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3M employee and church chorister Art Fry needed something to temporarily mark pages in his hymnal. He was in luck because his colleague, Spencer Silver, accidentally developed a glue that was too weak for other purposes. After initially discouraging consumer response, Post-it Notes became a hit in 1979.
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| Number | Title | Issue Date |
| 8063621 | Current balancing circuit and method A multi-phase power converter and a method for balancing a plurality of currents in the multi-phase power converter. The multi-phase power converter that includes a pulse width modulator coupled to an oscillator. A plurality of currents are generated in response to ... | 11/22/2011 |
| 7972521 | Method of making reliable wafer level chip scale package semiconductor devices The present invention relates to a method of making a robust wafer level chip scale package and, in particular, a method that prevents cracking of the passivation layer during solder flow and subsequent multiple thermal reflow steps. In one embodiment, a passivation... | 07/05/2011 |
| 7737004 | Multilayer gettering structure for semiconductor device and method In one embodiment, a multi-layer extrinsic gettering structure includes plurality of polycrystalline semiconductor layers each separated by a dielectric layer. ... | 06/15/2010 |
| 7667270 | Double trench for isolation of semiconductor devices A semiconductor device has a substrate (50), a buried layer (55), an active area extending from a surface contact to the buried layer, an insulator (130) in a first trench extending towards the buried layer, to isolate the active area, and a sec... | 02/23/2010 |
| 7462550 | Method of forming a trench semiconductor device and structure therefor In one embodiment, a trench semiconductor device is formed to have an oxide of a first thickness along the sidewalls of the trench, and to have a greater thickness along at least a portion of a bottom of the trench. ... | 12/09/2008 |
| 7457138 | Single pin multi-function signal detection method and structure therefor In one embodiment, a multi-function signal sensor is configured to receive a signal having a plurality of states and to offset the input signal by a first amount for values of the input signal that are greater than a first value. ... | 11/25/2008 |
| 7456611 | Multi-current battery charger circuit and method therefor In one embodiment, a battery charger is configured to provide a normal charge current during a first time period and to supply a maintenance current after the first time period expires. ... | 11/25/2008 |
| 7456441 | Single well excess current dissipation circuit A current dissipation circuit that dissipates excess current to or from a circuit node when that monitored circuit node experiences abnormal voltage conditions, rather than having that excess current being dissipated through other protected circuitry. The current di... | 11/25/2008 |
| 7453298 | PWM controller and method therefor In one embodiment, a PWM controller is configured to form a control signal that has reduced noise. The control signal is used to adjust a frequency of a clock signal of the PWM controller. ... | 11/18/2008 |
| 7447601 | Power supply controller method and structure A power supply controller determines the value of an input power and uses the value of the input power to regulate a value of the output voltage. ... | 11/04/2008 |
| 7446517 | Power supply controller and method therefor In one embodiment, a power supply controller uses a first clock of a first frequency to initiate a PWM cycle in a first operating mode and uses a second clock having a higher frequency to initiate a PWM cycle in a second operating mode. ... | 11/04/2008 |
| 7446354 | Power semiconductor device having improved performance and method In one embodiment, a semiconductor device is formed in a body of semiconductor material. The semiconductor device includes a counter-doped drain region spaced apart from a channel region. ... | 11/04/2008 |
| 7443699 | Negative current compensation method and circuit A power supply controller (10, 60, 70) uses a negative current (36) of a power transistor (16, 71) to detect the valley point for enabling the power transistor when driving an inductor (17). The negative current occurs when the inductor i... | 10/28/2008 |
| 7439716 | DC-DC converter and method A DC-DC converter and method for compensating for errors in the DC-DC converter. The DC-DC converter includes an inductor coupled for receiving a source of operating voltage through a plurality of switches. The switches are controlled by a control circuit that has f... | 10/21/2008 |
| 7439100 | Encapsulated chip scale package having flip-chip on lead frame structure and method In one embodiment, an encapsulated electronic package includes a semiconductor chip having patterned solderable pads formed on a major surface. During an assembly process, the patterned solderable pads are directly affixed to conductive leads. The assembly is encaps... | 10/21/2008 |
| 7423856 | Fault control circuit and method therefor In one embodiment, a fault control circuit of a switching power supply controller is configured to disable an operating voltage of the switching power supply controller responsively to a fault condition and to subsequently decouple the fault control circuit from ano... | 09/09/2008 |
| 7420258 | Semiconductor device having trench structures and method In one embodiment, a pair of sidewall passivated trench contacts is formed in a substrate to provide electrical contact to a sub-surface feature. A doped region is diffused between the pair of sidewall passivated trenches to provide low resistance contacts. ... | 09/02/2008 |
| 7417265 | Schottky diode structure with enhanced breakdown voltage and method of manufacture In one embodiment, a Schottky diode structure comprises a Schottky barrier layer in contact with a semiconductor material through a Schottky contact opening. A conductive ring is formed adjacent the Schottky contact opening and is separated from the semiconductor ma... | 08/26/2008 |
| 7411266 | Semiconductor device having trench charge compensation regions and method In one embodiment, a semiconductor device is formed having charge compensation trenches in proximity to channel regions of the device. The charge compensation trenches comprise at least two opposite conductivity type semiconductor layers. A channel connecting region... | 08/12/2008 |
