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...Daniel Webster invented a "bull plow" to pull out tree stumps. It didn't catch on because it was huge and required four oxen to pull it!
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| Number | Title | Issue Date |
| 8183469 | Wiring board and method of manufacturing the same A wiring board includes an external connection terminal of a cylindrical shape, in which an electrode terminal of the electronic component to be mounted is fitted. In one configuration, a portion of the external connection terminal is electrically connected to a pad... | 05/22/2012 |
| 8183467 | Wiring board and method of producing the same A wiring board includes: wiring layers; insulating layers disposed between the wiring layers; and external connection pads respectively including surface plated layers, for connecting to an external circuit. In each of the external connection pads in one face of the... | 05/22/2012 |
| 8178957 | Electronic component device, and method of manufacturing the same A method of manufacturing an electronic component device, includes the steps of preparing a wiring substrate, which includes a silicon substrate, a concave portion provided on its upper surface side, a through hole formed to penetrate the silicon substrate on a bott... | 05/15/2012 |
| 8176627 | Method of manufacturing wiring substrate and method of manufacturing electronic component device In a method of manufacturing a wiring substrate, first, a structure in which an underlying layer is arranged in a wiring forming area of a temporary substrate and a peelable multi-layer metal foil that is larger in size than the underlying layer is arranged on the u... | 05/15/2012 |
| 8169083 | Semiconductor device A semiconductor device includes a wiring substrate having a mounting surface on which a semiconductor element is mounted. A portion of the mounting surface exposed from the semiconductor element is covered by a solder-resist layer, and an extension portion of the so... | 05/01/2012 |
| 8169073 | Semiconductor device and electronic apparatus of multi-chip packaging External connection terminals 27 which are electrically connected to semiconductor chips 11-1, 11-2, 12-1, 12-2 and also protrude beyond the semiconductor chips 11-1, 11-2, 12-1, 12-2 are d... | 05/01/2012 |
| 8166648 | Method of manufacturing a wiring substrate There is provided a wiring substrate manufacturing method. The wiring substrate includes: a plurality of conductor patterns formed on a mounting surface on which an electronic component is to be mounted, wherein each of the conductor patterns is covered with a corre... | 05/01/2012 |
| 8161636 | Circuit board and method of manufacturing the same A circuit board has plated through holes which are laid out with a fine pitch and meets requirements relating to characteristics such as the thermal expansion coefficient of the circuit board. A method of manufacturing a circuit board includes: a step of forming a c... | 04/24/2012 |
| 8153902 | Wiring board and electronic component device A wiring board includes a wiring forming region in which a plurality of wiring layers are stacked while sandwiching insulating layers, an outer periphery region which is arranged around the wiring forming region and in which a reinforcing pattern is formed in the sa... | 04/10/2012 |
| 8153900 | Wiring substrate with lead pin and lead pin A wiring substrate with a lead pin is formed by bonding lead pins to electrode pads formed on a wiring substrate through conductive materials. In the lead pin, a conic protrusion part whose side surface is formed in a concave surface is formed in the end face side o... | 04/10/2012 |
| 8148254 | Method of manufacturing semiconductor device There is provided a method of manufacturing a semiconductor device. The method includes the successive steps of: (a) providing a semiconductor substrate; (b) forming a plurality of semiconductor chips having electrode pads on the semiconductor substrate; (c) forming... | 04/03/2012 |
| 8143533 | Method for forming resist pattern, method for producing circuit board, and circuit board There are provided a method for forming a resist pattern for preparing a circuit board having a landless or small-land-width through-hole(s) to realize a high-density circuit board, a method for producing a circuit board, and a circuit board. A method for forming a ... | 03/27/2012 |
| 8143531 | Electronic component mounting package An electronic component mounting package includes a structure (coreless substrate) in which a plurality of wiring layers are stacked one on top of another with insulating layers interposed therebetween and are interconnected through via holes formed in the insulatin... | 03/27/2012 |
