tube is evacuated to have a pressure... | 03/22/1994 |
