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| Number | Title | Issue Date |
| 8183062 | Creating metal gate structures using Lithography-Etch-Lithography-Etch (LELE) processing sequences The invention can provide apparatus and methods of creating metal gate structures on wafers in real-time using Lithography-Etch-Lithography-Etch (LELE) processing sequence. Real-time data and/or historical data associated with LELE processing sequences can be fed fo... | 05/22/2012 |
| 8173357 | Method of forming etching mask, etching method using the etching mask, and method of fabricating semiconductor device including the etching method The method of forming an etching mask includes: forming a mask layer on an object layer that is to be etched, to form an etching mask used in etching the object layer; forming a first mask layer on the mask layer, the first mask layer having a first pattern that is ... | 05/08/2012 |
| 8171880 | Microwave plasma processing apparatus and method of supplying microwaves using the apparatus A microwave plasma processing apparatus performs plasma processing on a substrate by exciting a gas by electric field energy of microwaves emitted from a radial line slot antenna (RLSA). The microwave plasma processing apparatus includes: a processing container in w... | 05/08/2012 |
| 8170833 | Transforming metrology data from a semiconductor treatment system using multivariate analysis Metrology data from a semiconductor treatment system is transformed using multivariate analysis. In particular, a set of metrology data measured or simulated for one or more substrates treated using the treatment system is obtained. One or more essential variables f... | 05/01/2012 |
| 8168377 | Pattern forming method and method of manufacturing semiconductor device by using the same The pattern forming method includes forming a catalyst film on a base layer having an uneven surface, wherein the catalyst layer is formed along the uneven surface of the base layer; forming a coating film by coating a fluid material on the catalyst film; forming an... | 05/01/2012 |
| 8129775 | Semiconductor device and method of manufacturing the same The semiconductor device has a stacked structure in which a tunnel oxide layer, a charge trapping layer, a blocking oxide layer, and a gate electrode are sequentially formed on a silicon substrate, wherein the blocking oxide layer includes a crystalline layer dispos... | 03/06/2012 |
| 8129080 | Variable resist protecting groups A method and system for patterning a substrate using a dual-tone development process is described. The method and system comprise using a resist material having a polymer backbone with a plurality of protecting groups attached thereto to improve process latitude and... | 03/06/2012 |
| 8124484 | Forming a MOS memory device having a dielectric film laminate as a charge accumulation region To manufacture a MOS memory device having a dielectric film laminate in which adjacent dielectric films have band-gaps of different magnitudes, a plasma processing device which transmits microwaves to a chamber by means of a planar antenna having a plurality of hole... | 02/28/2012 |
| 8108805 | Simplified micro-bridging and roughness analysis The invention provides apparatus and methods for processing substrates using pooled statistically based variance data. The statistically based variance data can include Pooled Polymer De-protection Variance (PPDV) data that can be used to determine micro-bridging de... | 01/31/2012 |
| 8107073 | Diffraction order sorting filter for optical metrology A zoned order sorting filter for a spectrometer in a semiconductor metrology system is disclosed with reduced light dispersion at the zone joints. The order sorting filter comprises optically-transparent layers deposited underneath, or on top of thin-film filter sta... | 01/31/2012 |
| 8097402 | Using electric-field directed post-exposure bake for double-patterning (D-P) The invention provides a method of processing a substrate using Double-Patterning (D-P) processing sequences and Electric-Field Enhanced Layers (E-FELs). The D-P processing sequences and E-FELs can be used to create lines, trenches, vias, spacers, contacts, and gate... | 01/17/2012 |
| 8091863 | Gate valve and semiconductor manufacturing apparatus A gate valve of a semiconductor manufacturing apparatus, which is formed between a processing chamber in which processing is performed and a transfer chamber which carries a substrate on which the processing is performed, includes a gate valve at a side of the proce... | 01/10/2012 |
