Bizarre Patents
An automatic bed maker which uses the expansion of inflatable bladder to straighten, align, and tuck-in bed-cover assembly.
PatentStorm News
Make the Most of Our Site
See this month's Top Inventors and Most Cited Patents.
Stay on top of the latest innovations by subscribing to an RSS feed.
Registered users: Manage your profile.
| Number | Title | Issue Date |
| 8091758 | Wave soldering bath In a conventional wave soldering bath, molten solder spouted from a second discharge nozzle did not have a uniform height, oxides were spouted from the nozzle opening and adhered to printed circuit boards, and constituent parts of the wave soldering bath were eroded... | 01/10/2012 |
| 8084717 | Reflow furnace The suction ports of a hot air blowing heater are arranged in a zigzag shape crossing the direction of travel of a printed circuit board, and hot air discharge nozzles project from inside or alongside the suction ports. Accordingly, in the reflow furnace according t... | 12/27/2011 |
| 7988031 | Reflow furnace and heater for blowing hot air A reflow furnace using a conventional heater for blowing hot air has difficulty in reducing Δt and in stabilizing the oxygen concentration at a low level. In addition, it is difficult to uniformly discharge hot air from the discharge holes in a perforated plate of ... | 08/02/2011 |
| 7988030 | Wave soldering bath In a conventional wave soldering bath, the bottom surface of a bath body in a position which is below the inlet of a duct underwent erosion by molten solder and had a hole formed therein, causing molten solder to be spilled out from the hole. The cause of erosion of... | 08/02/2011 |
| 7976608 | Method and apparatus for manufacturing low melting point metal fine particles In a solder paste which is a mixture of a flux and low melting point metal particles, low melting point metal fine particles manufactured by a conventional method or apparatus therefor include particles having widely varying particle diameters. Accordingly, the sold... | 07/12/2011 |
| 7959055 | Wave soldering tank In a wave soldering tank using a conventional screw pump, pulsation sometimes occurred in which molten solder spouting from the discharge nozzle moved up and down. The cause of the occurrence of the pulsation in a screw pump was that the gap between the screw pump a... | 06/14/2011 |
| 7914595 | Fume removal method for a reflow furnace and a reflow furnace In a conventional reflow furnace equipped with a fume removal device, fume solids adhere to the inside of piping connecting it to the removal device, and a great amount of trouble was required for removal of the fume solids. The present invention maintains a fumes-c... | 03/29/2011 |
| 7906222 | Sliding material and a method for its manufacture A sliding material has a sintered layer formed atop a backing plate. The sintered layer contains 5-15 mass % of Bi nonuniformly distributed in a Cu—Sn alloy matrix consisting essentially of 8-12 mass % of Sn and a remainder of Cu. The sliding material can be manuf... | 03/15/2011 |
| 7905382 | Wave soldering tank A wave soldering tank is provided on which it is easy to perform maintenance, which does not have fluctuation of the height of spouted solder, which does not damage the rotating shaft of a discharge pump, and which can be stably used for long periods. The wav... | 03/15/2011 |
| 7854996 | Sliding material and a method for its manufacture A conventional Bi-containing sliding material sometimes underwent seizing in a sliding part operating at a high rotational speed. The present invention provides a sliding material which does not undergo seizing in a sliding part operating at a high rotational speed ... | 12/21/2010 |
| 7810772 | Column suction-holding head and column mounting method A column suction-holding head capable of inserting columns into all the holes of a mounting jig collectively at once. The body of the column suction-holding head has elongate holes at the same positions as those of electrodes installed on a ceramic substrate of a ce... | 10/12/2010 |
| 7800230 | Solder preform and electronic component A solder preform according to the present invention has a variation in the size of high melting point metal particles which is at most 20 micrometers when the metal particle diameter is 50 micrometers, and an alloy layer of the high melting point metal particles and... | 09/21/2010 |