| 8141770 | Conductive ball mounting method and surplus ball removing apparatus A surplus ball removing apparatus including a substrate stage, a substrate including a connection pad, a mask with opening to supply conductive ball onto the substrate, a surplus ball adhering head for removing surplus ball mounted on the substrate, adhering head mo... | 03/27/2012 |
| 8138424 | Wiring substrate including a reinforcing structural body A wiring substrate includes (i) a wiring forming region in which wiring layers and an insulating layer are alternately stacked, (ii) an outer periphery region around the wiring forming region, and (iii) a reinforcing structural body having (a) a first reinforcing me... | 03/20/2012 |
| 8137497 | Method of manufacturing wiring substrate A method includes the steps of providing a first tape base material on a single side of a stiffener substrate, forming, on the stiffener substrate, a cavity for accommodating a semiconductor chip therein, inserting the stiffener substrate in the cavity and providing... | 03/20/2012 |
| 8129830 | Electronic component package and method of manufacturing the same, and electronic component device An electronic component package, includes a package substrate portion constructed by a silicon substrate in which a through hole is provided, an insulating layer formed on both surface sides of the silicon substrate and an inner surface of the through hole, and a th... | 03/06/2012 |
| 8127439 | Method of manufacturing electronic component device A recessed portion is formed in a predetermined position in a heat-spreading component. A thermoplastic resin serving as a thermal interface material (TIM) is stored in the recessed portion. Meanwhile, a large number of filamentous thermo-conductive elements serving... | 03/06/2012 |
| 8120166 | Semiconductor package and method of manufacturing the same, and semiconductor device and method of manufacturing the same A semiconductor package of the present invention, includes a wiring substrate, a lead pin fixed to a connection pad on one surface side of the wiring substrate by solder, and a reinforcing resin layer formed on a surface of the wiring substrate on which the lead pin... | 02/21/2012 |
| 8119932 | Wiring board and method of manufacturing the same First, a structure is fabricated by directly bonding a first base material and a second base material. The first base material has a recessed portion formed in a desired patterning layout on one surface thereof, and the bonding is performed in such a manner that the... | 02/21/2012 |
| 8116066 | Method of manufacturing electronic component built-in substrate In a method of manufacturing an electronic component built-in substrate of the present invention, a mounted body including a first insulating layer, a stopper metal layer formed under the first insulating layer of a portion corresponding to a component mounting regi... | 02/14/2012 |
| 8115300 | Wiring substrate and manufacturing method thereof, and semiconductor apparatus In a semiconductor apparatus, a semiconductor element is mounted on a wiring substrate. Wiring patterns and protrusions are formed on a surface of a substrate with the wiring patterns extending on tops of the protrusions. The surface of the substrate on which the wi... | 02/14/2012 |
| 8111523 | Wiring board with switching function and method of manufacturing the same A wiring board for use in mounting an electronic component includes a switch element portion interposed in a signal transmission line including a wiring layer linked to an electrode terminal of the electronic component. The switch element portion has such a structur... | 02/07/2012 |
| 8106484 | Silicon substrate for package In a silicon substrate for a package, a through electrode is provided with which a through hole passing through from a bottom surface of a cavity for accommodating a chip of an electronic device to a back surface of the substrate is filled. An end part of the throug... | 01/31/2012 |
| 8096049 | Method of manufacturing a multilayer wiring board First, a unilayer wiring board is fabricated, which has wiring layers formed in desired shapes on both sides of an insulating base member; and a metal bump formed on the wiring layer on one side of the insulating base member. Then, a desired number of unilayer board... | 01/17/2012 |
| 8094457 | Electronic apparatus An electronic apparatus includes a substrate, electronic components mounted on the substrate, an antenna mounted on the substrate, and a resin material containing a dielectric constant adjusting material added therein, and sealing the electronic components and the a... | 01/10/2012 |
| 8080122 | Method of manufacturing wiring substrate and method of manufacturing semiconductor device There are provided a step of preparing a dummy chip, a step of forming a cavity in a stiffener substrate, a step of providing a second tape base member on one surface of the stiffener substrate, a step of inserting the dummy chip into the cavity to provide the dummy... | 12/20/2011 |
