Did You Know...
...that Charles Goodyear performed some of his experiments on rubber while in debtor's prison? He was there so often he referred to it as his "hotel". Chronically in debt because of poor business sense and ill health, Goodyear depended on the generosity of friends and family. Even after he unlocked the secret to vulcanizing rubber, he was unable to improve his financial situation. When he died, his estate was $200,000 in debt.
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| Number | Title | Issue Date |
| 7535332 | Protective element A protective element has a heat-generating member and a low-melting metal member on a substrate, in which the low-melting metal member is blown out by the heat generated by the heat-generating member, wherein at least two strips of low-melting metal member are provi... | 05/19/2009 |
| 7478052 | Contents market research system, contents market research apparatus, contents polling apparatus, contents market research method, and recording medium A system and method that reduces content selection cost, to commercialize the proper picture content quickly, and to reduce the cost required to research the detailed sales market. Content introduction information is sent to a contents polling apparatus, the content... | 01/13/2009 |
| 7413686 | Conductive particle and adhesive agent A conductive particle can be used for connecting a variety of adherends. The conductive particle includes a resin particle, a first conductive particle disposed around the resin particle, a first resin coating disposed on the periphery of the resin particle. The fir... | 08/19/2008 |
| 7157125 | Doubled-faced tape A double-faced tape according to which, in the case of fixing a liquid crystal display panel and a backlight module together using the double-faced tape, reflection of external light can be reduced as much as possible at the fixed parts, and moreover incident light ... | 01/02/2007 |
| 7074741 | Sublimation thermal transfer recording medium and thermal transfer recording method using the same A sublimation thermal transfer recording medium and a thermal transfer recording method that can remove background stain and the like, and can realize gradation printing with high accuracy and good correlation between the heat quantity applied and the coloring densi... | 07/11/2006 |
| 7034750 | Antenna mounting printed-circuit board A chip-like printed antenna in which an open end is formed by at least two antenna conductors separated from each other is mounted on a printed-circuit board. A ground required by one or plural other modules is disposed and mounted on the printed-circuit board so as... | 04/25/2006 |
| 7025852 | Connecting material and mounting method which uses same A connecting material containing a thermosetting resin has a surface tension of 25 to 40 mN/m (at 25° C.). The connecting material contains a surfactant to adjust the surface tension to 25 to 40 mN/m (at 25° C.). The surfactant is a silicone resin-based surfactant... | 04/11/2006 |
| 6977343 | Heat-sensitive material and heat-sensitive element The invention provides a heat-sensitive material having a heat shrinkable material (e.g., a heat shrinkable resin) having dispersed therein electrically conductive particles, which shrinks on heating to allow an electric current to flow. The invention also provides ... | 12/20/2005 |
| 6918560 | Winding apparatus and feeding apparatus A winding apparatus adaptable to longer films with minimum design changes in existing apparatus has a winding shaft 31 on which a reel member 50 capable of winding a given film at multiple stages can be mounted. The winding shaft 31 can be moved... | 07/19/2005 |
| 6903463 | COG-assembly and connecting material to be used therein A chip-on-glass (COG) assembly, in which the electrodes of the semiconductor chips (3) are held in direct connection with the corresponding electrodes on the substrate glass circuit board (1), utilizes a layer (5) of a connecting material for bo... | 06/07/2005 |
| 6848176 | Process for manufacturing flexible wiring boards A process for manufacturing a flexible wiring board according to the present invention comprises growing metal bumps 16 using a mask film patterned by photolithography. Fine openings can be formed with good precision, therefore, fine metal bumps 16 can... | 02/01/2005 |
| 6831117 | Hardener particle, manufacturing method for hardener particle and adhesive With the hardener particle of the present invention, because siloxane or an alkoxy group is bonded to a central metal located on a surface, an adhesive prepared by dispersing the hardener particles in an epoxy resin together with a silane coupling agent hardly cause... | 12/14/2004 |
