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| Number | Title | Issue Date |
| 8182312 | CMP system with wireless endpoint detection system A CMP polishing pad with an optical sensor assembly embedded in the pad, connected to a transceiver and/or power supply mounted at the center of the pad or at the outer edge of the pad which communicates wirelessly with a control system. ... | 05/22/2012 |
| 8052504 | Method, apparatus and system for use in processing wafers The present embodiment provides for methods and systems for use in processing objects such as wafers, including polishing and/or grinding wafers. Some embodiments provide systems that include a front-end module and a processing module. The front end module couples w... | 11/08/2011 |
| 7959496 | Flexible membrane assembly for a CMP system and method of using A flexible membrane assembly for a wafer carrier in a CMP system. The flexible membrane assemble has a flat, flexible membrane joined to a rigid cylindrical sidewall. ... | 06/14/2011 |
| 7918712 | Endpoint detection system for wafer polishing An wafer polishing pad assembly for use in CMP includes an optical sensor for sensing reflectivity of the wafer during polishing, and produces a corresponding signal, and transmits the signal from the rotating pad to a stationary portion of the assembly. The signal ... | 04/05/2011 |
| 7551979 | Robot calibration system and method A robot calibration system and method for robots in semiconductor wafer processing systems is disclosed. The calibration system comprises a calibration array, a dummy wafer and a control system programmed with a calibration routine. The calibration array has an plur... | 06/23/2009 |
| 7549909 | Methods for optical endpoint detection during semiconductor wafer polishing A method of measuring a change in thickness of a layer of material disposed on a wafer while polishing the layer. Light is directed at the surface of the wafer from an optical sensor disposed within the polishing pad. The intensity of the reflected light is measured... | 06/23/2009 |
| 7467990 | Back pressure control system for CMP and wafer polishing A wafer carrier with a back pressure applicator system adapted to provide high resolution back pressure control. A plurality of millimeter scale distensible elements are disposed between the wafer carrier pressure plate and a process wafer, and selectively distended... | 12/23/2008 |
| 7249992 | Method, apparatus and system for use in processing wafers The present embodiment provides for methods and systems for use in processing objects such as wafers, including polishing and/or grinding wafers. Some embodiments provide systems that include a front-end module and a processing module. The front end module couples w... | 07/31/2007 |
| 7238083 | Wafer carrier with pressurized membrane and retaining ring actuator A wafer carrier for controlling downward force and edge effect during chemical mechanical planarization. A retaining ring actuator is disposed within the retaining ring to control the height of the retaining ring relative to the bottom surface of the wafer carrier. ... | 07/03/2007 |
| 7235154 | Devices and methods for optical endpoint detection during semiconductor wafer polishing A method of measuring a change in thickness of a layer of material disposed on a wafer while polishing the layer. Light is directed at the surface of the wafer from an optical sensor disposed within the polishing pad. The intensity of the reflected light is measured... | 06/26/2007 |
| 7195541 | Endpoint detection system for wafer polishing An wafer polishing pad assembly for use in CMP includes an optical sensor for sensing reflectivity of the wafer during polishing, and produces a corresponding signal, and transmits the signal from the rotating pad to a stationary portion of the assembly. The signal ... | 03/27/2007 |
| 7160808 | Chuck for supporting wafers with a fluid A method of relieving surface stress on a thin wafer by removing a small portion of the wafer substrate, the substrate being removed by applying a warm solution of KOH to the backside of the wafer while the wafer spins. The wafer may be supported on a rotatable plat... | 01/09/2007 |
| 7156946 | Wafer carrier pivot mechanism A pivoting wafer carrier having a minimum of internal friction and a smooth, continuous pivoting motion. The pivot mechanism includes a lower ring mounted on a pressure plate, an upper ring mounted on a housing upper plate and ball transfer units disposed on the low... | 01/02/2007 |
| 7131892 | Wafer carrier with pressurized membrane and retaining ring actuator A wafer carrier for controlling downward force and edge effect during chemical mechanical planarization. A retaining ring actuator is disposed within the retaining ring to control the height of the retaining ring relative to the bottom surface of the wafer carrier. ... | 11/07/2006 |
| 7063604 | Independent edge control for CMP carriers A wafer carrier for controlling the edge effect during chemical mechanical planarization. A first bladder is disposed within the retaining ring to control the height of the retaining ring relative to the bottom surface of the wafer carrier. A second bladder is dispo... | 06/20/2006 |
| 7063605 | Retaining ring for wafer carriers A long-lasting retaining ring for wafer carriers used in chemical mechanical planarization. A groove is disposed around the retaining ring, with the groove opening facing the mounting plate. A ridge is disposed in the groove. A bladder is disposed in the groove and ... | 06/20/2006 |
| 7059942 | Method of backgrinding wafers while leaving backgrinding tape on a chuck A method of backgrinding wafers wherein backgrinding tape or a pad is applied to the chuck and not to the wafers. The backgrinding tape or pad is left on the chuck as each wafer is sequentially placed on the tape or pad, background, rinsed on the backside, removed f... | 06/13/2006 |
