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Assignee: Siemens VDO Automotive Aktiengesellschaft


Location: Munich, DE
No. of patents: 1

NumberTitleIssue Date
7542291Electronic circuit configuration having a printed circuit board thermally coupled to a heat sink
In order to improve the heat dissipation capacity in an electronic circuit configuration with one or more printed circuit boards thermally coupled by one flat side to a heat sink having at least one coolant duct, the flat side immediately adjoins the coolant duct.
06/02/2009
 
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