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| Number | Title | Issue Date |
| 8179692 | Board having connection terminal A board includes a board body; a first conductor provided at a first surface of the board body; and an electrically conductive connection terminal having a spring property. The connection terminal includes a first end part fixed to the first conductor; a second end ... | 05/15/2012 |
| 8179689 | Printed circuit board, method of fabricating printed circuit board, and semiconductor device A printed circuit board has capacitors, a grounding wiring pattern having a bonding surface on which a semiconductor device is bonded, and a contact surface located opposite from the bonding surface thereof and coupled to first electrodes of the capacitors, and a po... | 05/15/2012 |
| 8174109 | Electronic device and method of manufacturing same An electronic device includes a first semiconductor device and a second semiconductor device. The first semiconductor device includes a first electronic component, a first sealing resin, and a first multilayer interconnection structure including a first interconnect... | 05/08/2012 |
| 8169072 | Semiconductor device, manufacturing method thereof, and electronic device A disclosed semiconductor device includes a reinforcing board having first and second faces, an electronic part accommodating portion penetrating the reinforcing board, a through hole, an electronic part having a front face on which an electrode pad is formed and a ... | 05/01/2012 |
| 8168452 | Method for manufacturing semiconductor device A method for manufacturing a semiconductor device, the semiconductor device including an integrated circuit having plural connection terminals arranged on a predetermined local region of the integrated circuit, plural metal bumps, and a wiring layer connected to at ... | 05/01/2012 |
| 8152535 | Socket having two relay boards and a frame for holding a terminal to connect an electronic device to a mounting board A socket includes a first relay board provided above a mounting board; a second relay board detachably provided above the first relay board; and a frame part provided at side parts of the first relay board and the second relay board, wherein the frame part is config... | 04/10/2012 |
| 8138609 | Semiconductor device and method of manufacturing semiconductor device In a semiconductor device, a substrate includes a plurality of line conductors which penetrate the substrate from a top surface to a bottom surface of the substrate. A semiconductor chip is secured in a hole of the substrate. A first insulating layer is formed on th... | 03/20/2012 |
| 8138018 | Manufacturing method of semiconductor device having underfill resin formed without void between semiconductor chip and wiring board A manufacturing method of a semiconductor device includes a film state underfill resin adhering step wherein film state underfill resin in a semi-cured state is adhered on the first surface of the board main body without forming a gap between the first surface of th... | 03/20/2012 |
| 8130500 | Thermal conductive member, manufacturing method of the thermal conductive member, heat radiating component, and semiconductor package A thermal conductive member includes linear high thermal conductivity materials; a first solder layer provided at first end sides of the linear high thermal conductivity materials; and a second solder layer provided at second end sides of the linear high thermal con... | 03/06/2012 |
| 8129259 | Manufacturing method of preparing a substrate with forming and removing the check patterns in scribing regions before dicing to form semiconductor device A disclosed device includes a manufacturing method of semiconductor device including preparing a semiconductor substrate including semiconductor chip forming regions, scribing regions surrounding these regions, and cutting regions formed in the scribing regions and ... | 03/06/2012 |
| 8083529 | Socket A socket includes a first relay board mounted on a mounting board, a second relay board detachably mounted on the first relay board, and a frame part fixed to the first relay board. The frame part positions and holds the first and second relay boards, and positions ... | 12/27/2011 |
| 8066862 | Manufacturing method of wiring board A manufacturing method of a wiring board includes a sticking layer forming step; a resist film forming step of forming a resist film on an upper surface of the sticking layer, the resist film having an opening exposing the upper surface of the sticking layer; a meta... | 11/29/2011 |
| 8058717 | Laminated body of semiconductor chips including pads mutually connected to conductive member A semiconductor chip laminated body includes a wiring board having a connecting terminal; a plurality of semiconductor chips laminated on the wiring board, each of the semiconductor chips having a pad; conductive connecting members having first end parts connected t... | 11/15/2011 |
