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| Number | Title | Issue Date |
| 7144817 | Etching solutions and processes for manufacturing flexible wiring boards The disclosure relates to methods and solutions for precisely and rapidly etching a polyimide resin layer. Etching solutions of the present invention include 3–65% by weight of a diol containing 3 to 6 carbon atoms or a triol containing 4 to 6 carbon atoms, 10–5... | 12/05/2006 |
| 7109058 | Bumpless semiconductor device When connecting a semiconductor device such as an IC chip with a circuit board by the flip-chip method, a semiconductor device is provided without forming bumps thereon, which enables highly reliable and low cost connection between the IC chip and circuit board whil... | 09/19/2006 |
| 7098267 | Polyamic acid varnish composition and a flexible printed board A polyamic acid varnish composition, which is composed of a polyamic acid obtained by the addition polymerization of an diamine and an aromatic acid dianhydride, contains as an additive a specific imidazolyl-diaminoazine. ... | 08/29/2006 |
| 7098132 | Method of manufacturing flexible wiring board In the present invention, a reference conductive layer and a first surface conductive layer are respectively provided on a surface and a back face of a first base film. The first base film includes a first via hole penetrating the first surface conductive layer. Aft... | 08/29/2006 |
| 7088216 | Protective device Protective devices for preventing overcurrent and overvoltage are disclosed. The devices includes a base substrate, a pair of electrodes formed on the base substrate, and a low-melting metal element connected between the pair of electrodes to interrupt the current f... | 08/08/2006 |
| 7079003 | Secondary battery with protective circuit A secondary battery of the present invention a heat-sensitive element which varies in resistance value due to change of temperature is not placed on a path through which a charge or discharge current flows into or out of a storage battery. Accordingly, when a main s... | 07/18/2006 |
| 7076868 | Wiring circuit board having bumps and method of producing same A method of manufacturing a wiring circuit board having bumps is disclosed in which a stable bump connection is possible, and complex operations such as plating pre-treatment are unnecessary. Bumps having a surface roughness on the tip face thereof of 0.2 to 20 μm ... | 07/18/2006 |
| 7053312 | Flexible wiring boards A flexible wiring board are formed by growing metal bumps using a mask film patterned by photolithography. Fine openings can be formed with good precision, therefore, fine metal bumps can be formed with good precision because laser beam is not used to form opening i... | 05/30/2006 |
| 6998000 | Method of adhesion and adhesion apparatus A method of adhesion inhibiting generation of bubbles is provided. Heating, evacuation and centrifugal degassing are performed on an adhesive 37 disposed in an adhesive container 30 to semi-harden the adhesive 37, then a semi-hardened adhesive i... | 02/14/2006 |
| D515128 | Bobbin for heat transfer printing film | 02/14/2006 |
| 6991148 | Process for manufacturing multilayer flexible wiring boards The multilayer flexible wiring board includes first and second patterned wiring layers, a resin film interposed between a surface of the first wiring layer and a surface of the second wiring layer, and a bump connected to the surface of the second wiring layer. The ... | 01/31/2006 |
| 6977349 | Method for manufacturing wiring circuit boards with bumps and method for forming bumps Wiring circuit boards with bumps can be manufactured such that stable bump connections are possible and plating pre-treatments or other difficult operations are rendered unnecessary. By utilizing a technique whereby a bump-formation etching mask 7 is formed o... | 12/20/2005 |
| 6972066 | Roll, roll production apparatus and method for producing roll Rolls easy to be produced are provided. The invention provides a roll which is composed of a main tape cylindrically wound up. The main tape is provided with a first and second holes, respectively, in its winding terminating position and winding initiating position.... | 12/06/2005 |
| 6930390 | Flexible printed wiring boards An object of the present invention is to provide a simple process for manufacturing a flexible printed wiring board having fine metal bumps. A resin coating 21 and a resist film 24 are formed in this order on the surface of a metal film 11 | 08/16/2005 |
| 6926187 | Ultrasonic manufacturing apparatus The present invention pertains to a multilayer flexible wiring board. The multilayer flexible wiring board including first and second patterned wiring layers, a resin film interposed between a surface of the first wiring layer and a surface of the second wiri... | 08/09/2005 |
| 6921782 | Adhesive and electric device A novel adhesive cures quickly at a lower temperature and ensures reliable connection of objects the adhesive connects with each other. The adhesive includes a metal chelate, a silane coupling agent and a thermosetting resin. The silane coupling agent in the adhesiv... | 07/26/2005 |
| 6917505 | Secondary batteries having a protective circuit A protective circuit for a secondary battery is formed with a heater and a thermistor that are connected in parallel, and a main fuse is connected in series with the parallel circuit. In a secondary battery equipped with this protective circuit, a charging/dischargi... | 07/12/2005 |
| 6912779 | Method of manufacturing flexible wiring board In the present invention, a reference conductive layer and a first surface conductive layer are respectively provided on a surface and a back face of a first base film. The first base film includes a first via hole penetrating the first surface conductive layer. Aft... | 07/05/2005 |
| 6879258 | IC card having a mica film for stable resonance frequency and enhanced antenna properties An IC card 10A has a mica capacitor that comprises a mica film 1 and electrodes 6a, 6b formed on both sides thereof, where the mica film 1 serves as a mounting substrate for an antenna coil 2 and an IC chip ... | 04/12/2005 |
| 6861655 | Non-destructive method for testing curing level of cured product of curable adhesive composition and manufacturing method of electronic devices In a method for non-destructively testing the curing level of the cured product of a curable adhesive composition, a fluorescent component that emits fluorescent light upon irradiation with excitation light is added to the curable adhesive composition, the curable a... | 03/01/2005 |
