Celebrity Inventors
Glam girl Heddy Lamar may have used her good looks to good effect on the silver screen, but she put her smarts to better use as an inventor. During World War II, she co-patented a frequency-switching system for torpedo guidance that was considered years ahead of its time.
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| Number | Title | Issue Date |
| 8118584 | Device and method for processing carrier tape A carrier tape forming apparatus includes a tape paying-out unit for paying out a tape to be worked, a tape feeding unit for feeding the tape, a forming unit for effecting embossing on the tape, a perforating unit for perforating at least a feeding hole in the tape,... | 02/21/2012 |
| 8044505 | Prepreg, method for manufacturing prepreg, substrate, and semiconductor device A prepreg which can meet a demand for thickness reduction is provided. The prepreg has first and second resin layers having different applications, functions, capabilities, or properties, and allows an amount of a resin composition in each of the first and second re... | 10/25/2011 |
| 7799852 | Composition of biphenyl epoxy resin, phenolbiphenylaralkyl resin and filler An epoxy resin composition which can be used as a semiconductor encapsulating resin and in which the improvement of flame retardancy can be attained by suitably adapting a crosslinked structure itself of a cured article without using any flame retardant material and... | 09/21/2010 |
| 7655871 | Resin composition, resin-attached metal foil, base material-attached insulating sheet and multiple-layered printed wiring board A multiple-layered printed wiring board is manufactured, which exhibits higher thermal resistance and lower thermal expansion so that no flaking and/or no crack would be occurred in a thermal shock test such as a cooling-heating cycle test and the like, in addition ... | 02/02/2010 |
| 7622515 | Composition of epoxy resin, phenolic resin, silicone compound, spherical alumina and ultrafine silica The object of the present invention is to provide an epoxy resin composition which is excellent in flash characteristics and thermal conductivity, and gives an area mounting type semiconductor apparatus having little warpage and excellent temperature cycle propertie... | 11/24/2009 |
| 7612458 | Epoxy resin composition for semiconductor encapsulating use, and semiconductor device There is provided an epoxy resin composition for semiconductor encapsulating use comprising: an epoxy resin (A); a phenol resin (B); a curing accelerator (C); and an inorganic filler (D), wherein the inorganic filler (D) contains a spherical fused silica (d1) which ... | 11/03/2009 |
| 7442729 | Composition of epoxy resin, polyphenolic compound and trisubstituted phosphonionphenolate salt A curing accelerator which is suitable for various curable resin compositions, an epoxy resin composition having excellent curability, storage stability and fluidity, and a semiconductor device having excellent solder cracking resistance and moisture resistance reli... | 10/28/2008 |
| 7144385 | Discharging implement for medical care For safely inserting a catheter into a chest cavity of a child or corpulent patient to be retained therein and for preventing atmospheric air from proceeding into the chest cavity during a removal of a penetrating needle, discharge equipment for medical procedures i... | 12/05/2006 |
| 7098276 | Flame-retardant epoxy resin composition and semiconductor device made using the same An epoxy resin composition which can be used as a semiconductor encapsulating resin and in which the improvement of flame retardancy can be attained by suitably adapting a crosslinked structure itself of a cured article without using any flame retardant material and... | 08/29/2006 |
| 7077640 | Method of and apparatus for manufacturing molded materials of thermosetting resin composition A method of manufacturing molded materials of a thermosetting resin composition in a method of granulating a molding material of the thermosetting resin composition, in which a sheet producing step for transferring the molding material in a molten state to a subsequ... | 07/18/2006 |
| 7074738 | Curing accelerator, epoxy resin composition, and semiconductor device A curing accelerator which is suitable for various curable resin compositions, an epoxy resin composition having excellent curability, storage stability and fluidity, and a semiconductor device having excellent solder cracking resistance and moisture resistance reli... | 07/11/2006 |
| 7023098 | Resin composition for encapsulating semiconductor chip and semiconductor device therewith An epoxy resin composition for encapsulating a semiconductor chip, which has good flowability without deterioration in curability. Specifically, a resin composition for encapsulating a semiconductor chip containing an epoxy resin (A), a phenol resin (B), an inorgani... | 04/04/2006 |