| 6812060 | Multilayer flexible wiring boards and processes for manufacturing multilayer flexible wiring boards The present invention provides bumpless ultrasonic bonding of flexible wiring board pieces. A metal coating 26 is formed on the surface of a contact region 181 of a metal wiring 28 of each of two flexible wiring board pieces | 11/02/2004 |
| 6811847 | Printing media A printing medium is manufactured by forming a primer layer 12 and an adhesive layer 13 successively on the rubbed surface of a base film 11 and wound into a roll 15. When the printing medium is delivered from roll 15, adhesive lay... | 11/02/2004 |
| 6809267 | Flexible printed wiring board and its production method In a flexible printed wiring board obtained by connecting metal bumps of a first flexible printed wiring part and connection pads of a second flexible printed wiring part, the first flexible printed wiring part is composed of a conductive layer and insulating layer ... | 10/26/2004 |
| 6808770 | Heat-resistant film and thermal transfer recording medium A heat-resistant film includes a film substrate and a heat-resistant slip layer. The heat-resistant slip layer is disposed on one surface of the film substrate and contains a binder and a slip additive, which is a higher fatty acid metal salt composition containing ... | 10/26/2004 |
| 6794038 | Latent hardener, manufacturing method for latent hardener, and adhesive There is provided an adhesive which hardens under the condition of low temperature within short time and has a high preserving property. The latent hardener of the present invention has hardener particles mainly comprising metal chelate and capsules covering the sur... | 09/21/2004 |
| 6780898 | Adhesive composition An adhesive composition is obtained which has high reactivity and is able to connect even plastic substrates with high connection reliability. The adhesive composition is constituted of insulating resin, photopolymerization initiator, and oxetan compound. ... | 08/24/2004 |
| 6777478 | Adhesive material The adhesive material contains a radical-polymerizable compound, a curing agent, and a thermoplastic resin; gives a negative result of the Ames test; and has a PII, or skin irritation, value of 2 or less. In particular, all the starting ingredients should preferably... | 08/17/2004 |
| 6764765 | Fire-retardant adhesive, fire-retardant adhesive film using the same, and flat cable A fire-retardant adhesive and a fire-retardant adhesive film, which are suitable for producing flat cables using a non-halogen flame-retardant and have fire-retardant properties rivaling those of halogen flame-retardants while maintaining good electrical insulating ... | 07/20/2004 |
| 6753476 | Flame-retardant adhesives and circuit materials with the use of the same Flame-retardant adhesives for circuit materials which are harmless to the environment, show excellent thermo-humidity resistant electrical characteristics and have high flame retardancy. These flame-retardant adhesives contain a saturated polyester resin and ... | 06/22/2004 |
| 6737588 | Processes for manufacturing flexible wiring boards and the resulting flexible wiring board Against a first resin film formed on a first metal film are pressed bumps on a second metal film so that the bumps are embedded into the first resin film. Either one of the first metal film or the second metal film or both is (are) patterned while the bumps are in c... | 05/18/2004 |
| 6696119 | Thermal ink-transfer recording material In a thermal ink-transfer recording material comprising a support, and a primer layer and a thermal transferring ink layer which are superposed on the support in this order, the thermal transferring ink layer comprising a binder and a colorant dispersed i... | 02/24/2004 |
| 6658722 | Process for producing magnetic head suspension (a) A method of manufacturing a magnetic head suspension includes a polyimide precursor layer 2 that is formed over a springy material layer 1, (b) a metal layer 3 for lines is formed over the polyimide precursor layer 2, (c) the metal layer 3 is patterne... | 12/09/2003 |
| 6653736 | Multilayer flexible wiring boards A multilayer flexible wiring board, suited for mounting semiconductor elements. The flexible wiring board is fabricated in the following manner. A flexible wiring board piece having a metal wiring, in which a metal coating is exposed on at least a part of... | 11/25/2003 |
| 6611065 | Connection material The present invention is a connection material which enables a flexible circuit board to be connected to a bare IC chip without causing a shoulder touch effect. The connection material contains an insulating adhesive and a flaky or fibrous insulating fill... | 08/26/2003 |
