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| Number | Title | Issue Date |
| 8184937 | Optical cable The present invention relates to an optical cable with a structure for improving a durability performance. The optical cable comprises, as a basic structure: a coated optical fiber, and a cable jacket covering an outer periphery of the coated optical fiber. The coat... | 05/22/2012 |
| 8183669 | Nitride semiconductor wafer having a chamfered edge A nitride semiconductor wafer is planar-processed by grinding a bottom surface of the wafer, etching the bottom surface by, e.g., KOH for removing a bottom process-induced degradation layer, chamfering by a rubber whetstone bonded with 100 wt %-60 wt % #3000-#600 di... | 05/22/2012 |
| 8182286 | Water-proofing joint connector The present invention provides a water-proofing joint connector capable of electrically interconnecting a plurality of terminals, with a simple structure, irrespective of the number of the terminals. The water-proofing joint connector includes a connection conductor... | 05/22/2012 |
| 8180218 | PON system and terminal operation registering method In a PON system in which communication is performed at a plurality of types of transmission rate (L, M, and H) in an upstream direction from a plurality of terminals connected to a station apparatus through optical fibers, within a discovery period for allowing an u... | 05/15/2012 |
| 8179918 | Relay connection unit for vehicle A relay connection unit which is connected to a first communication line of a first communication protocol for communicating a first message via time-divided slots and a second communication line of a second communication protocol for communicating a second message ... | 05/15/2012 |
| 8177911 | Damage evaluation method of compound semiconductor member, production method of compound semiconductor member, gallium nitride compound semiconductor member and gallium nitride compound semiconductor membrane A method of evaluating damage of a compound semiconductor member, comprising: a step of performing measurement of photoluminescence on a surface of the compound semiconductor member; and a step of evaluating damage on the surface of the compound semiconductor member... | 05/15/2012 |
| 8177590 | Crimping terminal and method of manufacturing terminal-provided wire A crimp terminal whose crimp state can be easily evaluated and to provide a method of manufacturing a terminal-provided wire comprising the crimp terminal. The crimp terminal includes a pair of conductor barrels which are crimped onto a conductor of an electric wire... | 05/15/2012 |
| 8177589 | Terminal connector with a crimping portion with recesses A plurality of recesses are formed on a surface of a wire barrel where an electric wire is provided. In a state before the electric wire is crimped onto the wire, barrel, at least one of sides comprising rims of an opening of each recess of a quadrangular shape is a... | 05/15/2012 |
| 8173897 | Superconducting cable line A superconducting cable line includes a heat insulation pipe for a fluid for transporting liquid hydrogen, a superconducting cable housed in the heat insulation pipe for a fluid, and heat exchange means for performing a heat exchange between liquid hydrogen and a re... | 05/08/2012 |
| 8172625 | Spherical terminal with guide groove In a pair of mutually connectable terminals, one terminal is provided with a joint having a spherical surface formed on the outer circumferential surface, and the other terminal is provided with a hole into which the joint can be fitted. At least one of the joint an... | 05/08/2012 |
| 8168516 | Method of fabricating single crystal gallium nitride semiconductor substrate, nitride gallium semiconductor substrate and nitride semiconductor epitaxial substrate A method of fabricating a single crystal gallium nitride substrate the step of cutting an ingot of single crystal gallium nitride along predetermined planes to make one or more single crystal gallium nitride substrates. The ingot of single crystal gallium nitride is... | 05/01/2012 |
| 8167653 | Shield shell A shield shell is composed of a tubular shell body made of a conductive resin and a metallic conductive body mounted in the shell body. The conductive body is capable of, in the base end part, connecting with a shielding member by being exposed on the surface of the... | 05/01/2012 |
| 8164242 | Spark plug A spark plug (100) includes: a center electrode (2); and a ground electrode (30) which is to be exposed in a combustion chamber of an internal combustion engine and which forms a spark discharge gap with the center electrode (2), wherein ... | 04/24/2012 |
| 8164043 | Optical module with fiber holding ferrule An optical module is configured such that it is not susceptible to fine particulate matter when an optical fiber is inserted into a fiber insertion hole thereof. The optical module is also configured to prevent any reduction in the optical coupling efficiency and de... | 04/24/2012 |