| 6946421 | Latent catalyst This invention provides a latent catalyst having a structure of phosphonium borate consisting of a monovalent cation portion in which four specific groups are bonded to the phosphorus atom and a monovalent anion portion in which four specific groups are bonded to th... | 09/20/2005 |
| 6908717 | Positive photosensitive resin composition, process for its preparation, and semiconductor devices The present invention provides a positve photosensitive resin composition of high sensitivity which can form a pattern of high resolution and high residual film ration and which can give a cured film superior in mechanical properties, adhesivity and water absorptivi... | 06/21/2005 |
| 6838030 | Method of and apparatus for manufacturing molded materials of thermosetting resin composition A method of manufacturing molded materials of a thermosetting resin composition in a method of granulating a molding material of the thermosetting resin composition, in which a sheet producing step for transferring the molding material in a molten state to a subsequ... | 01/04/2005 |
| 6831146 | Resin composition for use in manufacturing wet friction materials and wet friction material A resin composition for wet friction materials contains as a main component a phenolic resin formed as a result of the reaction between phenols and aldehydes in the presence of a basic catalyst, and a particulate filler having a specific surface area of 35 to 410 m | 12/14/2004 |
| 6787224 | Cover tape for packaging electronic components A cover tape for packaging electronic components, which can prevent troubles associated with the peeling strength or trouble appearing during mounting of the electronic components, which can be produced at a low cost, and which is transparent; that is, a cover tape ... | 09/07/2004 |
| 6780960 | Method of making a polyimide in a low-boiling solvent A method of making a solution of a polyimide from a diamine monomer and a dianhydride monomer is disclosed. A solution or slurry of one of the monomers in a solvent that boils at a temperature between about 80° C. and about 160° C. is prepared. The solution or slu... | 08/24/2004 |
| 6765051 | Phenol resin forming material for pulley used in motor vehicles and phenol resin pulley for motor vehicles A phenol resin composition for forming pulleys used in motor vehicles is disclosed. The composition comprises 35 to 45 wt % of resol, 35 to 45 wt % of glass fiber, 5 to 15 wt % of one or more inorganic powders selected from the group consisting of calcium carbonate,... | 07/20/2004 |
| 6750315 | Polyether aromatic ketone resin composition and its film and sheet The present invention is envisioned to improve sliding characteristics of polyether aromatic ketone resins and to provide their molded articles which are themselves resistant to damage and abrasion, cause no such damage or abrasion to their partner parts and can be ... | 06/15/2004 |
| 6733901 | Process for production of epoxy resin composition for semiconductor encapsulation, epoxy resin composition for semiconductor encapsulation, and semiconductor device The present invention provides a process for producing an epoxy resin composition for semiconductor encapsulation which, when used in encapsulation of a semiconductor chip, can minimize voids appearing in the semiconductor device obtained. That is, the present inven... | 05/11/2004 |
| 6688472 | Container for electric device A container for receiving an electric device in a recess. The container includes a pair of projections for restraining a movement of the electric device in a first direction perpendicular to a second direction and directed from a top opening area of the r... | 02/10/2004 |
| 6667104 | Phenol resin composition for wet friction material and wet friction material A phenol resin composition for wet friction material comprising a curable resin composition obtained by mixing a resol-type phenol resin and a hydrolysis solution of an alkoxysilane or a condensate thereof, wherein the ratio by weight of the nonvolatile c... | 12/23/2003 |
| 6664344 | Composition of polyepoxide, phenolic co-condensate and phosphonium-polyphenolic molecular association product The present invention provides an epoxy resin composition that has both a rapidly-curability and an excellent storage stability and is useful in the field of electronic and electric materials. That is, the present invention is an epoxy resin composition c... | 12/16/2003 |
| 6639307 | Cover tape for packaging electronic elements A cover tape for packaging electronic elements capable of being heat-sealed to a polycarbonate carrier tape having regularly formed pockets for containing electronic elements, which cover tape comprises (A) a substrate layer comprising a thermoplastic res... | 10/28/2003 |
| 6635138 | Method of immobilizing circuitry fingers Disclosed is a method of immobilizing the fingers of circuitry. A coating is formed of a liquid adhesive on the surface of a release film in a pattern of strips in positions perpendicular to and across the positions the fingers of the circuitry will have ... | 10/21/2003 |
