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| Number | Title | Issue Date |
| 7462555 | Ball grid array substrate having window and method of fabricating same Disclosed is a ball grid array substrate having a window formed on a core material instead of a thin core material, and wherein a semiconductor chip is mounted thereon, thereby reducing the thickness of a package, and a method of fabricating the same. The ball grid ... | 12/09/2008 |
| 7453045 | Rigid-flexible PCB having coverlay made of liquid crystalline polymer and fabrication method thereof Disclosed are a rigid-flexible PCB and a method for fabricating the rigid-flexible PCB. Characterized by using a liquid crystalline polymer for the formation of coverlay over flexible regions, the all-layer processing method has the advantage of preventing interlaye... | 11/18/2008 |
| 7435911 | Printed circuit board including embedded capacitor and method of fabricating same Disclosed is a PCB including an embedded capacitor and a method of fabricating the same. The long embedded capacitor is formed through an insulating layer, making a high capacitance and various capacitance designs possible. ... | 10/14/2008 |
| 7423689 | Camera module for mobile communication terminals Disclosed herein is a camera module for mobile communication terminals. The module comprises an image capture device unit for focusing an image of a subject, a LED (light emitting diode) unit for emitting light to the subject, a FPC (flexible printed circuit) electr... | 09/09/2008 |
| 7414317 | BGA package with concave shaped bonding pads In the BGA package and its manufacturing method, a bonding pad is etched from the exposed surface to a part of the insulation layer-coated region so as to form a solder contact side having a dish configuration, which is planar at a bottom center and slanted at a per... | 08/19/2008 |
| 7411630 | Apparatus and method for transposing data in the display system using the optical modulator Disclosed herein is an apparatus and method for transposing data. The apparatus includes a pair of line memories, a pair of memories and output units. The line memories horizontally read image data a frame of which is composed of K×L byte data (row length: K bytes,... | 08/12/2008 |
| 7408261 | BGA package board and method for manufacturing the same Disclosed herein is a Ball Grid Array (BGA) package board. The BGA package board includes a first external layer on which a pattern comprising a circuit pattern and a wire bonding pad pattern is formed, a second external layer on which a pattern comprising a circuit... | 08/05/2008 |
| 7408120 | Printed circuit board having axially parallel via holes Disclosed is a PCB having axially parallel via holes, in which an outer ground via hole, acting as a ground, is formed around a via hole for intercircuit connection in the PCB, thereby minimizing the effect of noise caused by the via hole. ... | 08/05/2008 |
| 7398539 | Height-variable type turntable assembly and optical disk device including the same The present invention relates generally to a turntable assembly for optical disks and, more particularly, to a height-variable type turntable assembly, which can adjust the height of a turntable to adjust the working distance between an object lens and an optical di... | 07/08/2008 |
| 7394249 | Printed circuit board with weak magnetic field sensor Disclosed is a printed circuit board with a weak magnetic field sensor according to the present invention, which includes a substrate having first excitation circuits and first detection circuits formed on both sides thereof. First laminates are layered on both side... | 07/01/2008 |
| 7387917 | BGA package substrate and method of fabricating same Disclosed is a ball grid array (BGA) package substrate, in which a wire bonding pad and a solder ball pad are formed on a via hole, making high freedom in design of a circuit pattern and a high density circuit pattern possible, and a method of fabricating the same. | 06/17/2008 |
| 7350296 | Method of fabricating a printed circuit board including an embedded passive component Disclosed is a method of fabricating a PCB including an embedded passive component and a method of fabricating the same and a method of fabricating the same. The PCB includes at least two circuit layers in which circuit patterns are formed. At least one insulating l... | 04/01/2008 |
| 7350295 | Method of fabricating multi-layered printed circuit board for optical waveguides A method of fabricating a multi-layered PCB, in which the optical waveguide component is inserted into the PCB in such a way that a prepreg adhesive does not block an optical signal entrance of the optical waveguide. The method includes pre-routing a portion of an a... | 04/01/2008 |
| 7351915 | Printed circuit board including embedded capacitor having high dielectric constant and method of fabricating same A printed circuit board (PCB) having at least one embedded capacitor and a method of fabricating the same is provided. A dielectric layer is formed using a ceramic material having a high capacitance, thereby assuring that the capacitors each have a high dielectric c... | 04/01/2008 |