| 8164009 | Control knob which operates multiple systems A control knob capable of operating multiple systems has a first rotational body and a second rotational body coaxially arranged, and a shaft connected to the second rotational body. Opposite the shaft, a movable body is moved axially in response to rotation of the ... | 04/24/2012 |
| 8155825 | On-vehicle database distribution node and on-vehicle database system A on-vehicle database system includes: a memory for recording an on-vehicle database connected to an on-vehicle LAN network and to an ECU for registering data inputted from respective ECU as attribute value data all at once; and data output means for registering dat... | 04/10/2012 |
| 8155161 | Semiconductor laser A semiconductor laser includes a semiconductor laser region and a wavelength-monitoring region. The semiconductor laser region includes a first optical waveguide that includes a gain waveguide, the first optical waveguide having one end and another end opposite the ... | 04/10/2012 |
| 8153530 | Method of manufacturing a semiconductor device In this method of manufacturing a semiconductor device, the remaining layer of an etching mask layer remains in a predetermined thickness when the stamping face of a nano-stamper is pressed on the surface of the etching mask layer. Therefore, the remaining layer of ... | 04/10/2012 |
| 8149889 | Semiconductor laser device A semiconductor laser device includes a laser diode provided on a semiconductor substrate, the laser diode including a first optical waveguide having a gain waveguide, a plurality of photodiodes, a first wavelength-selective filter having periodic transmission peaks... | 04/03/2012 |
| 8147911 | Perforated porous resin base material and production process of porous resin base with inner wall surfaces of perforations made conductive. A production process of a perforated porous resin base, comprising Step 1 of impregnating the porous structure of a porous resin base with a liquid or solution; Step 2 of forming a solid substance from the liquid or solution impregnated; Step 3 of forming a pluralit... | 04/03/2012 |
| 8146248 | Construction for stopping water from penetrating into drain wire contained in shielded wire and method for stopping water from penetrating thereinto A Drain wire led out from the interior to the exterior of a shielded wire is covered with a heat shrinkable tube made of an insulating resin or with a rubber tube including silicon or EPDM (ethylene-propylene rubber). A water-stop agent is penetrated between the ele... | 04/03/2012 |
| 8143140 | Substrate having thin film of GaN joined thereon and method of fabricating the same, and a GaN-based semiconductor device and method of fabricating the same There is provided a method of producing a thin GaN film-joined substrate, including the steps of: joining on a GaN bulk crystalline body a substrate different in type or chemical composition from GaN; and dividing the GaN bulk crystalline body at a plane having a di... | 03/27/2012 |
| 8137116 | Ground joint connector and wire harness including the same The present invention provides a ground joint connector capable of collectively connecting a plurality of grounding wires included in a wire harness for a vehicle, to a given ground site, while occupying a little space. The ground joint connector JC comprises a plur... | 03/20/2012 |
| 8134223 | III-V compound crystal and semiconductor electronic circuit element Favorable-quality III-V crystals are easily obtained at low cost without causing cracks, even when using a variety of substrates, and can be used to manufacture semiconductor devices with good quality and at high yields. The III-V crystals are characterized by the f... | 03/13/2012 |
| 8133815 | Method of polishing compound semiconductor substrate, compound semiconductor substrate, method of manufacturing compound semiconductor epitaxial substrate, and compound semiconductor epitaxial substrate Compound-semiconductor-substrate polishing methods, compound semiconductor substrates, compound-semiconductor-epitaxial-substrate manufacturing methods, and compound semiconductor epitaxial substrates whereby oxygen superficially present on the substrates reduced. A... | 03/13/2012 |
| 8133412 | Anisotropic conductive film An anisotropic conductive film 2 contains electrically conductive particles 6 dispersed in an adhesive agent 30 for electrode connection, the adhesive agent containing an epoxy resin, which is an insulating thermosetting resin, as a main compone... | 03/13/2012 |
| 8129619 | Flame-retardant resin composition, and insulated wire, insulated shielded wire, insulated cable and insulation tube using the same A flame-retardant resin composition including a resin component containing (A) 30 to 90 parts by weight of a thermoplastic polyurethane elastomer having, as measured according to JIS K 7311, a JIS hardness of A98 or less, (B) 70 to 10 parts by weight of an ethylene-... | 03/06/2012 |
