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Assignee: Tokyo Electron FE Limited


Location: Tokyo, JP
No. of patents: 62

1    
NumberTitleIssue Date
7445689Substrate processing method and substrate processing system
The substrate processing system has an ozone generator that generates and supplies an ozone-containing gas to plural or N (N is a natural number not less than 2) ozone process units. The ozone generator has capacity of supplying the first processing fluid to only Nâ...
11/04/2008
7419316Developing treatment apparatus
A developing treatment apparatus for performing a developing treatment for a substrate, includes a substrate holding member for holding the substrate; an outer peripheral plate surrounding an outer peripheral portion of the substrate to form a gap between the plate ...
09/02/2008
7419550Oxidizing method and oxidizing unit of object for object to be processed
An oxidizing method for includes: an arranging step of arranging a plurality of objects to be processed in a processing container whose inside can be vacuumed, a supplying unit of an oxidative gas being provided at one end of the processing container, a plurality of...
09/02/2008
7419613Method and device for plasma-etching organic material film
A support electrode (2) and a counter electrode (16) constituting parallel plate electrodes are disposed in a process vessel (1). A substrate (W) with an organic material film formed thereon is supported by the support electrode (2). A hi...
09/02/2008
7416405Vertical type of thermal processing apparatus and method of using the same
A vertical type of thermal processing apparatus of the present invention includes a thermal processing furnace having a furnace opening at a lower portion thereof. A boat holding objects to be processed in a tier-like manner in a vertical direction is adapted to be ...
08/26/2008
7416632Substrate processing apparatus and substrate processing method
A substrate processing apparatus and a substrate processing method are provided wherein an oxide film which is thinner than the conventional films can be formed with uniform thickness when forming an oxide film on the front-side surface of a substrate. A subs...
08/26/2008
7416978Film forming method, film forming system and recording medium
After silicon nitride films have been formed on wafers by a film forming process in a reaction vessel, the reaction vessel is processed by a purging process specified by a purging recipe and compatible with the film forming process to suppress production of gases an...
08/26/2008
7412981Liquid processing apparatus and method
A liquid processing apparatus includes containers 26, 27, 26a, 26b surrounding processing chambers 51, 52 for accommodating a plurality of wafers W and nozzles 54, 56 for supplying a processing liquid to the substrates W in ...
08/19/2008
7410543Substrate processing method
Resists can be removed while metal contamination of wafers, etc. and generation of particles, and growth of oxide films are suppressed. A substrate processing method comprises feeding a processing gas, such as ozone gas, into a processing vessel to pressurize an atm...
08/12/2008
7410923SiC material, semiconductor device fabricating system and SiC material forming method
A highly corrosion-resistant SiC material is formed on a base body by a CVD process. The SiC material contains β-SiC crystals so oriented that the ratio of the sum of peak intensities of x-ray diffraction for (220) and (311) planes of the β-Sic csystals to the sum...
08/12/2008
7404407Substrate processing apparatus
The substrate processing apparatus has an enclosure structure enclosing a substrate support member to define a processing space. The enclosure structure has an opening closed by a shutter. A processing fluid supply unit, which supplies processing fluid, such as chem...
07/29/2008
7404409Substrate processing system and substrate processing method
A substrate processing system includes a substrate transfer unit having a plural-wafer conveyer that transfers plural wafers collectively and a single wafer conveyer that transfers a single wafer at a time. The single-wafer conveyer is accessible to the plural-wafer...
07/29/2008
7403260Coating and developing system
The coating and developing system carries a substrate delivered to a carrier handling block to a processing block to form a film on the substrate by a coating block included in the processing block, carries the substrate through an interface block to the exposure sy...
07/22/2008
7401988Substrate processing apparatus and substrate processing method
On top of respective areas divided by partition plates, that is, a cassette station, a processing station, and an interface section in a coating and developing processing system, gas supply sections for supplying an inert gas into the respective areas are provided. ...
07/22/2008
7393172Untreated body transfer device and semiconductor manufacturing device with the untreated body transfer device
In a wafer transfer system wherein a wafer transfer robot linearly reciprocates by a linear motor, dust is prevented from adhering to a wafer. A fixed base 9, on which the secondary side 11 of a linear motor M for linearly reciprocating a wafer ...
07/01/2008
7387131Processing apparatus and substrate processing method
A substrate processing apparatus for processing a substrate With a processing fluid is provided. The apparatus includes holding members 60 for holding the substrate W, a chuck member 61 for supporting the holding members 60 and a top-face member...
06/17/2008
7376490Operational control device, operational control method, program and storage medium thereof, for a plurality of power consumption systems
A operational control device for supplying electric power from an electric power equipment to a plurality of power consumption systems store a power consumption pattern for each of the power consumption systems. It obtains a combined expected power consumption patte...
05/20/2008
7364626Substrate processing apparatus and substrate processing method
Substrate cleaning apparatus and method capable of preventing adhesion of particles to a substrate irrespective of being hydrophilic or hydrophobic are provided. Although a cleaning liquid ejected from a two-fluid nozzle 36 rebounds from a cup CP and scatters...
04/29/2008
D564462RF electrode for a process tube of semiconductor manufacturing apparatus
03/18/2008
7341644Method for predicting consumption of consumable part, method for predicting deposited-film thickness, and plasma processor
There is not known a conventional method for predicting the consumed degree of consumable supplies and the thickness of deposited films without opening a processing chamber. A method for predicting the consumed degree of a consumable supply and the thickness ...