| 8076678 | Package for photoelectric wiring and lead frame A package for a photoelectric wiring in which a pair of light emitting and receiving devices are mounted as optical devices on a lead frame having an optical waveguide in which an optical waveguide having a plurality of core portions disposed in parallel and surroun... | 12/13/2011 |
| 8068326 | Electrostatic chuck and substrate temperature control fixing apparatus There is provided an apparatus including: an electrostatic chuck for holding an object; and a base plate which supports the electrostatic chuck and controls a temperature of the electrostatic chuck. The electrostatic chuck is fixed onto the base plate via an adhesiv... | 11/29/2011 |
| 8067695 | Wiring board and method of manufacturing the same A wiring board (package) includes: a cavity formed at a position corresponding to a chip mounting area of the outermost insulating layer on one side of both surfaces of the wiring board; a pad exposed from the surface of the insulating layer in the cavity; and a pad... | 11/29/2011 |
| 8062927 | Wiring board and method of manufacturing the same, and electronic component device using the wiring board and method of manufacturing the same A wiring board is provided with an external connection terminal to which an electrode terminal of an electronic component is to be connected. The external connection terminal is formed so that a portion thereof is electrically connected to a pad portion exposed from... | 11/22/2011 |
| 8057950 | Solid oxide fuel cell and method of manufacturing the same A solid oxide fuel cell includes: a solid electrolyte; and electrodes on both surfaces of the solid electrolyte, wherein at least one of joint surfaces where the solid electrolyte and the electrodes are in contact with each other is a roughened surface having at lea... | 11/15/2011 |
| 8052882 | Method of manufacturing wiring substrate A method of manufacturing a wiring substrate of the present invention, includes the steps of forming a seed layer on an underlying layer, forming a plating resist in which an opening portion is provided on the seed layer, forming a copper plating layer in the openin... | 11/08/2011 |
| 8046911 | Method for mounting electronic component on substrate and method for forming solder surface A method for mounting an electronic component on a substrate includes: forming an Au bump (24) on a surface of an electrode (20) of a substrate (10); placing an Sn-based solder sheet (26) on the Au bump; subjecting the Sn-based solder she... | 11/01/2011 |
| 8044429 | Light-emitting device and method for manufacturing the same A light-emitting device including a light-emitting element and a substrate where the light-emitting element is arranged. A housing part housing the light-emitting element and having a shape that is tapered upward from the substrate and a metal frame surrounding the ... | 10/25/2011 |
| 8039967 | Wiring substrate with a wire terminal A wiring substrate includes a silicon substrate, a through hole formed to penetrate the silicon substrate in a thickness direction, an insulating layer formed on both surfaces and side surfaces of the silicon substrate and an inner surface of the through hole, a pen... | 10/18/2011 |
| 8037596 | Method for manufacturing a wiring board A wiring board includes: an uppermost wiring layer formed on a prescribed number of underlying wiring layers, a portion of the uppermost wiring layer being exposed and used as a pad for connection with a component to be mounted; and an insulation resin layer coverin... | 10/18/2011 |
| 8034188 | Method for cleaning surface of resin layer A method for cleaning a surface of a resin layer capable of sufficiently improving peel strength of a metal film formed by plating on a surface which is roughened by performing a desmear treatment on a resin layer containing a resin added with a large amount of fill... | 10/11/2011 |
| 8026610 | Silicon interposer and method for manufacturing the same A method for manufacturing a silicon interposer, includes a step of forming a protection film on a surface, on which an element portion is formed, of a silicon wafer, a step of forming open holes according to planar arrangements of through holes which pass through t... | 09/27/2011 |
| 8026448 | Multilayer wiring board and method of manufacturing the same A multilayer wiring board includes at least two wiring boards having wiring layers containing wiring patterns formed on both sides. A pair of fin-shaped bumps are formed at desired positions on wiring patterns on the surfaces facing each other, of the wiring boards,... | 09/27/2011 |
