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| Number | Title | Issue Date |
| 8028978 | Wafer handling system A semiconductor wafer processing system has a carrier including wafer slots. A process robot engages the carrier and installs the carrier into a rotor within a process chamber. The rotor has a tapered or stepped inside surface matching a tapered or stepped outside s... | 10/04/2011 |
| 7935230 | Electro-chemical processor A processor for making porous silicon or processing other substrates has first and second chamber assemblies. The first and second chamber assemblies include first and second seals for sealing against a wafer, and first and second electrodes, respectively. The first... | 05/03/2011 |
| 7934898 | High throughput semiconductor wafer processing A wafer processing system has a wafer loading system accommodating sufficient wafer carriers to substantially maximize the processing speed capability of the processing system. Wafer carriers are placed into and removed from the loading system by one or two overhead... | 05/03/2011 |
| 7931786 | Apparatus and method for agitating liquids in wet chemical processing of microfeature workpieces Reactors with agitators and methods for processing microfeature workpieces with such reactors. The agitators are capable of obtaining high, controlled mass-transfer rates that result in high quality surfaces and efficient wet chemical processes. The agitators genera... | 04/26/2011 |
| 7927469 | Electro-chemical processor A processor for making porous silicon or processing other substrates has first and second chamber assemblies. The first and second chamber assemblies include first and second seals for sealing against a wafer, and first and second electrodes, respectively. The secon... | 04/19/2011 |
| 7909967 | Electro-chemical processor An electro-chemical processor for making porous silicon or processing other substrates has first and second chamber assemblies. The first and second chamber assemblies include first and second seals for sealing against a wafer, and first and second electrodes, respe... | 03/22/2011 |
| 7898089 | Semiconductor workpiece The present invention provides an apparatus and method for use in processing semiconductor workpieces. The new apparatus and method allows for the production of thinner workpieces that at the same time remain strong. Particularly, a chuck is provided that includes a... | 03/01/2011 |
| 7857958 | Method and apparatus for controlling vessel characteristics, including shape and thieving current for processing microfeature workpieces A method and apparatus for processing a microfeature workpiece. In one embodiment, the apparatus includes a support member configured to carry a microfeature workpiece at a workpiece plane, and a vessel positioned at least proximate to the support member. The vessel... | 12/28/2010 |
| 7849865 | System for processing a workpiece A wafer processing system has a moveable drain assembly having multiple drain rings. The drain rings may be spaced apart sufficiently to allow a process fluid applicator to move between them. Each drain ring provides a separate drain path, optionally in a separate r... | 12/14/2010 |
| 7842173 | Apparatus and methods for electrochemical processing of microfeature wafers Apparatus and methods for electrochemically processing microfeature wafers. The apparatus can have a vessel including a processing zone in which a microfeature wafer is positioned for electrochemical processing. The apparatus further includes at least one counter el... | 11/30/2010 |
| 7811422 | Electro-chemical processor with wafer retainer A wafer plating apparatus has a rotor in a head including wafer retainers which properly hold a wafer on the rotor in position. A seal on the head seals plating bath liquid away from the edges of the wafer. After plating is completed and the wafer is moved away from... | 10/12/2010 |
| 7794573 | Systems and methods for electrochemically processing microfeature workpieces Systems and methods for electrochemically processing microfeature workpieces are disclosed herein. In one embodiment, a system includes (a) a processing unit having a first flow system configured to convey a flow of a first processing fluid to a microfeature workpie... | 09/14/2010 |
| 7645366 | Microelectronic workpiece holders and contact assemblies for use therewith The invention provides an improved contact ring and an improved workpiece support, each of which is useful alone or jointly with the other in a workpiece holder for electrochemically treating microelectronic workpieces. Several embodiments of the invention provide a... | 01/12/2010 |
| 7628898 | Method and system for idle state operation Methods and systems for electrochemically processing microfeature workpieces are described herein. In one embodiment, a process for electrochemically treating a surface of a plurality of microfeature workpieces in an electrochemical treating chamber that includes a ... | 12/08/2009 |