03/11/2008
7337792Liquid processing apparatus and liquid processing method
A cleaning apparatus 1 includes a foup loading/unloading part 2 for mounting foups F each accommodating a plurality of wafers W at intervals of a constant pitch (normal pitch), a rotor 34 capable of holding the wafers W at half the normal pitch ...
03/04/2008
7332055Substrate processing apparatus
A substrate processing apparatus is provided. The apparatus includes a plurality of fluid suppliers 61, 61, 63 for supplying different processing fluids. In processing a wafer W, the substrate processing apparatus moves the fluid suppliers 61, 62, 63 a...
02/19/2008
RE40046Processing system
A processing system has an upper electrode with gas discharge holes of a shape corresponding to the external we of insulating members. The insulating members are formed of a poly(ether etherketone) resin, a polyimide resin, a poly(ether imide) resin or the like. Eac...
02/12/2008
7329549Monitoring method of processing state and processing unit
The present invention is a monitoring method of monitoring a change of a processing state of an object to be processed when a predetermined process is conducted to the object to be processed by using a processing unit. The method includes: a step of respectively set...
02/12/2008
RE39969Processing system
A processing system has an upper electrode with gas discharge holes of a shape corresponding to the external we of insulating members. The insulating members are formed of a poly(ether etherketone) resin, a polyimide resin, a poly (ether imide) resin or the like. Ea...
01/01/2008
7314054Liquid processing apparatus with nozzle having planar ejecting orifices
A liquid processing apparatus includes containers 26, 27, 26a, 26b surrounding processing chambers 51, 52 for accommodating a plurality of wafers W and nozzles 54, 56 for supplying a processing liquid to the substrates W in ...
01/01/2008
7313451Plasma processing method, detecting method of completion of seasoning, plasma processing apparatus and storage medium
With analysis data in the prior art, it is difficult to find out if a change regarded as a judgmental standard of the completion of seasoning has come from a change due to the seasoning, namely, change in condition of the interior of a processing container or come f...
12/25/2007
RE39939Processing system
A processing system has an upper electrode with gas discharge holes of a shape corresponding to the external we of insulating members. The insulating members are formed of a poly(ether etherketone) resin, a polyimide resin, a poly (ether imide) resin or the like. Ea...
12/18/2007
7304002Method of oxidizing member to be treated
A method for oxidation of an object to be processed is provided wherein an oxide film can provide favorable film quality and a laminate structure of nitride film and oxide film can be obtained by a thermal oxidation of a nitride film. In a method for oxidatio...
12/04/2007
7304003Oxidizing method and oxidizing unit for object to be processed
An oxidizing method for an object to be processed according to the present invention includes: an arranging step of arranging a plurality of objects to be processed in a processing container whose inside can be vacuumed, the processing container having a predetermin...
12/04/2007
7300598Substrate processing method and apparatus
The invention relates to a process including a chemical liquid treatment and a rinse liquid treatment on a substrate, more particularly to a technique for reducing consumption of a chemical liquid while achieving uniform process and preventing particle generation. I...
11/27/2007
7299566Substrate-placing mechanism having substrate-heating function
The present invention is a substrate-placing mechanism to be provided in a processing container of a substrate-processing apparatus including: a stage having: a base body on which a substrate is placed, a heat-generating body for heating the substrate placed on the ...
11/27/2007
7285498Etching method
An etching method etches an organic film by using an inorganic film as a mask at a high etch rate, in a satisfactory etch profile in a satisfactory in-plane uniformity without causing the inorganic film to peel off. An organic film formed on a workpiece is etched by...
10/23/2007
7284917Coating and developing system and coating and developing method
A coating and developing system is capable of preventing the contamination of a substrate with particles while the same coats a surface of a substrate with a resist film and develops the resist film after the substrate has been processed by immersion exposure. The c...
10/23/2007
7281869Coating and developing system and coating and developing method
A coating and developing system includes a resist film forming unit block and antireflection film forming unit blocks stacked up in layers to form a resist film and an antireflection film underlying the resist film and an antireflection film overlying the resist fil...
10/16/2007
7283890Work convey system, unmanned convey vehicle system, unmanned convey vehicle, and work convey method
There is a jump in the number of devices formed on a single wafer, and it takes a lot of time to inspect a single wafer. In addition, if wafers are inspected every lot, detected wafers remain in staying in a prober until the inspection of all of the wafers is comple...
10/16/2007
7267497Coating and developing system and coating and developing method
A coating and developing system includes a resist film forming unit block and antireflection film forming unit blocks stacked in layers to form a resist film and an antireflection film underlying the resist film and an antireflection film overlying the resist film i...
09/11/2007
7245348Coating and developing system and coating and developing method with antireflection film and an auxiliary block for inspection and cleaning
A coating and developing system includes an auxiliary block, a resist film forming unit block and antireflection film forming unit blocks stacked up in layers to form a resist film and an antireflection film underlying the resist film and an antireflection film over...
07/17/2007
7244335Substrate processing system and substrate processing method
A substrate processing system is provided with an ozone generator capable of generating an ozone-containing gas by discharging electricity in an oxygen-containing gas, and a plurality of processing chambers each capable of holding substrates therein to process the s...
07/17/2007
7240680Substrate processing apparatus
A substrate processing apparatus includes a rotor 45 for rotating a plurality of wafers W paralleled each other at appropriate intervals. While rotating the wafers W by the rotor 45, a chemical liquid is supplied to the wafers W for their processing. T...
07/10/2007
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