| 8069704 | Sealing structure of plasma processing apparatus, sealing method, and plasma processing apparatus including the sealing structure A gate valve corresponding to the sealing structure seals an opening of a plasma generation chamber and includes a valve body, a valve stem, and ring-shaped first and second sealing members that seal a gap between the valve body and the plasma generation chamber. Th... | 12/06/2011 |
| 8025473 | Carrying system, substrate treating device, and carrying method A carrying system 1 has a carrying path which is laid out in such a manner as to pass through the lower sides of loading table 11 and the like provided at the front face side of treating devices 10, 100, 200, and covered by a cover 5. As ... | 09/27/2011 |
| D645486 | Dielectric window for plasma processing device | 09/20/2011 |
| 7994562 | Memory apparatus The memory apparatus includes a memory device including a gate insulating layer formed on a silicon substrate by sequentially stacking a tunnel oxide layer, a charge trap layer, and a block oxide layer in this order, on the silicon substrate. In addition, a gate ele... | 08/09/2011 |
| 7977609 | Temperature measuring device using oscillating frequency signals This invention provides a wafer-type temperature sensor capable of eliminating the need for an A/D converter, adapting itself to automation and improving the heat resistance to measure temperature distribution of the upper surface of a wafer, a temperature measuring... | 07/12/2011 |
| 7968472 | Film forming method and film forming apparatus The invention includes inserting an object to be processed into a processing vessel, which can be maintained vacuum, and making the processing vessel vacuum; performing a sequence of forming a ZrO2 film on a substrate by alternately supplying zirconium so... | 06/28/2011 |
| 7941295 | Manufacturing apparatus, information processing method, and program Provided is a manufacturing apparatus for appropriately managing information about parts of the manufacturing apparatus. The manufacturing apparatus includes: a parts identification information receiving unit receiving parts identification information used to identi... | 05/10/2011 |
| 7924422 | Calibration method for optical metrology A zoned order sorting filter for a spectrometer in a semiconductor metrology system is disclosed with reduced light dispersion at the zone joints. The order sorting filter comprises optically-transparent layers deposited underneath, or on top of thin-film filter sta... | 04/12/2011 |
| 7923665 | Temperature measuring device and method for measuring wafer-type thermometers An object of the present invention is to provide a wafer-type thermometer capable of adapting itself to automation and improving the heat resistance to measure temperature distribution of a wafer and a method for manufacturing the wafer-type thermometer. A plurality... | 04/12/2011 |
| 7891090 | Method for manufacturing an interposer A method for manufacturing an interposer including a body and a plurality of probes connected to said body is disclosed. The method includes a step of manufacturing said body including the sub-steps of preparing a first substrate having one surface side and the othe... | 02/22/2011 |
| 7871908 | Method of manufacturing semiconductor device The method of manufacturing a semiconductor device comprising: forming a first hard mask layer and a second hard mask layer on the layer to be etched (S11); a first groove-forming mask pattern forming process for forming a groove-forming mask pattern which ha... | 01/18/2011 |
| 7866038 | Through substrate, interposer and manufacturing method of through substrate A through substrate which comprises a silicon substrate (10) having a through hole (19) penetrating a front surface (11) and a back surface (12), a oxidized silicon film (13) being provided along the inner wall surface of the throu... | 01/11/2011 |
| 7796544 | Method and system for providing an analog front end for multiline transmission in communication systems A method and system for providing an analog front end for multiline transmission in communications systems are described. A transceiver circuit (1100) is configured to reduce line noise by providing a coupled transmitter (1106), receiver (1106),... | 09/14/2010 |
| 7777510 | Wafer inspecting apparatus, wafer inspecting method and computer program There is provided a wafer inspecting apparatus which reduces a preheating time of a probe, and prevents the probe and a wafer from being damaged. The apparatus has a stage (10) which allows a semiconductor wafer (W) to be mounted on a top face thereof and hea... | 08/17/2010 |