| 7625821 | Process and apparatus for thinning a semiconductor workpiece The present invention provides system and apparatus for use in processing wafers. The new system and apparatus allows for the production of thinner wafers that at same time remain strong. As a result, the wafers produced by the present process are less susceptible t... | 12/01/2009 |
| 7585398 | Chambers, systems, and methods for electrochemically processing microfeature workpieces Chambers, systems, and methods for electrochemically processing microfeature workpieces are disclosed herein. In one embodiment, an electrochemical deposition chamber includes a processing unit having a first flow system configured to convey a flow of a first proces... | 09/08/2009 |
| 7566386 | System for electrochemically processing a workpiece A reactor for electrochemically processing at least one surface of a microelectronic workpiece is set forth. The reactor comprises a reactor head including a workpiece support that has one or more electrical contacts positioned to make electrical contact with the mi... | 07/28/2009 |
| 7541299 | Method and apparatus for thermally processing microelectronic workpieces An apparatus for thermally processing a microelectronic workpiece comprises a rotatable carousel assembly configured to support at least one workpiece. A driver is coupled to the carousel assembly and rotates the carousel assembly, moving the workpiece between a loa... | 06/02/2009 |
| 7531060 | Integrated tool assemblies with intermediate processing modules for processing of microfeature workpieces An intermediate module comprising a dimensionally stable mounting module and a first device attached to the dimensionally stable mounting module. The dimensionally stable mounting module can include a front docking unit with front alignment elements for connecting t... | 05/12/2009 |
| 7524406 | Processing apparatus including a reactor for electrochemically etching microelectronic workpiece Although there are several inventions disclosed herein, the present application is directed to a reactor for electrochemically processing a microelectronic workpiece. The reactor comprises a movable electrode assembly that is disposed for movement along a motion pat... | 04/28/2009 |
| 7520286 | Apparatus and method for cleaning and drying a container for semiconductor workpieces The invention provides an apparatus for cleaning and drying a container for semiconductor workpieces. The apparatus comprises a load port with a fixture that receives a dirty container and delivers it to a deck assembly with a carrier that removably receives the con... | 04/21/2009 |
| 7462269 | Method for low temperature annealing of metallization micro-structures in the production of a microelectronic device A method for filling recessed microstructures at a surface of a microelectronic workpiece, such as a semiconductor wafer, with metallization is set forth. In accordance with the method, a metal layer is deposited into the microstructures with a process, such as an e... | 12/09/2008 |
| 7438788 | Apparatus and methods for electrochemical processing of microelectronic workpieces An apparatus and method for electrochemical processing of microelectronic workpieces in a reaction vessel. In one embodiment, the reaction vessel includes: an outer container having an outer wall; a distributor coupled to the outer container, the distributor having ... | 10/21/2008 |
| 7429537 | Methods and apparatus for rinsing and drying A method for rinsing and drying a workpiece includes placing the workpiece into a chamber and spinning the workpiece. A rinsing fluid, such as water, is applied onto the workpiece through a first outlet in the chamber, with the rinsing fluid moving outwardly towards... | 09/30/2008 |
| 7420690 | End point detection in workpiece processing In a workpiece process end point detection system, light is diffused and then light intensity or color is sensed. Optical noise is greatly reduced and more accurate end point detection can be made. A light emitter and a light sensor may be located within a workpiece... | 09/02/2008 |
| 7416611 | Process and apparatus for treating a workpiece with gases In a method and apparatus for cleaning or processing a workpiece, a process gas is brought into contact with the workpiece by diffusion through a heated liquid layer on the workpiece, and by bulk transport achieved by entraining the gas in a liquid stream, spray or ... | 08/26/2008 |
| 7404863 | Methods of thinning a silicon wafer using HF and ozone A method of thinning a silicon wafer in a controllable cost-effective manner with minimal chemical consumption. The wafer is placed into a process chamber, after which ozone gas and HF vapor are delivered into the process chamber to react with a silicon surface of t... | 07/29/2008 |