| 8053886 | Semiconductor package and manufacturing method thereof A semiconductor package includes a wiring board and a semiconductor device mounted on the wiring board. At least one penetration hole extends from one surface of the semiconductor chip to an opposite surface of the semiconductor chip. A penetration electrode is situ... | 11/08/2011 |
| 8053680 | Wiring board having efficiently arranged pads A wiring board includes a plate-shaped resin member; chip connection pads provided in the resin member, the chip connection pads having connection surfaces electrically connected to electrode pads provided on a semiconductor chip, the connection surfaces being situa... | 11/08/2011 |
| 8043514 | Method of manufacturing a wiring board by utilizing electro plating When a wiring pattern is formed on a wiring board utilizing electroplating, an unnecessary portion is removed by proceeding as follows. First electroless plating layers are formed on both sides of an insulating substrate, which are covered with metallic foils in adv... | 10/25/2011 |
| 8017503 | Manufacturing method of semiconductor package A manufacturing method includes forming a semi-cured insulation layer made of a photosensitive material on a supporting body; forming an opening part in the insulation layer by a photolithography method, the opening part being configured to expose the supporting bod... | 09/13/2011 |
| 8008123 | Manufacturing method of semiconductor device A manufacturing method of a semiconductor device, including a first step of forming a first electrode pad at an external edge part of a semiconductor chip mounting area of a supporting board; a second step of fixing a rear surface of a semiconductor chip having a ma... | 08/30/2011 |
| 7913906 | Reader/writer and manufacturing method thereof A reader/writer comprises a circuit board, a communication control portion mounted on the circuit board and configured to perform communication with IC tags, sealing resin for sealing the communication control portion; and an antenna electrically connected to the co... | 03/29/2011 |
| 7890203 | Wiring forming system and wiring forming method for forming wiring on wiring board A wiring forming system comprises: maskless exposure unit which directly exposes an unexposed board by using exposure data generated based on design data relating to an wiring board; post-development inspect unit which tests the board after development, by using the... | 02/15/2011 |
| 7888953 | Probe card A probe card is disclosed that includes a board having a first surface and a second surface facing away from each other and a through hole formed between the first and second surfaces; and a probe needle having a penetration part and a support part. The penetration ... | 02/15/2011 |
| 7865052 | Optical waveguide having an optical transmission direction changing part An optical waveguide includes: a first clad layer; a core layer formed on the first clad layer; a second clad layer formed on the core layer; and an optical transmission direction changing part. The optical transmission direction changing part is configured and arra... | 01/04/2011 |
| 7843059 | Electronic parts packaging structure In an electronic parts packaging structure of the present invention constructed by stacking a plurality of sheet-like units in a thickness direction, each of the units includes a first insulating layer, wirings formed on one surface of the first insulating layer, a ... | 11/30/2010 |
| 7838982 | Semiconductor package having connecting bumps A semiconductor package and a fabrication method thereof are disclosed, whereby an environmental problem is solved by using external connection terminals or semiconductor element-mounting terminals containing a smaller amount of lead, while at the same time achievin... | 11/23/2010 |
| 7816177 | Semiconductor device and method of manufacturing the same In a semiconductor device, via holes are formed around a chip buried in a package, one end of a conductor filled in the via hole is covered with a pad portion exposed to the outside, and a wiring layer connected to the other end of the conductor is formed. The porti... | 10/19/2010 |
| 7803491 | Solid electrolyte fuel cell configuration A solid electrolyte fuel cell configuration provided with a single sheet shaped solid electrolyte substrate formed with a plurality of fuel cells and thereby not having a sealed structure, achieving a reduction of the size and a reduction of the cost, and able to im... | 09/28/2010 |
| 7796851 | Manufacturing method of optical waveguide, optical waveguide and optical reception/transmission apparatus A manufacturing method of an optical waveguide, the optical waveguide including a first clad layer; a core layer formed on the first clad layer and configured to propagate light; a second clad layer formed on the first clad layer so as to cover the core layer; and a... | 09/14/2010 |
