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| Number | Title | Issue Date |
| 7279116 | Method for the wet treatment of disk-like objects The invention relates to a method for the treatment of disk-like objects with one first liquid and at least one second liquid at least in a defined edge region of a disk-like object. ... | 10/09/2007 |
| 7270510 | Device and method for transporting wafer-shaped articles An apparatus for treating wafer-shaped articles includes at least one linear arranged array of a plurality of at least two process units wherein in each such process unit one single wafer-shaped article can be treated, a cassette-holding unit for holding at least on... | 09/18/2007 |
| 7267129 | Device and process for liquid treatment of wafer-shaped articles A device for liquid treatment of a defined area of a wafer-shaped article, especially of a wafer, near the edge, in which the liquid is applied to a first surface, flows essentially radially to the outside to the peripheral-side edge of the wafer-shaped article and ... | 09/11/2007 |
| 7179753 | Process for planarizing substrates of semiconductor technology In a process for planarization of semiconductor substrates in which a layer which has been applied to a semiconductor substrate which has a trench and/or contact holes is removed such that the layer remains solely in the area of the trenches or contact holes, instea... | 02/20/2007 |
| 7057973 | Method and device for measuring cavitation A method, probe, and system for detecting presence of cavitation in a fluid and measuring cavitation density and intensity of a specific locale in the fluid. A first cavitation void and associated energy perturbation, produced in a first fluid, moves within the firs... | 06/06/2006 |
| 7007702 | Device and process for liquid treatment of wafer-shaped articles A device for liquid treatment of a defined area of a wafer-shaped article, especially of a wafer, near the edge, in which the liquid is applied to a first surface, flows essentially radially to the outside to the peripheral-side edge of the wafer-shaped article and ... | 03/07/2006 |
| 6858092 | Device and process for liquid treatment of wafer-shaped articles A device for liquid treatment of a defined area of a wafer-shaped article, especially of a wafer, near the edge, in which the liquid is applied to a first surface, flows essentially radially to the outside to the peripheral-side edge of the wafer-shaped article and ... | 02/22/2005 |