| 7399713 | Selective treatment of microelectric workpiece surfaces This invention provides a process for treating a workpiece having a front side, a back side, and an outer perimeter. In accordance with the process, a processing fluid is selectively applied or excluded from an outer peripheral margin of at least one of the front or... | 07/15/2008 |
| 7393439 | Integrated microfeature workpiece processing tools with registration systems for paddle reactors Tools having mounting modules with registration systems are disclosed. The mounting module includes positioning elements for precisely locating a processing chamber and a transport system that moves workpieces to and from the processing chamber. The relative positio... | 07/01/2008 |
| 7390382 | Reactors having multiple electrodes and/or enclosed reciprocating paddles, and associated methods Reactors having multiple electrodes and/or enclosed reciprocating paddles are disclosed. The reactor can include multiple electrodes spaced apart from a process location to provide virtual electrodes proximate to the process location for transferring material to or ... | 06/24/2008 |
| 7390383 | Paddles and enclosures for enhancing mass transfer during processing of microfeature workpieces Paddles and enclosures for processing microfeature workpieces are disclosed. A paddle device having multiple paddles is positioned in an enclosure to reciprocate back and forth along a generally linear path. The clearances between the paddles, the workpiece and the ... | 06/24/2008 |
| 7378355 | System and methods for polishing a wafer In methods for smoothing or polishing a surface of a wafer, such as a silicon wafer, a liquid layer is formed on a surface of the wafer. The liquid layer may be an invisible microscopic layer, or a visible macroscopic layer. A flow of an oxidizing gas is directed ov... | 05/27/2008 |
| 7371306 | Integrated tool with interchangeable wet processing components for processing microfeature workpieces An integrated tool that enables wet chemical processing chambers, lift-rotate units and other hardware to be quickly interchanged without having to recalibrate the transport system or other components to the replacement items. These tools are expected to reduce the ... | 05/13/2008 |
| 7371998 | Thermal wafer processor A thermal processor may include a cooling jacket positionable around a process chamber within a process vessel or jar. A heater can move into a position substantially between the process chamber vessel and the cooling jacket. A holder having multiple workpiece holdi... | 05/13/2008 |
| 7357850 | Electroplating apparatus with segmented anode array An electroplating apparatus includes a reactor vessel having a segmented anode array positioned therein for effecting electroplating of an associated workpiece such as a semiconductor wafer. The anode array includes a plurality of ring-like anode segments which are ... | 04/15/2008 |
| 7354649 | Semiconductor workpiece The present invention provides an apparatus and method for use in processing semiconductor workpieces. The new apparatus and method allows for the production of thinner workpieces that at the same time remain strong. Particularly, a chuck is provided that includes a... | 04/08/2008 |
| 7351314 | Chambers, systems, and methods for electrochemically processing microfeature workpieces Chambers, systems, and methods for electrochemically processing microfeature workpieces are disclosed herein. In one embodiment, an electrochemical deposition chamber includes a processing unit having a first flow system configured to convey a flow of a first proces... | 04/01/2008 |
| 7351315 | Chambers, systems, and methods for electrochemically processing microfeature workpieces Chambers, systems, and methods for electrochemically processing microfeature workpieces are disclosed herein. In one embodiment, an electrochemical deposition chamber includes a processing unit having a first flow system configured to convey a flow of a first proces... | 04/01/2008 |
| 7337663 | Sonic energy process chamber A system for processing a workpiece includes a base having a bowl or recess for holding a processing fluid. A sonic energy source, such as a megasonic transducer, provides sonic energy into a processing fluid in the bowl. A process head holds a workpiece. A process ... | 03/04/2008 |
| 7334826 | End-effectors for handling microelectronic wafers End-effectors may be used to grasp microelectronic workpieces for handling by automated transport devices. One such end-effector includes a plurality of abutments and a detector adapted to detect engagement of the edge of the workpiece by at least one of the abutmen... | 02/26/2008 |