| 7793820 | Solder preform and a process for its manufacture A mixed mother alloy is prepared from a solder mixture comprising a pyrolyzable flux and high melting point metal particles, the mixed mother alloy is charged into a large amount of molten solder and stirred, and a billet is prepared. The billet can then be extruded... | 09/14/2010 |
| 7750475 | Lead-free solder ball A Sn—Ag—Cu based lead-free solder ball which does not undergo yellowing of its surface when formed into a solder bump on an electrode of an electronic part such as a BGA package. The solder ball has excellent wettability and does not form voids at the time of so... | 07/06/2010 |
| 7682468 | Lead-free solder alloy A lead-free solder alloy suitable for use in flow soldering of electronic components to printed wiring boards comprises 0.1-3 wt % of Cu, 0.001-0.1 wt % of P, optionally 0.001-0.1 wt % of Ge, and a balance of Sn. The solder alloy may further contain at least one ele... | 03/23/2010 |
| 7681777 | Solder paste and printed circuit board In a solder paste formed by blending an alloy powder and a flux, the alloy powder is a powder mixture formed by mixing at least one powder of a Sn—Zn based alloy and at least one powder of a Sn—Ag based alloy. The alloys powders are blended so that the compositi... | 03/23/2010 |
| 7628308 | Method of replenishing an oxidation suppressing element in a solder bath The rate of decrease of an oxidation suppressing element in a solder bath is measured during a soldering operation. Soldering is then carried out while replenishing the solder bath is then replenished during soldering so as to maintain the surface level of molten so... | 12/08/2009 |
| 6935553 | Reflow soldering method A soldering method includes exposing a solder paste including a solder powder and a flux on a member to a free radical gas and heating the solder paste to reflow the solder paste and vaporize any active components in the solder paste. Any flux residue is free of act... | 08/30/2005 |
| 7537728 | Method for increasing the effectiveness of a component of a material A manufacturing method for a material increases the effectiveness of a component so the component can be present in an amount which does not produce undesirable effects. A material is prepared containing the component in a first concentration. The component is at le... | 05/26/2009 |
| 7524748 | Method of interconnecting terminals and method of mounting semiconductor devices A method of interconnecting terminals so as to obtain an excellent electrical connection between terminals such as opposing electrodes and a mounting method for semiconductor devices using this connecting method are provided. Electrode pads 21 of a semiconduc... | 04/28/2009 |
| 7451805 | Pouring apparatus for molten metal and casting method A pouring apparatus for molten metal includes a stirrer installed in a reservoir. The stirrer is rotated by a rotational drive mechanism installed on the reservoir. Molten solder is placed into the reservoir, high melting point metal particles are charged into the m... | 11/18/2008 |
| 7425299 | Lead-free solder balls and method for the production thereof Lead-free solder balls having a good surface appearance with no appreciable surface defects such as seams and shrinkage cavities comprises an alloy having a composition consisting essentially of about 4.0% to about 6.0% by weight of Ag, about 1.0% to about 2.0% by w... | 09/16/2008 |
| 7338567 | Lead-free solder alloy A lead-free solder alloy suitable for use in flow soldering of electronic components to printed wiring boards comprises 0.1-3 wt % of Cu, 0.001-0.1 wt % of P, optionally 0.001-0.1 wt % of Ge, and a balance of Sn. The solder alloy may further contain at least one ele... | 03/04/2008 |
| 7282175 | Lead-free solder A lead-free solder includes 0.05-5 mass % of Ag, 0.01-0.5 mass % of Cu, at least one of P, Ge, Ga, Al, and Si in a total amount of 0.001-0.05 mass %, and a remainder of Sn. One or more of a transition element for improving resistance to heat cycles, a melting point ... | 10/16/2007 |
| 7282174 | Lead-free solder and soldered article The present invention provides a Sn—Zn based lead-free solder which can prevent peeling of solder from soldered portions even after the passage of long periods after soldering of portions to be soldered made of Cu. A Sn—Zn based lead-free solder according to the... | 10/16/2007 |
