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| Number | Title | Issue Date |
| 6073229 | Computer system having a modular architecture A computer system architecture in which functionally compatible electronic components are located on modular printed circuit boards. Thus, a type of processor used by the system can be changed by replacing the printed circuit board incorporating the proce... | 06/06/2000 |
| 6050850 | Electrical connector having staggered hold-down tabs A male connector connects with a female connector to establish an electrical connection. The male and female connectors each include a connector housing having hold-down tabs at opposite ends thereof for securing the connector housing to a substrate. The ... | 04/18/2000 |
| 6031720 | Cooling system for semiconductor die carrier A cooling system for a semiconductor die carrier is disclosed that includes a cooling fan disposed at a substantial distance from a semiconductor die carrier, a cooling duct including an inlet portion and an outlet portion, and a heat exchanger disposed o... | 02/29/2000 |
| 6016256 | Multi-chip module having interconnect dies A multi-chip module includes a housing having insulative side walls and an end plate, conductive leads extending from the side walls, integrated circuit (IC) dies mounted to the end plate, and one or more interconnect dies mounted to the end plate. The en... | 01/18/2000 |
| 5951665 | Interface optimized computer system architecture A computer system includes a bus system; a pluggable central processing unit circuit board, coupled to the bus system; a pluggable logic board coupled to the pluggable central processing unit circuit board through the bus system; a pluggable input/output ... | 09/14/1999 |
| 5941617 | Decorative panel for computer enclosure Disclosed is a decorative panel for attachment to the exterior of a computer enclosure including a fastener receiving portion for facilitating attachment of the decorative panel to an outer surface of the computer enclosure, a plurality of irregular geome... | 08/24/1999 |
| 5824950 | Low profile semiconductor die carrier A semiconductor die carrier configured to be secured to a printed circuit board includes an insulative package for housing a semiconductor die. The insulative package has a top surface, a bottom surface, and a plurality of side surfaces coupling the top s... | 10/20/1998 |
| 5821457 | Semiconductor die carrier having a dielectric epoxy between adjacent leads A semiconductor die carrier includes an insulative module; a plurality of electrically conductive leads extending from the insulative module; a semiconductor die housed with the insulative module; and at least one high frequency capacitor secured to the i... | 10/13/1998 |
| 5822551 | Passive backplane capable of being configured to a variable data path width corresponding to a data size of the pluggable CPU board A computer system includes a first passive backplane having a local bus, a memory bus, and peripheral bus. The computer system includes a first printed circuit board having a microprocessor, and connected to the local bus and to the memory bus. The comput... | 10/13/1998 |
| 5819403 | Method of manufacturing a semiconductor chip carrier A semiconductor die carrier includes a plurality of electrically insulative side walls; a plurality of electrically conductive leads extending from at least one of the side walls, each of the leads being individually manufactured without use of a lead fra... | 10/13/1998 |
| 5812797 | Computer having a high density connector system A computer system architecture in which functionally compatible electronic components are located on modular printed circuit boards. Thus, a type of processor used by the system can be changed by replacing the printed circuit board incorporating the proce... | 09/22/1998 |
| 5791947 | Contact beam for electrical interconnect component An electrically conductive contact beam for use in an electrical interconnect component. The contact beam includes a stabilizing section for securing the contact beam within a support substrate, and a contact section, connected to the stabilizing section,... | 08/11/1998 |
| 5781408 | Computer system having a motorized door mechanism A computer system includes an exterior casing having an opening therein to permit user access to peripheral devices, such as floppy drives, CD ROM drives, tape drives, or optical drives. A door driven by a reversible motor slides along the exterior casing... | 07/14/1998 |
| 5696027 | Method of manufacturing a semiconductor chip carrier affording a high-density external interface A semiconductor die carrier may include an insulative substrate; an array of groups of multiple electrically conductive contacts arranged in rows and columns on the insulative substrate, wherein the groups from adjacent rows are staggered as are the group... | 12/09/1997 |
| 5659953 | Method of manufacturing an apparatus having inner layers supporting surface-mount components An apparatus comprising a multi-layer substrate including a plurality of layers of insulative material, at least one well formed in at least one of the layers, the well extending from an outer surface of the multi-layer substrate to an inner surface of th... | 08/26/1997 |
| 5661631 | Computer system having color-coded printed circuit boards and corresponding slats A computer system includes a computer cabinet, a plurality of printed circuit boards housed within the computer cabinet, a processor secured to at least one of the printed circuit boards, a power supply cabinet remote from the computer cabinet, a power su... | 08/26/1997 |
| 5637019 | Electrical interconnect system having insulative shrouds for preventing mismating An electrical interconnect system comprising a first electrical connector including a first plurality of electrically conductive contacts and a first insulator shroud surrounding the first plurality of contacts, the first shroud comprising a first side wa... | 06/10/1997 |
| 5576931 | Computer with two fans and two air circulation areas A computer system including a plurality of air circulation areas to facilitate cooling of components with in the air circulation areas. Specifically, the system includes an air circulation area for a plurality of printed circuit boards, for a power supply... | 11/19/1996 |
| 5543586 | Apparatus having inner layers supporting surface-mount components An apparatus comprising a multi-layer substrate including a plurality of layers of insulative material, at least one well formed in at least one of the layers, the well extending from an outer surface of the multi-layer substrate to an inner surface of th... | 08/06/1996 |
| 5541449 | Semiconductor chip carrier affording a high-density external interface A semiconductor die carrier may include an insulative substrate; an array of groups of multiple electrically conductive contacts arranged in rows and columns on the insulative substrate, wherein the groups from adjacent rows are staggered as are the group... | 07/30/1996 |