| 7793412 | Component-embedded board fabrication method A component-embedded board fabrication method includes detecting, before the board is covered with a first insulating layer, the actual position of a first electronic component formed on a surface of the board, calculating a displacement between the design position ... | 09/14/2010 |
| 7790359 | Plating method A method of forming an electrode on a semiconductor wafer by plating is disclosed that is able to reliably prevent leakage of a plating solution during the plating process. The plating method comprises the steps of forming a conductive layer on a semiconductor wafer... | 09/07/2010 |
| 7772118 | Substrate having high electrical connection reliability of a penetrating via connected to wirings and a method for manufacturing the same A disclosed substrate is composed of a base member having a through-hole, a penetrating via provided in the through-hole, and a wiring connected to the penetrating via. The penetrating via includes a penetrating part having two ends on both sides of the base member,... | 08/10/2010 |
| 7771886 | Fuel cell A solid oxide fuel cell comprising a fuel cell unit which comprises an anode layer made of an electrically conducting mesh and an anode-forming material carried by this mesh, a cathode layer made of an electrically conducting mesh and a cathode-forming material carr... | 08/10/2010 |
| 7754535 | Method of manufacturing chip integrated substrate There are provided the steps of connecting a chip component 13 to a first substrate 10 through wire bonding, providing, on a second substrate 20, an electrode 21 having a solder coat 23 with a copper core 22, polishing a por... | 07/13/2010 |
| 7750358 | Semiconductor device and manufacturing method of semiconductor device A semiconductor device made by mounting a light emitting element in a substrate, characterized in that an optically-transparent cover with a flat plate shape is installed on the light emitting element and a fluorescent substance film is formed on the cover. ... | 07/06/2010 |
| 7747111 | Optical waveguide mounted substrate and method of producing the same Openings are disposed in an insulating layer to expose a conductor layer. A lower cladding layer is formed, and a resist layer is formed on an insulating layer and the lower cladding layer. Electrolytic plating is performed with using the conductor layer which is co... | 06/29/2010 |
| 7734124 | Optical waveguide and method of manufacturing the same, and method of manufacturing optical/electrical hybrid substrate An optical waveguide includes an optical waveguide main body and mirrors. The optical waveguide main body includes a first cladding layer, a second cladding layer and a core portion provided between the first cladding layer and the second cladding layer. The optical... | 06/08/2010 |
| 7728283 | Illuminance detecting apparatus comprising a light shielding element containing openings for each detector element An illuminance detecting component includes: a supporting substrate including a substrate body made of silicon, and pads provided on an upper surface of the substrate body; a plurality of light receiving elements connected electrically to the pads and receiving ligh... | 06/01/2010 |
| 7727802 | Method for fabricating an electronic component embedded substrate A method for fabricating an electronic component embedded substrate including an electronic component that is embedded within a buildup layer is disclosed. The method includes a first buildup layer lamination step of laminating plural first buildup layers on a core ... | 06/01/2010 |
| 7722980 | Solid oxide fuel cell directly utilizing flame A solid oxide fuel cell that directly utilizes a flame according to the present invention has a solid oxide substrate, a cathode electrode layer formed on one surface, and an anode electrode layer 3 formed on the opposite surface and a platinum mesh is embedd... | 05/25/2010 |
| 7721083 | CPU runaway determination circuit and CPU runaway determination method A CPU reads a clear pattern held in a register in a watchdog timer when a system is booted up or reset, thereby determining whether or not the boot-up or the reset is a reset performed by the system or a reset due to runaway of a program to be executed and performin... | 05/18/2010 |
| 7720327 | Optical waveguide mounted substrate and method of producing the same A lower cladding layer is formed on a surface of an electrical circuit substrate. A UV curable resin layer is stacked on the lower cladding layer. The resin layer is partly cured, and the other uncured resin layer is removed, thereby forming resin projections. The r... | 05/18/2010 |
