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| Number | Title | Issue Date |
| 5868605 | In-situ polishing pad flatness control Conditioning of a polishing pad so as to control the surface profile and achieve uniformity in wear of a polishing pad by causing the workpiece and polishing pad to oscillate radially relative to one another with the extent of the oscillating movement bei... | 02/09/1999 |
| 5791975 | Backing pad A method of fabricating a soft, resilient backing pad adapted for attachment to a pressure plate for planarizing work pieces wherein the outer exposed surface of the pad has been abraded by means of dry abrasive particles fixed on a surface of a spherical... | 08/11/1998 |
| 5782678 | Dual column abrading machine In accordance with the present invention, there is provided a machine for performing abrading operations. The preferred machine includes an upper lap plate and lower lap plate mounted for rotation about its own vertical axis. A carriage means supports the... | 07/21/1998 |
| 5762543 | Polishing apparatus with improved product unloading In a polishing machine for polishing parts between a table and an upper polishing head, the upper polishing head includes push rods to clear the workpieces after a polishing operation. A push ring engages the push rods as a polishing head is being raised,... | 06/09/1998 |
| 5695392 | Polishing device with improved handling of fluid polishing media A retainer ring for retaining a thin workpiece during machining thereof, the retaining ring being of a design which facilitates distribution of an abrasive slurry used in the machining operation.... | 12/09/1997 |
| 5685766 | Polishing control method Polishing of wafers, such as wafers of semiconductive material is carried out by mounting the wafer to a carrier, and pressing the wafer against a polishing pad carrying a polishing media. An antenna is placed beneath the polishing pad and electrical ener... | 11/11/1997 |
| 5595529 | Dual column abrading machine In accordance with the present invention, there is provided a machine for performing abrading operations. The preferred machine includes an upper lap plate and lower lap plate mounted for rotation about its own vertical axis. A carriage means supports the... | 01/21/1997 |
| 5569062 | Polishing pad conditioning A rotating polishing wheel having secured to its top surface a polishing pad and a vertically movable carrier element for carrying a workpiece to be polished into contact with the polishing pad and exerting a desired pressure on the workpiece. Operatively... | 10/29/1996 |
| 5498196 | Wafer polishing method and apparatus A wafer polishing apparatus includes a wafer polishing assembly having a plurality of wafer carriers for substantially simultaneously polishing a plurality of wafers against a rotating polishing surface. A plurality of wafers to be polished are substantia... | 03/12/1996 |
| 5498199 | Wafer polishing method and apparatus A wafer polishing apparatus includes a wafer polishing assembly having a plurality of wafer carriers for substantially simultaneously polishing a plurality of wafers against a rotating polishing surface. A plurality of wafers to be polished are substantia... | 03/12/1996 |
| 5486131 | Device for conditioning polishing pads A device for conditioning the surface of a polishing pad covering a platen mounted on a polishing machine for rotation about a vertical axis, comprising a rigid carrier element carrying cutting means on its bottom surface and which is adapted for vertical... | 01/23/1996 |
| 5436045 | Low abraision material comprising a fibrous matrix impregnated with a polyurethane resin wherein fiber ends are exposed on at least one surface of the material Frictional articles useful for power transmission such as frictional drive belts and as non-slip friction surfaces comprised of a matrix of fibers impregnated with a cured and set polyurethane resin.... | 07/25/1995 |
| 5329732 | Wafer polishing method and apparatus A wafer polishing apparatus includes a wafer polishing assembly having a plurality of wafer carriers for substantially simultaneously polishing a plurality of wafers against a rotating polishing surface. A plurality of wafers to be polished are substantia... | 07/19/1994 |
| 5187901 | Circumferential pattern finishing machine A disc finishing machine comprising an annular upper platen, lower platen, a center driving ring, a plurality of a clamping guide rollers, a plurality of stationary guide rollers, a clamping guide roller, and stationary guide roller perpendicularly attach... | 02/23/1993 |
| 5134807 | Multilevel grinding apparatus A grinding apparatus comprises first and second grinding wheels for grinding the arms of E-cores, or any other desired item, having two different lengths, in a single grinding operation.... | 08/04/1992 |
| 5123218 | Circumferential pattern finishing method A disc finishing method using a machine comprising an annular upper platen, lower platen, a center driving ring, a plurality of a clamping guide rollers, a plurality of stationary guide rollers, a clamping guide roller, and stationary guide roller perpend... | 06/23/1992 |
| 4821459 | Multilevel grinding apparatus and method A grinding apparatus comprises first and second grinding wheels for grinding the arms of E-cores, or any other desired item, having two different lengths, in a single grinding operation.... | 04/18/1989 |
| 4693012 | Measuring bar for free abrasive machines A measuring bar for determining flatness and deviations therefrom comprises a rigid bar, and a plurality of support feet projecting from the bar. The support feet have free ends which occupy a common, flat plane, the free ends of each of the support feet ... | 09/15/1987 |
| 4593716 | Control valve assembly for abrasive slurry A control valve assembly for controlling the flow of abrasive slurry from a supply pump, directing a selected amount of abrasive slurry to the lapping wheel of an associated lapping machine, and recirculating the remainder of the supply of abrasive slurry... | 06/10/1986 |
| 4519168 | Liquid waxless fixturing of microsize wafers The disclosure teaches an improved manner of firmly holding a thin brittle wafer, such as a 0.01" thick silicon disc 3" in diameter, so as to allow the wafer to be brought into abrading contact with a moving lap wheel. The fixturing provides a pedestal gr... | 05/28/1985 |
| 4270314 | Bearing mount for lapping machine pressure plate This disclosure teaches structure for mounting a pressure plate relative to its supporting shaft in such a manner that axial forces are transmitted between the shaft and pressure plate while yet providing that the plate can freely rotate and swivel relati... | 06/02/1981 |
| 4047640 | Abrasive slurry regulator assembly The regulator assembly comprises body member carried by a support and defining a cavity for detaining a pool of abrasive slurry. An overflow device is associated with the body member for establishing the upper level of a pool of abrasive slurry in the cav... | 09/13/1977 |
| 4047639 | Abrasive slurry regulator assembly The regulator assembly comprises body member carried by a support and defining a cavity for detaining a pool of abrasive slurry. An overflow device is associated with the body member for establishing the upper level of a pool of abrasive slurry in the cav... | 09/13/1977 |
| 3991918 | Abrasive slurry regulator assembly The regulator assembly comprises body means carried by a support and defining a cavity for detaining a pool of abrasive slurry. Overflow means is associated with the body means for establishing the upper level of a pool of abrasive slurry in the cavity. A... | 11/16/1976 |