| 7052366 | Endpoint detection system for wafer polishing An wafer polishing pad assembly for use in CMP includes an optical sensor for sensing reflectivity of the wafer during polishing, and produces a corresponding signal, and transmits the signal from the rotating pad to a stationary portion of the assembly. The signal ... | 05/30/2006 |
| 7040955 | Chemical-mechanical planarization tool force calibration method and system The methods and devices described below allow users of CMP tools to quickly calibrate Spindle Force, Wafer Force, and Retaining Ring Force using mechanisms, load cells, a control computer, and force equations. The control computer can test a variety of pressures in ... | 05/09/2006 |
| 7033252 | Wafer carrier with pressurized membrane and retaining ring actuator A wafer carrier for controlling downward force and edge effect during chemical mechanical planarization. A retaining ring actuator is disposed within the retaining ring to control the height of the retaining ring relative to the bottom surface of the wafer carrier. ... | 04/25/2006 |
| 7018268 | Protection of work piece during surface processing The present invention provides an apparatus and method for protecting a work piece during surface processing. The apparatus employs a protective material to protect a wafer during backside grinding. The apparatus can further include a vacuum chuck that allows the pa... | 03/28/2006 |
| 7008309 | Back pressure control system for CMP and wafer polishing A wafer carrier with a back pressure applicator system adapted to provide high resolution back pressure control. A plurality of millimeter scale distensible elements are disposed between the wafer carrier pressure plate and a process wafer, and selectively distended... | 03/07/2006 |
| 6986701 | Polishing pad with built-in optical sensor An optical sensor that includes a light source and a detector is located within a cavity in a polishing pad so as to face the surface that is being polished. Light from the light source is reflected from the surface being polished and the detector detects the reflec... | 01/17/2006 |
| 6976901 | In situ feature height measurement Embodiments of the invention provide methods and apparatus for in situ feature height measurement of an object being planarized. In one embodiment, a method of planarizing an object comprises polishing a surface of the object to be planarized using a polishing pad h... | 12/20/2005 |
| 6945856 | Subaperture chemical mechanical planarization with polishing pad conditioning Embodiments of the present invention are directed to polishing an object with polishing pad conditioning. In one embodiment, a method for polishing an object comprises placing a contact portion of a polishing pad in contact with a target surface of the object to be ... | 09/20/2005 |
| 6887133 | Pad support method for chemical mechanical planarization Embodiments of the invention as directed to supporting a polishing pad that can be easily replaced. In one embodiment, a method for polishing an object comprises coupling a polishing head to a substrate for holding a polishing pad which is smaller in area than the o... | 05/03/2005 |
| 6885206 | Device for supporting thin semiconductor wafers A device for supporting and securing thin wafers comprising a housing having an upper shelf extending radially inwardly from the housing and a lower shelf extending radially inwardly from the upper shelf. An upper seal is disposed within the upper shelf and an inspe... | 04/26/2005 |
| 6884150 | Polishing pad sensor assembly with a damping pad A polishing pad having an optical assembly that does not cause excess wear on a wafer workpiece. The optical assembly is disposed within the pad such that it may move in response to forces applied to the optical assembly. A damping pad may be disposed on the optical... | 04/26/2005 |
| 6878037 | Slurry pump control system A CMP slurry pumping system and method which uses the slurry pump inlet pressure as input to the pump controller, and the controller adjusts pump speed to account for variations in inlet pressure. ... | 04/12/2005 |
| 6869348 | Retaining ring for wafer carriers A long-lasting retaining ring for wafer carriers used in chemical mechanical planarization. A groove is disposed around the retaining ring, with the groove opening facing the mounting plate. A ridge is disposed in the groove. A bladder is disposed in the groove and ... | 03/22/2005 |
| 6866564 | Method of backgrinding wafers while leaving backgrinding tape on a chuck A method of backgrinding wafers wherein backgrinding tape or a pad is applied to the chuck and not to the wafers. The backgrinding tape or pad is left on the chuck as each wafer is sequentially placed on the tape or pad, background, and then removed from the tape. A... | 03/15/2005 |
| 6855030 | Modular method for chemical mechanical planarization Specific embodiments of the present invention are directed to a method of operating a modular chemical mechanical planarization process. The method comprises operating CMP apparatus comprising a docking station having at least one CMP module and at least one cleanin... | 02/15/2005 |
| 6743722 | Method of spin etching wafers with an alkali solution A method of relieving surface stress on a thin wafer by removing a small portion of the wafer substrate, the substrate being removed by applying a solution of KOH to the wafer while the wafer spins. ... | 06/01/2004 |
| 6739945 | Polishing pad with built-in optical sensor An optical sensor that includes a light source and a detector is located within a cavity in a polishing pad so as to face the surface that is being polished. Light from the light source is reflected from the surface being polished and the detector detects the reflec... | 05/25/2004 |
| 6726528 | Polishing pad with optical sensor A polishing pad having an optical assembly that does not cause excess wear on a wafer workpiece. The optical assembly is disposed within the pad such that it may move in response to forces applied to the optical assembly. ... | 04/27/2004 |