| 6572022 | Information recording tag An information recording tag contains: an IC module in which a resonance circuit and an IC chip 3 are packaged on a substrate 1 where the resonance circuit has an antenna coil 2 and a film condenser 5; and an adhesive 17 that is applied to the IC module in ord... | 06/03/2003 |
| 6566439 | Lowly-adhesive coating material The present invention provides a lowly-adhesive coating material comprising 99 to 33% by weight of a fluorine-containing acrylic polymer obtained by polymerizing a monomer composition mainly comprising acrylate or methacrylate having C6-16 perf... | 05/20/2003 |
| 6566995 | Protective element A protective element contains a heat-generating member and a low melting metal member on a substrate, in which the low melting metal member is molten by the heat generated by the heat-generating member and flows onto electrodes, which causes the low melti... | 05/20/2003 |
| 6566422 | Connecting material A connecting material for bonding and connecting elements each having electrodes thereon in a correspondingly confronting relation to each other, while attaining electroconductive connection between the corresponding electrodes, which material has a high ... | 05/20/2003 |
| 6562250 | Method for manufacturing wiring circuit boards with bumps and method for forming bumps Wiring circuit boards with bumps can be manufactured such that stable bump connections are possible and plating pre-treatments or other difficult operations are rendered unnecessary. By utilizing a technique whereby a bump-formation etching mask 7 is form... | 05/13/2003 |
| 6559541 | Connection structure for semiconductor electrode terminals A connection structure is configured such that electrodes formed on an overcoat layer on a substrate are connected to other electrode terminals using an anisotropically electroconductive adhesive 30 comprising electroconductive particles dispersed in an i... | 05/06/2003 |
| 6556403 | Protective element A protective element includes at least three electrodes provided on one PTC material. The PTC material operates as at least two PTC elements. This protective element can be manufactured, with fewer components, in an easy manner, and at lower cost, and can... | 04/29/2003 |
| 6527984 | Low temperature-curable connecting material for anisotropically electroconductive connection A low temperature-curable connecting material for anisotropically electroconductive connection, which can be cured at lower temperature with reduction of shrinkage of the material upon curing, whereby an accumulation of internal stresses is avoided to the... | 03/04/2003 |
| 6514433 | Connecting material A connecting material for bonding and connecting elements to be bonded together, each element having electrodes thereon in a correspondingly confronting relationship to each other. The material is highly reliable in the strength of bonding of the elements... | 02/04/2003 |
| 6512184 | Anisotropically electroconductive connection body and method for forming it An anisotropically electroconductive connection body, in which two elements, each having electrodes on a confronting face, are connected with each other. The connection body is made up of a connecting material containing an adhesive component constituted ... | 01/28/2003 |
| 6489417 | Process for producing fluorine-containing acrylic or methacrylic polymers A process for producing a fluorine-containing acrylic or methacrylic polymer, comprises polymerizing a fluorine-containing acrylate or methacrylate in a solution phase formed of an organic solvent and dissolved therein a monomer containing a fluorine-cont... | 12/03/2002 |
| 6451875 | Connecting material for anisotropically electroconductive connection A connecting material for anisotropically electroconductive connection for bonding and connecting a semiconductor element having a plurality of electrodes recessed from the outer face of the passivation layer formed on the semiconductor element, on the on... | 09/17/2002 |
| 6447867 | Epoxy resin composition and optical information recording medium using the same An epoxy resin composition according to the present invention is one initiating cationic polymerization upon irradiation with energy rays. The epoxy resin composition is formed of at least bisphenol type epoxy resin (A) as an active ingredient, epoxy resi... | 09/10/2002 |
| 6445341 | GPS receiver and GPS reception method A GPS receiver is disclosed wherein GPS position measurement can be performed in a short time without the necessity to wait for periodical time information from a GPS satellite and power consumption is minimized also with a minimized position measurement ... | 09/03/2002 |