| 6861109 | Recording material for back-printing A recording material for back-printing contains (i) a back-printing sheet comprising a transparent substrate, an ink-absorbing layer that is provided on the transparent substrate, and a porous ink-receiving layer that is provided on the ink-absorbing layer and has f... | 03/01/2005 |
| 6855389 | Photopolymerizable resin compositions for optical recording media and optical recording media The present invention relates to photopolymerizable resin composition inducing substantially no chemical degradation in metals in tight contract with the resin. Further, the present invention relates to optical recording media using the photopolymerizable resins. In... | 02/15/2005 |
| 6846527 | Thermal transfer recording media The present invention provides a thermal transfer recording medium having a solvent-resistant layer based on a polyester resin wherein an even ink layer is formed by coating on the solvent-resistant layer. A thermal transfer recording medium 10 of the ... | 01/25/2005 |
| 6838134 | Recording sheet A recording sheet adaptable to print an image using pigment ink, on which a smear is hardly generated, is provided. A recording sheet includes an ink permeable layer prepared by adding 3-30 parts by weight of a nonionic surfactant including an amine compound as a ma... | 01/04/2005 |
| 6835442 | Flexible printed wiring board A flexible printed board contains an unroughened electrodeposited copper foil, a zinc-based metallic layer provided thereon in an amount of 0.25 to 0.40 mg/dm2, and a polyimide resin layer formed through the imidation of a polyamic acid layer provided on ... | 12/28/2004 |
| 6827880 | Anisotropic conductive adhesive An anisotropic conductive adhesive includes the following components (a) to (d): (a) radical polymerizable compound with bridged hydrocarbon residue, (b) an organic peroxide, (c) a thermoplastic re... | 12/07/2004 |
| 6818266 | Backprinting recording medium A backprinting recording medium includes a transparent substrate, an ink-absorbing layer formed on the transparent substrate and a porous ink-permeable layer formed on the ink-absorbing layer and produced by dispersing a filler in a binder resin, wherein the binder ... | 11/16/2004 |
| 6811851 | Process for producing ridgy resin film and recording medium A ridgy resin film made of a resin is formed. On a flat substrate, a first concave and a second concave are formed such as to be spaced a given distance apart from each other. Then, a resin liquid is supplied onto a land being part of the substrate exposed between t... | 11/02/2004 |
| 6805967 | Polyamic acid varnish composition and a flexible printed board A polyamic acid varnish composition, which is composed of a polyamic acid obtained by the addition polymerization of an diamine and an aromatic acid dianhydride, contains as an additive a specific imidazolyl-diaminoazine. ... | 10/19/2004 |
| 6800816 | Wiring circuit board having bumps and method of producing same A method of manufacturing a wiring circuit board having bumps is disclosed in which a stable bump connection is possible, and complex operations such as plating pre-treatment are unnecessary. Bumps having a surface roughness on the tip face thereof of 0.2 to 20 μm ... | 10/05/2004 |
| 6777038 | Recording material for back printing A recording material for back printing has a transparent substrate; an ink absorbing layer that is provided on the transparent substrate; and a porous ink transmitting layer that is provided on the ink absorbing layer and comprises a filler dispersed in a binder res... | 08/17/2004 |
| 6770957 | Adhesives, adhesive films and electric devices An object of the present invention is to provide an adhesive with which voids are less likely to occur and adherends are not curved. Adhesives of the present invention have excellent dispensability from nozzles of dispensers because the overall specific gravity of t... | 08/03/2004 |
| 6769469 | Process for mounting semiconductor device and mounting apparatus A process for mounting a semiconductor device and a mounting apparatus whereby electrodes of a fine-pitch semiconductor device and a wiring board can be surely connected to each other. A process for mounting a semiconductor device by electrically connecting an elect... | 08/03/2004 |
| 6767631 | Adhesive compositions and adhesive sheets The present invention aims to provide an adhesive composition showing high adhesion and cohesion as well as good heat resistance. Adhesive compositions of the present invention include an imide (meth)acrylate, a monomer having a glass transition temperature of −50... | 07/27/2004 |
| 6760969 | Method for connecting electrical components A method for connecting electrical components is provided. The method includes electrically connecting electrodes on two separate substrates with an anisotropic electroconductive adhesive layer. The thickness of the electroconductive adhesive layer prior to connecti... | 07/13/2004 |
| 6762504 | Release films and adhesive films using the release films The present invention provides an adhesive film for producing an electric device having high reliability. Release agent layer of release film of the present invention is based on a fluorine compound with no silicone oil so that the adhesive force between substrate a... | 07/13/2004 |
| 6729022 | Processes for manufacturing flexible wiring boards and the resulting flexible wiring boards The present invention aims to connect metal films without forming any opening in a resin film. Against a first resin film 16 formed on a first metal film 12 are pressed bumps 21 on a second metal film 11 so that the bumps 21 | 05/04/2004 |
| 6718631 | Process for producing a flexible wiring board Process for producing a flexible wiring board by etching a metal foil halfway to form a thick film part and a thin film part, etching the thin film part in order to form a first wiring film having the thick film part and a second wiring film having the thin film par... | 04/13/2004 |
| 6717064 | Substrate piece and flexible substrate A flexible printed wiring board constructed by using elemental pieces at a low cost. The elemental pieces 81a to 81c according to the present invention are provided respectively with supporting films 24a to 24 | 04/06/2004 |
| 6705007 | Method for manufacturing double-sided flexible printed board A double-sided flexible printed circuit board is manufactured by the following steps of: (a) forming a polyimide precursor layer on a first metal layer; (b) forming a second metal layer on the polyimide precursor layer; (c) patterning the second metal layer to form ... | 03/16/2004 |