| 8126611 | On-vehicle communication system An on-vehicle communication system has a plurality of buses relay-connected through a relay connection unit, each of the buses having at least one ECU connected thereto. In the vehicle communication system, a basic routing table that specifies a relay point for tran... | 02/28/2012 |
| 8124553 | Composite sintered body The composite sintered body of the invention is a composite sintered body, containing 20 volume % or more and 80 volume % or less of cubic boron nitride particles, and a binder; wherein the binder contains at least one selected from the group consisting of nitrides,... | 02/28/2012 |
| 8124543 | Method for manufacturing semiconductor laser diode A method for manufacturing an LD is disclosed. The LD has a striped structure including an optical active region. The striped structure is buried with resin, typically benzo-cyclo-butene (BCB). The method to form an opening in the BCB layer has tri-steps etching of ... | 02/28/2012 |
| 8121495 | Current mirror circuit and optical receiver circuit using the same A current mirror circuit and an optical receiver circuit implementing with the current mirror circuit are disclosed. The current mirror circuit provides two MOSFETs and two differential amplifiers. The MOSFETs are operated under the same bias condition even the powe... | 02/21/2012 |
| 8119241 | Method for manufacturing diamond monocrystal having a thin film, and diamond monocrystal having a thin film A method for growing a low-resistance phosphorus-doped epitaxial thin film having a specific resistance of 300 Ωcm or less at 300 K on a principal surface of a {111} monocrystal substrate under conditions in which the phosphorus atom/carbon atom ratio is 3% or high... | 02/21/2012 |
| 8115927 | Production method of compound semiconductor member A method of evaluating damage of a compound semiconductor member, comprising: a step of performing spectroscopic ellipsometry measurement on a surface of the compound semiconductor member; and a step of evaluating damage on the surface of the compound semiconductor ... | 02/14/2012 |
| 8115810 | Vehicle-periphery viewing apparatus A vehicle-periphery viewing apparatus comprises an imaging device, an electronic control unit, and a display device. The imaging device captures an image of a surrounding area of the vehicle and comprises a field of view larger in a horizontal direction than in a ve... | 02/14/2012 |
| 8105121 | Ground terminal fitting with a clamping section touching a ground member The present invention provides a ground terminal fitting capable of being fixed to a ground member through a simple operation while permitting production cost to be reduced, and a ground device having the ground terminal fitting. The ground terminal fitting comprise... | 01/31/2012 |
| 8105103 | Ground connecting device and wire harness having the same Provided are a ground connecting device occupying only a little space and a wire harness having the ground connecting device. The ground connecting device comprises first and second ground joint connectors to connect a plurality of first and second grounding wires i... | 01/31/2012 |
| 8102596 | Optical fiber for amplification Provided is an erbium doped optical fiber (EDF) for amplification which allows an easy estimation of the amplification performance and high production stability. The fiber includes a core and a cladding. The core is mainly made of silica glass and doped with erbium ... | 01/24/2012 |
| 8101968 | Group III nitride substrate, epitaxial layer-provided substrate, methods of manufacturing the same, and method of manufacturing semiconductor device A group III nitride substrate on which an epitaxially grown layer of good quality can be formed, and a method of manufacturing the same are obtained. A GaN substrate is one of the following: a group III nitride substrate, wherein the number of atoms of an acid mater... | 01/24/2012 |
| 8101885 | Laser processing method and laser processing apparatus The present invention relates to a method and apparatus having a structure that enables laser processing of an object even when the object has a surface formed with irregularities. The laser processing method irradiates objects, each having a cylindrical form extend... | 01/24/2012 |
| 8101523 | Method of processing of nitride semiconductor wafer, nitride semiconductor wafer, method of producing nitride semiconductor device and nitride semiconductor device A nitride semiconductor wafer is planar-processed by grinding a bottom surface of the wafer, etching the bottom surface by, e.g., KOH for removing a bottom process-induced degradation layer, chamfering by a rubber whetstone bonded with 100 wt %-60 wt % #3000-#600 di... | 01/24/2012 |
