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Patent No. 5823386

Reward Candy Dispenser for Personal Computers

A personal computer peripheral, battery powered reward candy dispenser which immediately presents students with a single candy for each problem completed correctly.

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Assignee: Sony Chemical & Information Device Corporation


Location: Tokyo, JP
No. of patents: 79

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NumberTitleIssue Date
8152945Method for producing display device
A method for producing a display device includes: (A) coating a resin composition, which is a raw material of the cured resin, on at least one of the display part or the protective part, (B) closely attaching the display part and the protective part via the resin co...
04/10/2012
8148641Anisotropic conductive material, connected structure, and production method thereof
An anisotropic conductive material prevents conduction resistance from varying among bumps or among linear terminals when connecting an IC chip or a flexible wire to a wiring board via the anisotropic conductive material. The anisotropic conductive material is forme...
04/03/2012
8147720Latent curing agent
An aluminum chelate-based latent curing agent is provided which can cure a thermosetting epoxy resin at a relatively low temperature in a short period of time. A method for producing such an aluminum chelate-based latent curing agent, whose curing conditions can be ...
04/03/2012
8138421Flat cable
A flexible flat cable capable of having good flexibility and good bending strength while reducing a thickness thereof without damaging a good electrical characteristic of a strip structure and capable of enhancing cost effectiveness is provided. The flexible flat ca...
03/20/2012
8123972Sheet-like soft-magnetic material and production method thereof
The present invention is to impart, to a sheet-like soft magnetic material, a configuration in which sheet thickness change is suppressed and in which fluctuation in magnetic permeability is small even under a high-temperature or a high-temperature, high-humidity en...
02/28/2012
8114243Mounting method using thermocompression head
A mounting method is provided using a thermocompression head which can mount an electric component in a short time with high connection reliability. The method is provided for mounting an electric component on a wiring board by using a thermocompression head having ...
02/14/2012
8113439Antenna apparatus
This invention provides an antenna apparatus (60) for use in a non-contact type IC card into and from which data can be written and read by electronic apparatuses having a communication function, by virtue of inductive coupling. The antenna apparatus comprise...
02/14/2012
8108991Method and device for connecting a wiring board
Connection with an ACF is realized relative to a wiring board having an electronic component mounted on the rear surface thereof with high connection reliability and uniform thermal compression bonding. A thermal compression bonding head 12 is used to apply p...
02/07/2012
8093720Device, method of manufacturing device, board, method of manufacturing board, mounting structure, mounting method, LED display, LED backlight and electronic device
A mounting structure and a mounting method which are capable of securely electrically connecting wiring on a board and a device to each other in the case where the device is mounted on the board, and are capable of forming a finer bump, and increasing the number of ...
01/10/2012
8092636Anisotropic conductive adhesive
An anisotropic conductive adhesive for anisotropic conductive connection of an electronic component to a wiring board under no pressure or a low pressure is prepared by dispersing conductive particles in a binder resin composition. A metal flake powder having a majo...
01/10/2012
8087967Image display device and its manufacturing method with particular light-heat-curing resin composition
Manufacture a highly reliable image display device capable of proceeding with resin cure even in the case where a protective panel is provided with a light shielding portion. A liquid crystal display unit 2 having a liquid crystal display panel 8 and a...
01/03/2012
8076437Encapsulant material for optical component and light-emitting device
A light-emitting device is provided which uses an encapsulant material made from a polymer having a high relative light output. The light-emitting device includes a light-emitting element and a member sealing the light-emitting element. The encapsulant material has ...
12/13/2011
8067514Anisotropic conductive film
An anisotropic conductive film is provided which can provide high bonding strength and good conduction reliability when anisotropic conductive bonding is made under the compression bonding conditions of a compression bonding temperature of at most 130° C. for a com...
11/29/2011
8059062Antenna circuit and transponder
An antenna circuit and a transponder with the antenna circuit are provided for forming a resonant circuit. The antenna circuit includes a substrate, an antenna conductor, and a sheet metal. The antenna conductor includes an antenna coil formed in a predetermined con...
11/15/2011
8048254Mounting method
A mounting method is provided for mounting electric components on both faces of a substrate. Because the electric components on a front face and a rear face of the substrate are simultaneously pressed with first and second pressing rubbers, the electric components c...
11/01/2011
8039522Latent curing agent
An aluminum chelating agent-based latent curing agent is provided that can rapidly cure thermosetting epoxy resins at relatively low temperatures. A method for producing the aluminum chelating agent-based latent curing agent is also provided that enables relatively ...
10/18/2011
8034849Adhesive composition and adhesive sheet
A pressure-sensitive adhesive composition capable of giving a pressure-sensitive adhesive sheet which simultaneously realizes satisfactory holding power, adhesion, and peel resistance in peeling from curved surfaces, while balancing these properties, and has satisfa...
10/11/2011
8022126Encapsulating resin composition and light-emitting device
An encapsulating resin composition is provided, which gives a cured product having heat resistance, light resistance, and flexibility equivalent to those of silicone resins and having a refractive index of 1.57 or greater which is larger than that of epoxy resins. T...
09/20/2011
8011407Compression bonding device
A compression bonding device has a dam member so that when a pressing head is pressed against an object to be pressed, the bonding part is surrounded by the dam member. Thus, even if the surface of the bonding part bulges by pressing, the bulging part is stopped by ...
09/06/2011
7963030Multilayer printed circuit board and method for manufacturing same
