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The Quarterly Review ; March edition, 1825

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Assignee: Staystik, Inc.

Location: Venice, CA
No. of patents: 1

Number	Title	Issue Date
5372883	Die attach adhesive film, application method and devices incorporating the same A microelectronic device containing one or more dies bonded to a substrate 0.5-8 mil thick thermoplastic adhesive film is disclosed. The adhesive's main constituent is a thermoplastic organic high polymer containing the elements of carbon and hydrogen, an...	12/13/1994