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| Number | Title | Issue Date |
| 8184448 | Bare chip embedded PCB A PCB having an embedded bare chip includes an insulated substrate having a penetration hole formed therein; a filler filling up an inside of the penetration hole; a bare chip embedded in the filler such that electrode pads formed on one side thereof are exposed at ... | 05/22/2012 |
| 8183725 | Motor and recording disc driving device A motor includes a shaft supporting a rotation of a rotor, a sleeve supporting the shaft such that an upper end of the shaft protrudes upward in an axial direction, a rotor case having a rotor hub, which is forcibly inserted and fixed to a protrusion of the shaft, a... | 05/22/2012 |
| 8183473 | Optimized power package for electrical device Disclosed is a power package for an electrical device of an Electronic Control Unit (ECU) in an Electric Power Steering (EPS) system, the power package including: a housing which is formed with an upper part and a lower part and is formed to be in a two-step structu... | 05/22/2012 |
| 8183468 | Electromagnetic bandgap structure, printed circuit board comprising this and method thereof An electromagnetic bandgap structure and a printed circuit board including it as well as a method of manufacturing thereof that can solve a mixed signal problem between an analog circuit and a digital circuit are disclosed. The electromagnetic bandgap structure in a... | 05/22/2012 |
| 8181339 | Method of manufacturing a printed circuit board A printed circuit board and a method of manufacturing the printed circuit board are disclosed. The method of manufacturing the printed circuit board can include forming a first protective layer over one surface of a core substrate, forming a first circuit pattern ov... | 05/22/2012 |
| 8176504 | Clamping device for disk Disclosed herein is a disk clamping device capable of preventing the slipping or eccentricity of an optical disk when it rotates at high speeds. The disk clamping device includes a turntable having a hub which is integrally provided in a central portion thereof and ... | 05/08/2012 |
| 8174128 | Method of manufacturing semiconductor package having a first board, second boards electrically connected to both sides of the first board, and at least one component connected to the first board by a flip chip method A method of manufacturing a semiconductor package that includes: forming a first board; forming second boards, in each of which at least one cavity is formed; attaching the second boards to both sides of the first board, such that the second boards are electrically ... | 05/08/2012 |
| 8172991 | Hydrogen generating apparatus and fuel cell power generation system A hydrogen generating apparatus is disclosed, which can provide a constant amount of hydrogen regardless of its orientation. The hydrogen generating apparatus can include an electrolyte bath, which contains an electrolyte solution; a free-moving first electrode, whi... | 05/08/2012 |
| 8169790 | Electromagnetic bandgap structure and printed circuit board An electromagnetic bandgap structure and a printed circuit board having the electromagnetic bandgap that intercepts the transfer of a signal ranging a frequency band are disclosed. The electromagnetic bandgap structure includes a metal layer; a dielectric layer, sta... | 05/01/2012 |
| 8168890 | Printed circuit board and component package having the same A printed circuit board, a component package that includes the printed circuit board, and a method of manufacturing the component package are disclosed. The printed circuit board, which may include an insulation layer, a pad formed over the insulation layer and wire... | 05/01/2012 |
| 8166653 | Method of manufacturing printed circuit board having embedded resistors A method of manufacturing a printed circuit board (PCB) having embedded resistors, including providing a PCB on which internal layer circuit patterns, including electrode pads, are formed; layering insulating layers on the PCB; forming first via holes on the electro... | 05/01/2012 |
| 8164006 | Electromagnetic bandgap structure and printed circuit board According to an embodiment of the present invention, an electromagnetic bandgap structure can include: at least three conductive plates; a first stitching via, configured to electrically connect any one of the conductive plates to another conductive plate; and a sec... | 04/24/2012 |
| 8161634 | Method of fabricating a printed circuit board A method of fabricating a printed circuit, which involves forming a bump on a first metal layer; laminating an insulating layer on the bump so that the bumps passes through the insulating layer; placing a second metal layer on the insulating layer and then conductin... | 04/24/2012 |
| 8160417 | Printed circuit board for optical waveguide and method of manufacturing the same Disclosed herein is a printed circuit board for an optical waveguide, including a base board, and an optical waveguide formed on the base board. The optical waveguide includes a lower clad layer formed on the base board, an insulation layer formed on the lower clad ... | 04/17/2012 |
| 8159824 | Printed circuit board A printed circuit board is disclosed. The printed circuit board includes a first board unit and a second board unit disposed with a gap in-between, and a flexible optical board configured to transmit optical signals, which has one side stacked on the first board uni... | 04/17/2012 |
| 8159064 | Lead pin for package substrate, and method for manufacturing package substrate with the same Disclosed herein is a lead pin for a package substrate. The lead pin for the package substrate according to the exemplary embodiment of the present invention includes a head part having one surface opposite to the package substrate and the other surface that is an o... | 04/17/2012 |
| 8158889 | Electromagnetic bandgap structure and printed circuit board An electromagnetic bandgap structure and a printed circuit board are disclosed. In accordance with an embodiment of the present invention, the electromagnetic bandgap structure includes a mushroom type structure comprising a first metal plate and a via of which one ... | 04/17/2012 |
| 8154794 | Imaging lens and method of manufacturing the same There is provided an imaging lens including: a transparent substrate; an upper lens disposed on a top of the transparent substrate; and a lower lens disposed on a bottom of the transparent substrate to correspond to the upper lens, wherein one of the upper and lower... | 04/10/2012 |
| 8154789 | Electronic paper display device and manufacturing method thereof The electronic paper display device may include a first electrode; a dielectric layer that is disposed on the first electrode and has a plurality of cells defined by a barrier; a second electrode that faces the dielectric layer; and electronic balls that are dispose... | 04/10/2012 |