Disclosed is a multilayer wiring board in which a copper foil is bonded by a thermocompression bonding onto an insulating layer having a bump for interlayer connection buried therein, and the copper foil and the bump are electrically connected to each other. The cop...
06/21/2011
7931956Anisotropic conductive film, method for producing the same, and bonded structure
Provided is an anisotropic conductive film, containing: an insulating layer formed of an insulating resin composition; and a conductive particle-contained layer containing a photo and thermal curing resin composition and conductive particles, the conductive particle...
04/26/2011
7927533Method for manufacturing image display device
A thin image display device having a resin interposed between an image display unit and a protection member having a light-shielding member is manufactured. In the manufactured image display device, display defects caused by the deformation of the image display unit...
04/19/2011
7910033Method for manufacturing image display device
A method for manufacturing an image display device includes the step of forming a cured resin layer 15 by interposing a photo-curable resin composition between a base 2 including an image display unit such as a liquid crystal display panel 8 and a ligh...
03/22/2011
7901768Multilayer anisotropic conductive adhesive and connection structure using the same
A multilayer anisotropic conductive adhesive a plurality of adhesive layers that are laminated, each of which contains an insulating resin and a hardening agent. The conductive particles are contained either in a first plurality of adhesive layers or in a second plu...
03/08/2011
7846547Insulation-coated conductive particle
To provide both an excellent solvent-resistance and a conduction reliability to an insulation coated conductive particle that is suitable for use as a conductive particle in an anisotropic conductive adhesive, the insulation coated conductive particle is configured ...
12/07/2010
7846220Electrochemical cell and production method thereof
An electrochemical cell, and a method of producing an electrochemical cell are provided. The method includes a step in which a counter electrode film and a mold film are crimped. A sol-gel precursor is inserted into a pore in the mold film provided on the counter el...
12/07/2010
7868109Curable resin composition
A curable resin composition is provided which has an appropriate viscosity suitable for encapsulating a light-emitting device. The cured product of the curable resin composition has a refractive index equal to or larger than that of epoxy resins, is excellent in hea...
01/11/2011
7851520Thermosetting epoxy resin composition
The thermosetting epoxy resin composition of the present invention includes an aluminum chelate/silanol curing catalyst system, an epoxy resin, and an anion-trapping agent. The anion-trapping agent is preferably an aromatic phenol derivative or an acid anhydride. Ex...
12/14/2010
7842886Transmission cable
A transmission cable includes multiple signal lines formed on one side of an insulation layer and a ground line between the signal lines. The ground line is electrically connected to a shield layer formed on a back surface side of the insulation layer and to a noise...
11/30/2010
7829743Sulfonium borate complex
A novel sulfonium borate complex, which can reduce the amount of fluorine ions produced during thermal cationic polymerization, and realize low-temperature, rapid curing properties in a thermal cationic polymerizable adhesive, is represented by the structure of the ...
11/09/2010
7824754Peeling sheet with adhesive of epoxy acrylate, non-unsaturated resin and bis(methacryloyloxyethyl) hydrogen phosphate
An insulating adhesive film and an anisotropically electroconductive adhesive film satisfying low-temperature curability, high adhesion and high reliability are provided. An anisotropically electroconductive adhesive film of the present invention is so configured th...
11/02/2010
7812264Functional element-mounted module and a method for producing the same
A functional element-mounted module can be decreased in size and requires no costly and special members for a light transition member. A substrate is used, on which an optical functional element having an optical function part and bonding pads therearound is mounted...
10/12/2010
RE41784Adhesive material
The adhesive material contains a radical-polymerizable compound, a curing agent, and a thermoplastic resin; gives a negative result of the Ames test; and has a PII, or skin irritation, value of 2 or less. In particular, all the starting ingredients should preferably...
09/28/2010
7781524Releasing composition
A releasing composition capable of improving abrasion resistance includes a releasing composition containing releasing particles in a film forming material, and the releasing particle has a first releasing resin as a core material and a second releasing resin as a c...
08/24/2010
7754790Adhesive of epoxy acrylate, non-unsaturated resin and bis(methacryloylethyl) hydrogen phosphate
An insulating adhesive film and an anisotropically electroconductive adhesive film satisfying low-temperature curability, high adhesion and high reliability are provided. An anisotropically electroconductive adhesive film of the present invention is so configured th...
07/13/2010
7745731Transmission cable
A transmission cable and method for manufacturing same are provided. A plurality of signal lines are formed on one side of an insulating layer and ground lines are formed between the signal lines. The ground lines are electrically connected with a shield layer forme...
06/29/2010
7744979Compositions for protective films for optical discs
Compositions for protective films include inorganic microparticles dispersed in an acrylic radical-based binder resin. Binder resins are formed from binder monomers including base components, scratch-resistant components and diluent components. Diluent components in...
06/29/2010
7736459Compression bonding device and a mounting method
A compression bonding device has a dam member so that when a pressing head is pressed against an object to be pressed, the bonding part is surrounded by the dam member. Thus, even if the surface of the bonding part bulges by pressing, the bulging part is stopped by ...
06/15/2010
7732078Non-aqueous electrolyte battery pack comprising a liquid-absorbent composition
A liquid-absorbent composition, which has a liquid-absorbent crosslinked resin that exhibits excellent absorption of the nonaqueous electrolyte of nonaqueous electrolyte secondary cells that constitute a nonaqueous electrolyte battery pack (and particularly a lithiu...
06/08/2010
7727819Process for producing a functional device-mounted module
The present disclosure provides an optical functional device-mounted module which needs no expensive or special members, can be reduced in size, and provide a producing process thereof. A bank to dam a liquid sealing resin is provided on a substrate around an optica...
06/01/2010
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