Did You Know...
...that in the early 1940s GE engineer James Wright was charged with a task of utmost importance to the war effort: develop a cheap substitute for rubber that could be used to produce tires, gas masks and a whole host of military gear. Wright tackled the task diligently -- and wound up inventing Silly Putty.
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| Number | Title | Issue Date |
| 7547571 | Packaging method of a light-sensing semiconductor device and packaging structure thereof The present invention discloses a packaging method of a light-sensing semiconductor device and a packaging structure thereof, wherein a matrix of spacer walls is formed on a light-sensing wafer, which has multiple light-sensing chips, and the adhesive is directly ap... | 06/16/2009 |
| 7405456 | Optical sensor chip package The present invention relates to an optical sensor chip package in a cavity of forming frame thereof and has a gap between protection layer and optical sensor chip. The optical sensor chip avoids accepting the pressure from protection layer that damage the reliabili... | 07/29/2008 |
| 7358482 | Packaging structure of a light-sensing element and fabrication method thereof The present invention discloses a packaging structure of a light-sensing element and a fabrication method thereof, wherein the light-sensing chip is installed on the substrate, and then a cleaning step is undertaken; next, a light transparent cover with a cavity is ... | 04/15/2008 |
| 7323675 | Packaging structure of a light-sensing device with a spacer wall The present invention discloses a packaging structure of a light-sensing device with a spacer wall, wherein a spacer wall is used to protect the light-sensing region from external pollutants or two spacer walls are used to confine the glue to therebetween lest the o... | 01/29/2008 |
| 7297918 | Image sensor package structure and image sensing module An image sensor package structure and an image sensing module are proposed. A substrate, a frame and a light transparent layer are used to package an image sensing chip to form the image sensor package structure. The frame is mounted on the substrate and located aro... | 11/20/2007 |
| 7282788 | Image sensing chip package structure In an image sensing chip package structure, plated through vias penetrate a substrate to electrically connect metallization traces disposed on the upper and lower surfaces of the substrate. The plated through vias can be opened from the center of the substrate inste... | 10/16/2007 |