| 7346982 | Method of fabricating printed circuit board having thin core layer A method is directed towards fabricating a printed circuit board (PCB) having a thin core layer. In the method, a substrate, where a copper foil is formed on a release film and a prepreg, is employed as a base substrate and a core insulating layer is removed after t... | 03/25/2008 |
| 7347950 | Rigid flexible printed circuit board and method of fabricating same A rigid flexible printed circuit board (PCB) and a method of fabricating the same. Since a polyimide copper clad laminate is not used during the fabrication of the rigid flexible PCB, an increase in cost resulting from use of the polyimide copper clad laminate and p... | 03/25/2008 |
| 7348772 | Printed circuit board having weak magnetic field sensor and method of manufacturing the same A Printed Circuit Board (PCB) having a weak magnetic field sensor of the present invention includes a base plate on which a first excitation circuit and a first detection circuit are formed on each of the sides thereof, soft magnetic core bodies laminated on the top... | 03/25/2008 |
| 7345701 | Line buffer and method of providing line data for color interpolation A line buffer and a method of providing data to a 3×3 line interpolation processor using the line buffer in an image processing system, such as a digital camera, includes a readable and writable single memory, a buffer register having a prior data area storing firs... | 03/18/2008 |
| 7343072 | Light modulator package having inclined light transmissive lid Disclosed herein is a light modulator package having an inclined light transmissive lid which is manufactured or positioned such that a surface of the light transmissive lid is inclined relative to a reflective surface of a light modulating array. ... | 03/11/2008 |
| 7337453 | Actuator employing a bobbin incorporating a winding coil and a manufacturing method thereof An optical pickup actuator and a method thereof includes a bobbin having a lens to scan a laser beam on a track of a disc, a winding coil moving the bobbin on the track in focusing and tracking directions, and an integrated circuit board used as the bobbin using a p... | 02/26/2008 |
| 7328504 | Method for manufacturing circuit board with built-in electronic components Disclosed is a method for manufacturing a circuit board, comprising step for preparing an insulating member and an electronic component having position-setting means on the lower surface thereof (S110), step for forming mounting holes in the insulating member... | 02/12/2008 |
| 7327665 | Optical fiber probe using an electrical potential difference and an optical recorder using the same An optical fiber probe generates an electrical potential difference formed between thin metal layers coated thereon to increase a light transmission rate. The optical fiber probe includes a near-field probe having a core transmitting light incident from an external ... | 02/05/2008 |
| 7326858 | Printed circuit board with embedded capacitors and manufacturing method thereof Disclosed is a printed circuit board which is advantageous in terms of high capacitance by embedding capacitors comprising polymer capacitor pastes with high-dielectric constant coated on an inner layer of the printed circuit board and then semi-dried to a state of ... | 02/05/2008 |
| 7312445 | Pyramid-shaped near field probe using surface plasmon wave Disclosed herein is a pyramid-shaped near field probe which forms and changes a near field at the aperture of the probe. The pyramid-shaped near field probe of the present invention includes a probe body and metal films. The probe body is constructed in the form of ... | 12/25/2007 |
| 7302695 | Slot-in type optical disk player The present invention provides a slot-in type optical disk player which has a guide unit to guide an optical disk, inserted into an inlet, to a central portion of the inlet of the optical disk player, and a disk guide device to allow the optical disk player to play ... | 11/27/2007 |
| 7298887 | System for and method of analyzing surface condition of PCB using RGB colors A system for and a method of analyzing the surface condition of a PCB using RGB colors are disclosed. The analyzing method includes the steps of feeding a target PCB, to be measured, to an image pick-up position where a pick-up unit is disposed, by a feeding unit, p... | 11/20/2007 |
| 7298676 | Optical pickup apparatus having optical detection area for compensating for tracking error offset The optical pickup apparatus includes a light emitting means, an optical means, and an optical detection means. The light emitting means emits a single beam. The optical means diffracts the single beam, focuses the optical spot of the diffracted beam on a track, and... | 11/20/2007 |
| 7295054 | Buffer capable of controlling slew rate in drive IC The present invention relates generally to a buffer of a drive Integrated Circuit (IC) and, more particularly, to a buffer of a drive IC for driving a spatial light modulator that can meet a desired dynamic slew rate characteristic by controlling current that affect... | 11/13/2007 |
| 7293353 | Method of fabricating rigid flexible printed circuit board Disclosed is a method of fabricating rigid flexible PCBs. In the method, a self-detachable adhesive tape is used to separate a wafer and a substrate from each other in the course of conventionally fabricating a semiconductor wafer, is employed to avoid inherent prob... | 11/13/2007 |