| 7402895 | Semiconductor package structure and method of manufacture In one embodiment, a semiconductor package includes a conductive slug and columnar leads in spaced relationship thereto. The columnar leads are coupled to an electronic device attached to the slug, and are exposed at least on one side of the package opposite the die... | 07/22/2008 |
| 7400517 | Power factor correction circuit and method therefor In one embodiment, a power factor correction circuit is configured to use a stored value of a feedback signal to assist in regulating the value of an output voltage and to bypass the sample and hold circuit if the output voltage increase to an upper limit or decreas... | 07/15/2008 |
| 7400127 | Method for regulating an output signal and circuit therefor A regulator circuit and a method for compensating for sag in the output signal of the regulator circuit. A first comparator is coupled to an input of an oscillator, which oscillator outputs a clock signal and a ramp signal. In accordance with a feedback signal from ... | 07/15/2008 |
| 7397084 | Semiconductor device having enhanced performance and method In one embodiment, a semiconductor device is formed in a body of semiconductor material. The semiconductor device includes a localized region of doping near a portion of a channel region where current exits during operation. ... | 07/08/2008 |
| 7397070 | Self-aligned transistor In one embodiment, a transistor is formed to use two conductors to make electrical connection to one of the active regions of the transistor. ... | 07/08/2008 |
| 7397288 | Fan out buffer and method therefor In one embodiment, a fan out buffer has the inputs of a plurality of output followers connected to the output of a plurality of distribution gates. ... | 07/08/2008 |
| 7397120 | Semiconductor package structure for vertical mount and method In one embodiment, a semiconductor package structure includes a plurality of upright clips having ends with mounting surfaces for vertically mounting the package to a next level of assembly. A semiconductor chip is interposed between the upright clips together with ... | 07/08/2008 |
| 7385832 | Method of forming a secondary-side controller and structure therefor In one embodiment, a secondary-side controller is configured to detect a burst-mode of operation and responsively block or prevent sending drive pulses to a power transistor that is coupled in the secondary side. ... | 06/10/2008 |
| 7385170 | Ambient light suppression circuit for photodiode receiver applications An optical receiver circuit that effectively suppresses ambient light. A photodiode receives both desired higher frequency modulated optical signals, as well as the lower frequency or even DC ambient light optical signals. The optical receiver circuit includes a tra... | 06/10/2008 |
| 7382594 | Method of forming an integrated voltage protection device and structure In one embodiment, a voltage protection circuit uses two back-to-back transistors to receive an unprotected voltage and form a protected voltage. ... | 06/03/2008 |
| 7382059 | Semiconductor package structure and method of manufacture In one embodiment, a semiconductor package is formed by adding a layer of particles to desired portions of a packing substrate. The layer of particles forms a matrix of crevices that provides a micro-lock feature for mechanically locking or engaging encapsulating ma... | 06/03/2008 |
| 7381603 | Semiconductor structure with improved on resistance and breakdown voltage performance In one embodiment, a lateral FET cell is formed in a body of semiconductor material. The lateral FET cell includes a super junction structure formed in a drift region between a drain contact and a body region. The super junction structure includes a plurality of spa... | 06/03/2008 |
| 7382676 | Method of forming a programmable voltage regulator and structure therefor In one embodiment, a programmable voltage regulator stores data representing a programmable configuration of the regulator. The regulator is configured to verify the validity of the stored data before using it to control the operation of the programmable voltage reg... | 06/03/2008 |
| 7365383 | Method of forming an EPROM cell and structure therefor An EPROM cell includes a control gate and a control transistor. A portion of the control transistor is formed as a portion of the control gate. ... | 04/29/2008 |
| 7345464 | PWM power supply controller having multiple PWM signal assertions and method therefor In one embodiment, a PWM power supply controller asserts a PWM control signal synchronously to a clock signal of the PWM controller and also asserts the PWM control signal asynchronously to the clock signal. ... | 03/18/2008 |
| 7345896 | Secondary side power supply controller and method therefor In one embodiment, a power supply controller generates a PWM control signal that is subsequently used to control a portion of current flow in a primary side of a power supply system. THE PWM control signal is coupled to a secondary of the power supply system and use... | 03/18/2008 |
| 7342528 | Circuit and method for reducing electromagnetic interference A spread spectrum system having a self-oscillating delay-line digital pulse width modulator and a method for mitigating electromagnetic interference. The spread spectrum system has a pseudo-random pattern generator connected to a digital-to-analog converter, which i... | 03/11/2008 |
| 7339203 | Thyristor and method of manufacture A thyristor and a method for manufacturing the thyristor that includes a gate region extending from the first major surface into a semiconductor substrate and an anode region extending from the second major surface into the semiconductor substrate. A cathode region ... | 03/04/2008 |
| 7321499 | Method of forming a power supply controller and device therefor In one embodiment, a power supply controller uses a ramp signal to form current sense ramp compensation. ... | 01/22/2008 |
| 7319266 | Encapsulated electronic device structure In one embodiment, an electronic device package (1) includes a leadframe (2) with a flag (3). An electronic chip (8) is attached to the flag (3) with a die attach layer (9). A trench (16) having curved sidewalls is fo... | 01/15/2008 |
| 7306999 | High voltage sensor device and method therefor In one embodiment, a high voltage element is formed overlying a doped semiconductor region that can be depleted during the operation of the high voltage element. ... | 12/11/2007 |