| 7255933 | Multi-layer sliding part and a method for its manufacture A multi-layer sliding part is prepared by a process including mixing 1–50 parts by volume of a Cu-plated solid lubricant powder with 100 parts by volume of a Cu-based alloy powder comprising 5–20 mass % of Sn and a remainder of Cu to form a mixed powder, sinteri... | 08/14/2007 |
| 7195825 | Multi-layer sliding part and a method for its manufacture A multi-layer sliding part is prepared by a process including mixing 1–50 parts by volume of a Cu-plated solid lubricant powder with 100 parts by volume of a Cu-based alloy powder comprising 5–20 mass % of Sn and a remainder of Cu to form a mixed powder, sinteri... | 03/27/2007 |
| 7182240 | Solder coated lid A solder coated lid for a package for an electronic device has a lead-free solder layer comprising a Sn—Sb based solder with a liquidus temperature of at least 220 degrees C. provided on at least a region of the lid where the lid is to be joined to a base of a pac... | 02/27/2007 |
| 7172726 | Lead-free solder A lead-free solder which is significantly less susceptible to copper leaching when used in a molten state in which coil ends of copper wire are dipped comprises 1.5–8 mass % of Cu, 0.01–2 mass % of Co, optionally 0.01–1 mass % of Ni, and a remainder of Sn and ... | 02/06/2007 |
| 7142435 | Lid for use in packaging an electronic device and method of manufacturing the lid A lid for use with a plate-shaped base to seal an electronic device such as a SAW device includes a top portion, a wall structure extending from the top portion, and a lip connected to the lower end of the wall structure. The lip extends outwards from an outer surfa... | 11/28/2006 |
| 7132020 | Solder for use on surfaces coated with nickel by electroless plating A solder which can form a soldered joint of good bonding strength on a Ni layer containing a small amount of P formed from electroless Ni plating with a P-containing plating solution comprises 60–64 mass % of Sn, 0.002–0.01 mass % of P, 0.04–0.3 mass % of Cu, ... | 11/07/2006 |
| 7112888 | Solder ball assembly for bump formation and method for its manufacture A solder ball assembly for use in the formation of solder bumps on electrodes of a substrate for electronic components includes a heat-resisting sheet having a plurality of holes formed therein. Each hole has a solder ball disposed therein. The sheet includes an adh... | 09/26/2006 |
| 7097090 | Solder ball A solder ball is formed from an Sn—Pb alloy which consists essentially of about 2–65 mass % of Sn, 0–5 mass % of Ag, about 0.1–1 mass % of Sb, and 0.01–0.1 mass % of Cu, and 0.01–0.1 mass % of Bi, and a balance of Pb and incidental impurities. The solder... | 08/29/2006 |
| 7029542 | Lead-free solder alloy A lead-free solder alloy comprises 1.0–5.0 wt % Ag, 0.01–0.5 wt % Ni, one or both of (a) 0.001–0.05 wt % Co and (b) at least one of P, Ge, and Ga in a total amount of 0.001–0.05 wt %, and a remainder of Sn. The solder can form solder bumps which have a high ... | 04/18/2006 |
| D517384 | Wire solder applicator | 03/21/2006 |
| 6955285 | Apparatus for aligning and dispensing solder columns in an array An apparatus for aligning and dispensing a plurality of solder columns in an array. The apparatus includes a vibrator and an elongated alignment plate supported on the vibrator. The alignment plate includes a plurality of longitudinal guide grooves. A transparent co... | 10/18/2005 |
| 6926849 | Solder paste A solder paste comprising a powder of a Zn-containing Sn-based, lead-free solder mixed with an activator-containing rosin-based flux to which 0.5-10.0 wt % of isocyanuric acid or a haloalkyl ester thereof is added can prevent the formation of solder balls and voids ... | 08/09/2005 |
| 6919634 | Solder ball assembly, a method for its manufacture, and a method of forming solder bumps A solder ball assembly includes a mask having first and second sides and a plurality of holes formed therein. Each hole has a first end opening onto the first side of the mask and a second end. A plurality of solder balls are disposed in the holes, and a fixing agen... | 07/19/2005 |
| 6915941 | Method for local application of solder to preselected areas on a printed circuit board A method for locally applying solder to a set of preselected conductor areas on a printed circuit board without causing thermal damage to adjacent sensitive surface mounted devices and connectors. Before solder is applied, molten solder within a solder reservoir is ... | 07/12/2005 |