| 8153907 | Electromagnetic bandgap structure and printed circuit board An electromagnetic bandgap structure and a printed circuit board that solve a mixed signal problem are disclosed. In accordance with embodiments of the present invention, the electromagnetic bandgap structure includes a first metal layer; a first dielectric layer, s... | 04/10/2012 |
| 8153904 | Substrate panel including insulation parts and bus line A substrate panel is disclosed. The substrate panel may include a clamp contact, a bus line formed at a distance from the clamp contact, and a plurality of substrate units supplied with an electric current by way of the bus line, where an insulation part may be form... | 04/10/2012 |
| 8152284 | Inkjet head and inkjet head assembly having the same There is provided an inkjet head and an inkjet head assembly having the same. The inkjet head includes an inkjet head plate having a plurality of nozzles ejecting ink provided therein; pressure chambers storing ink drawn in from both outer ends of the inkjet head pl... | 04/10/2012 |
| 8151446 | Apparatus for manufacturing printed circuit board An apparatus for manufacturing a printed circuit board that uses conductive bumps to interconnect layers includes: a conveyor unit, which is configured to transport a board that has the conductive bumps formed on one side; an upper roller and a lower roller, which p... | 04/10/2012 |
| 8148796 | Solar cell and manufacturing method thereof Disclosed are a solar cell and a manufacturing method thereof. The solar cell in accordance with an embodiment of the present invention includes: a substrate having a plurality of holes formed on one surface thereof; a metal layer formed on an inner wall of the hole... | 04/03/2012 |
| 8144972 | Manufacturing method of printed circuit board and manufacturing apparatus for the same The present invention relates to a method for manufacturing a printed circuit board and an apparatus for manufacturing the same; and, more particularly, to a method for manufacturing a printed circuit board and an apparatus for manufacturing the same capable of impr... | 03/27/2012 |
| 8144553 | Disk drive A disk drive for driving a disk is disclosed, which includes: a driving unit configured to provide a driving force onto the disk, a main circuit pattern electrically connected with the driving unit, a sensor unit configured to sense a rotation speed of the disk, a f... | 03/27/2012 |
| 8144243 | Camera module The present invention relates to a camera module assembled by using a connector. The present invention provides a camera module including: a main substrate having an image sensor mounted on an upper surface and a connector insertion groove formed at one side of the ... | 03/27/2012 |
| 8143715 | Semiconductor package transformer The present invention relates to a semiconductor package transformer. There is provided a semiconductor package transformer including: a case where an opening into which a semiconductor package having a chip mounted on a substrate is inserted is formed on its front ... | 03/27/2012 |
| 8143099 | Method of manufacturing semiconductor package by etching a metal layer to form a rearrangement wiring layer The present invention relates to a method of manufacturing a semiconductor package capable of simplifying a process and remarkably reducing a production cost by including the steps of: preparing a different bonded panel including at least one metal layer; forming a ... | 03/27/2012 |
| 8142240 | Lead pin for package substrate Disclosed herein is a lead pin for a package substrate. The lead pin for the package substrate includes a cylindrical connection pin; and a head part that is formed on one end of the connection pin and has a convex round part formed on the lower end of the he... | 03/27/2012 |
| 8141244 | Insulating material and printed circuit board having the same An insulating material, a printed circuit board that utilizes the insulating material, and a method of manufacturing the printed circuit board. The method includes perforating at least one through-hole corresponding with the at least one, which is in correspondence ... | 03/27/2012 |
| 8141241 | Method of manufacturing a printed circuit board having metal bumps A method of manufacturing a printed circuit board having a metal bump, including: forming a recess for creation of the metal bump on a metal carrier; forming a barrier layer on the metal carrier including the recess; forming an upper circuit layer on the barrier lay... | 03/27/2012 |
| 8139146 | Camera module, method of focusing the same, and device for focusing the same An a camera module includes: a lens barrel housing lenses; a housing formed integrally with the lens barrel; and a substrate unit having a top surface bonded to the housing with an adhesive and including pass portions through which an ascending and descending unit p... | 03/20/2012 |
| D655722 | Stator core plate for electric motor | 03/13/2012 |
| 8130086 | Linear vibration generator A linear vibration generator is disclosed. The linear vibration generator may include: a stator having a coil, which induces a magnetic field when an electric current is applied; an oscillator having a magnet, which has one side facing the coil; a spring member, whi... | 03/06/2012 |
| 8125161 | Light emitting device driving apparatus and method for driving the same The present invention relates to a light emitting device (LED) driving apparatus that constantly maintains the average current flowing onto a plurality of channels. The light emitting device (LED) driving apparatus includes: a LED light source unit in which at least... | 02/28/2012 |
| 8124880 | Circuit board and method for manufacturing thereof A method of manufacturing a circuit board that includes: forming a conductive relievo pattern, including a first plating layer, a first metal layer, and a second plating layer stacked sequentially in correspondence with a first circuit pattern, on a seed layer stack... | 02/28/2012 |
| 8115859 | Method for controlling auto-exposure An auto-exposure control method includes: creating an exposure table and an analog gain table including an exposure time and an analog gain of an image sensor set according to an index, respectively; calculating an average luminance value of an image frame obtained ... | 02/14/2012 |
| 8115858 | System and method for acquiring moving images A system and a method for acquiring a moving image are provided. The system includes an image capturing unit capturing two images having different exposure times at a predetermined time slot, an image storing unit storing at least one of two images which were captur... | 02/14/2012 |
| 8115829 | Apparatus and method for controlling auto exposure An apparatus and method for controlling auto exposure (AE) that is used in digital imaging devices. The apparatus controlling the luminance of an image being outputted from an image sensor by controlling exposure time and analog gain of the image sensor includes: a ... | 02/14/2012 |