| 7692435 | Probe card and probe device for inspection of a semiconductor device The probe card is configured such that the outline of the probe card is formed almost round shape and a plurality of connectors for being electrically connected with a tester are provided on the upper surface thereof along the outline. A substrate with many probes a... | 04/06/2010 |
| 7692434 | Probe and method for fabricating the same A probe needle 20 includes a cantilever 21, a column 22 and a tip 23. The column 22 is cantilevered from an end of the cantilever 21. The tip 23 is formed on a top end of the column 22. The column 22 is ... | 04/06/2010 |
| 7679385 | Probe card for inspecting electric properties of an object In the present invention, an inspection contact structure is attached to a lower surface side of a circuit board of a probe card. The inspection contact structure has a silicon substrate, and sheets attached to upper and lower surfaces of the silicon substrate. Each... | 03/16/2010 |
| 7649369 | Probe and method of manufacturing probe In accordance with an increase in speed, a wiring structure has rapidly become more microscopic and thinner and a wiring layer has become extremely thin, and therefore, giving a contact load to a probe for the inspection as has been conventionally done causes damage... | 01/19/2010 |
| 7646581 | Electrostatic chuck An electrostatic chuck capable of widening a temperature range and reducing a variation in thermal conductivity between the electrostatic chuck and the flat substrate over time is provided. The chuck includes: a body that has an internal electrode for attracting a f... | 01/12/2010 |
| 7628931 | Processing method for conservation of processing gases In order to facilitate control of a circulating gas, in a processing apparatus 100 having a showerhead 200 for supplying a processing gas into a processing chamber via a plurality of gas supply holes, a turbo pump 120 for evacuating the processi... | 12/08/2009 |
| 7622390 | Method for treating a dielectric film to reduce damage A method of treating a dielectric layer on a substrate is described. The method comprises forming the dielectric layer on the substrate, wherein the dielectric layer comprises a dielectric constant value less than the dielectric constant of SiO2. A featur... | 11/24/2009 |
| 7619870 | Electrostatic chuck An electrostatic chuck device includes an electrostatic chuck section including a substrate and a power supply terminal for applying a DC voltage to an electrostatic-adsorption inner electrode; and a metal base section fixed to the other main surface of the electros... | 11/17/2009 |
| 7619731 | Measuring a damaged structure formed on a wafer using optical metrology A method of measuring a damaged structure formed on a semiconductor wafer using optical metrology includes directing an incident beam on the damaged structure. A diffracted beam is received from the damaged structure. The received diffracted beam is processed to det... | 11/17/2009 |
| 7619424 | Probe needle, method for manufacturing the probe needle and method for constructing a three-dimensional structure A method for manufacturing a probe needle having beams and a contactor placed on tips of the beams comprises preparing a Si wafer 20, forming a seed layer 21 on the Si wafer 20, and forming grooves in a desired shape of the beams on the seed lay... | 11/17/2009 |
| 7604701 | Method and apparatus for removing external components from a process chamber without compromising process vacuum An access assembly for a process chamber, including a wall segment constructed and arranged to access the process chamber, a mounting assembly constructed and arranged to couple the wall segment to the process chamber, and a sealing plate mounted to the process cham... | 10/20/2009 |
| 7602203 | Probe and probe card An object of the present invention is to make it possible that a probe for testing electrical characteristics of an object to be tested is easily attached to a support member such as a contactor. A through hole is formed in the contactor. In the probe, a fitting/loc... | 10/13/2009 |
| 7601242 | Plasma processing system and baffle assembly for use in plasma processing system The present invention presents a baffle assembly located in a plasma processing system, comprising a baffle carrier attached to the plasma processing system, and at least two baffle inserts having a plurality of passages therethrough, the at least two baffle inserts... | 10/13/2009 |
| 7591923 | Apparatus and method for use of optical system with a plasma processing system A plasma processing system and method for operating an optical system in conjunction with a plasma processing system are provided. The plasma processing system includes an optical system in communication with a plasma processing chamber of the plasma processing syst... | 09/22/2009 |