| 6632523 | Low temperature bonding adhesive composition An adhesive composition that bonds at low temperatures is disclosed. The composition is a solution in an organic solvent of a polyimide, an epoxy resin, and a cyanate. The polyimide can be a polyimidesiloxane, made from a dianhydride, an aromatic diamine ... | 10/14/2003 |
| 6631861 | Grinding device for resin composition In a rotor 1 provided with a cylinder 2 which can supply a molten and mixed resin composition to an upper portion of the rotor 1 from an opening portion and is formed by a magnetic material on an outer periphery thereof or is formed by a nonmagnetic mater... | 10/14/2003 |
| 6613699 | Process for producing a semiconductor device A process for producing a semiconductor device which comprises forming a layer of an organic polymer resin on a surface of a semiconductor element, treating the formed layer by pattern working and curing, etching the element using the patterned and cured ... | 09/02/2003 |
| 6592802 | Process for production of polymer sheet and optical polymer sheet The present invention provides a process for continuously producing a polymer sheet having an excellent surface smoothness, an apparatus for producing such a polymer sheet, and an optical polymer sheet produced by such a process. The process for producing... | 07/15/2003 |
| 6579160 | Holder for polished work and manufacturing method thereof The inner circumferential surface of through holes in a metal plate is chamfered or put to anchor fabrication and a thermoplastic resin is injection molding to the inner circumferential surface of the through hole thereby forming a resin portion over the ... | 06/17/2003 |
| 6569513 | Prepreg and process for manufacturing same A prepreg exhibiting excellent formability and producing laminated boards and multiple layer circuit boards exhibiting high thickness precision is disclosed. The prepreg comprises an inner layer made from a glass fiber substrate, having a weight of 40 g o... | 05/27/2003 |
| 6559218 | Phenol resin forming material for pulley used in motor vehicles and phenol resin pulley for motor vehicles A phenol resin composition for forming pulleys used in motor vehicles is disclosed. The composition comprises 35 to 45 wt % of resol, 35 to 45 wt % of glass fiber, 5 to 15 wt % of one or more inorganic powders selected from the group consisting of calcium... | 05/06/2003 |
| 6555174 | Process for manufacturing prepreg A process for manufacturing a prepreg exhibiting excellent formability and producing laminated boards and multiple layer circuit boards exhibiting high thickness precision is disclosed. The process of manufacturing the prepreg comprises (a) a step of impr... | 04/29/2003 |
| 6551714 | Flame-retardant resin composition, and prepregs and laminates using such composition The present invention provides a resin composition having excellent flame retardancy without using any halogen-containing flame retardant, and prepregs and laminates using such a resin composition. More specifically, the present invention provides a flame... | 04/22/2003 |
| 6538100 | Method for producing polyimide resin The object of the present invention is to provide a method capable of producing polyimide resins having excellent heat resistance, which can utilize inexpensive monomers and does not use solvents. The method comprises mixing, in the absence of a solvent, ... | 03/25/2003 |
| 6524989 | Tetraorganophosponium dicyclic tetraorganoborate catalyst This invention provides a latent catalyst having a structure of phosphonium borate consisting of a monovalent cation portion in which four specific groups are bonded to the phosphorus atom and a monovalent anion portion in which four specific groups are b... | 02/25/2003 |
| 6495260 | Method of producing epoxy for molding semiconductor device, molding material, and semiconductor device The present invention provides a process for producing an epoxy resin molding material for semiconductor encapsulation, which is very low in voids generation; a molding material produced by the process; and a semiconductor device obtained by encapsulation... | 12/17/2002 |
| 6486242 | Flame-retardant resin composition and prepreg and laminate using the same The present invention provides a flame-retardant resin composition having high flame retardancy without using any halogen compound and suited for printed circuit boards. Specifically, it provides a flame-retardant resin composition containing as its essen... | 11/26/2002 |
| 6483195 | Transfer bump street, semiconductor flip chip and method of producing same The invention relates to a low-cost transfer bump sheet which is capable of transferring copper-cored solder bumps with high reliability of bonding to a semiconductor chip and which is capable of transferring bumps of various structures. The invention als... | 11/19/2002 |
