Assignee: Semikron Elektronik GmbH & Co. KG

Location: Nürnberg, DE
No. of patents: 23

Number	Title	Issue Date
8182273	Power semiconductor module with prestressed auxiliary contact spring A power semiconductor module having a housing, a pressure member, a substrate including at least one contact surface, and at least one connection element leading towards the exterior of the housing. The connection element has a first contact device, a resilient sect...	05/22/2012
8116053	Isolating device for a power semiconductor and method for its operation, power module and system installation An isolating device for a power semiconductor comprising n power terminals for a power grid comprises n module terminals, n grid terminals, n connecting lines which connect the module terminals and grid terminals and have overcurrent fuses, and a tripping controller...	02/14/2012
7982302	Power semiconductor module with control functionality and integrated transformer A power semiconductor module comprising: a substrate, a plurality of conductor tracks arranged thereon, the conductor tracks being electrically insulated from one another, and including power semiconductor components arranged thereon; a connecting device, composed o...	07/19/2011
7965516	Power semiconductor module and method for its production A power semiconductor module that includes a substrate having at least one power semiconductor element; a heat sink for dissipation of heat from the at least one power semiconductor element and a housing having a cutout which is arranged on a lower face of the housi...	06/21/2011
7884287	Connecting device for electronic components A connecting device for the electrically conductive connection of electronic components and a substrate. The connecting device is formed as a film composite formed of at least one insulating film and at least two electrically conductive films disposed on opposite si...	02/08/2011
7821791	Housing for a power module A circuit arrangement includes a power module combined with a printed circuit board. The power module and the printed circuit board are disposed between a heat sink and a pressing device and are contact-connected to one another by pressure contact elements. The powe...	10/26/2010
7821028	Power semiconductor component with trench-type field ring structure A power semiconductor component and a method for producing such a component. The component comprises a semiconductor base body having a first doping. A pn junction is formed in the base body by a contact region having a second doping with a first doping profile. A f...	10/26/2010
7791176	Power semiconductor component with trench-type second contact region A power semiconductor component and method for producing it. The component has a semiconductor base body with a first doping and a pn junction formed by a contact region having a second doping with a doping profile in the base body. The second contact region is arra...	09/07/2010
7741711	Power semiconductor module with a connected substrate carrier and production method therefor A power semiconductor module includes a housing, a substrate carrier with a circuit thereon and electrical connection elements extending therefrom. The carrier has a cutout between its inner surface (facing the interior of the module) and its outer surface. The cuto...	06/22/2010
7723244	Method for internal electrical insulation of a substrate for a power semiconductor module A method for internal electrical insulation of a substrate for a power semiconductor module having a framelike insulating housing with a cap and having an insulating substrate. The substrate has conductor tracks and power semiconductor components mounted thereon. Th...	05/25/2010
7705442	Contact device for use in a power semiconductor module or in a disc-type thyristor A contact device for use with a power semiconductor component in a power semiconductor module or a disc-type thyristor, the module or thyristor having a molded body with a first recess disposed above the component. The contact device makes electrical contact with th...	04/27/2010
7638872	Power semiconductor module A power semiconductor module is presented. The power semiconductor module has a substrate, a composite film, and a power semiconductor component between the substrate and the composite film. The composite film has a thin circuit-structured logic metal layer and a th...	12/29/2009
7626441	Drive circuit with BOT level shifter for transmitting an input signal and assigned method A drive circuit in power electronic systems comprising a half-bridge circuit of two power switches, a first so-called TOP switch and a second so-called BOT switch, which are arranged in a series circuit. The drive circuit has a BOT level shifter for transmitting an ...	12/01/2009
7626256	Compact power semiconductor module having a connecting device A power semiconductor module having a housing, a substrate with conductor tracks and power semiconductor components arranged on the conductor tracks, and a connecting device. The connecting device comprises a film composite with first and second conductive layers, w...	12/01/2009
7613008	Power semiconductor module with capacitors connected parallel to one another A power semiconductor module is presented. The power semiconductor module includes a plurality of capacitors coupled in parallel with each other. Each of the plurality of capacitors each includes a first and a second connection element. The power semiconductor modul...	11/03/2009
7592698	Power semiconductor modules having a cooling component and method for producing them An arrangement with an associated production method, of a power semiconductor module in a pressure contact embodiment and a cooling component. The module includes load terminals embodied as metal molded bodies with a flat portion and a contact device originating at ...	09/22/2009
7589418	Pressure contact power semiconductor module A power semiconductor module in a pressure contact embodiment, for disposition on a cooling component, in which load terminals are formed as metal molded bodies, each with at least one flat portion and having a plurality of contact feet extending from the flat porti...	09/15/2009
7554336	Method for measuring the insulation resistance in an IT network A method for measuring the insulation resistance in an information technology (IT) network. The IT network has a DC voltage intermediate circuit and at least one self-commutated converter having at least one first and one second power switch. The IT network also inc...	06/30/2009
7495324	Power semiconductor module A power semiconductor module having an electrically insulating substrate, to be arranged with a circuit board. The circuit board is spaced apart from the substrate by a housing. First conductor tracks are disposed inside the substrate, facing the circuit board, for ...	02/24/2009
7324359	Circuit for converting alternating voltage into high-voltage direct voltage A converter circuit for a wind power system for supplying a high-voltage direct voltage connection. The system includes a transformer with one primary winding per phase and a plurality of secondary windings per phase. Three of these secondary windings of different p...	01/29/2008
7242584	Housing for power semiconductor modules A housing for power semiconductor modules with a base plate or for direct mounting on a heat sink. The housing (10) surrounds an electrically insulating substrate (40) with metal connection tracks (41) disposed thereon. The metal connection trac...	07/10/2007
7164201	Semiconductor module with scalable construction A power semiconductor module with a scalable construction, having a base plate or intended for direct mounting on a heat sink. The module has a framelike housing, a cover, terminal elements, extending to the outside of the housing for load contacts and auxiliary con...	01/16/2007
6979204	Pressure piece for use in a power semiconductor module A pressure piece for a compact power semiconductor module for direct mounting on a heat sink. The power semiconductor module has resilient connection leads for electrical connection to a printed circuit board disposed outside the housing. The pressure piece is dimen...	12/27/2005

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Assignee: Semikron Elektronik GmbH & Co. KG