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| Number | Title | Issue Date |
| 6993696 | Semiconductor memory device with built-in self test circuit operating at high rate A semiconductor memory device with a built-in self test circuit includes a semiconductor substrate, a memory cell array formed on the semiconductor substrate, an input buffer provided on the semiconductor substrate to receive externally applied data, a test circuit ... | 01/31/2006 |
| 6934648 | Jitter measurement circuit for measuring jitter of measurement target signal on the basis of sampling data string obtained by using ideal cyclic signal A jitter measurement circuit includes: a conversion section sampling one of a reference signal and a measurement target signal in response to the other of the signals, thereby obtaining a sampling data string; and a determination section measuring jitter of the meas... | 08/23/2005 |
| 6864580 | Semiconductor device and method of manufacturing the same A semiconductor device having a structure in which no short circuit occurs between plug interconnections even when a void occurs in an insulating layer in a gap between wiring layers and a method of manufacturing the same are attained. The method includes: a step of... | 03/08/2005 |
| 6841487 | Method of manufacturing semiconductor device and flash memory A semiconductor manufacturing method is mainly contemplated, improved to prevent an altered surface layer of a resist from being removed when a single patterned resist is used to provide dry-etch and wet-etch successively. On a semiconductor substrate an insulation ... | 01/11/2005 |
| 6823229 | Substrate carrier management system and program The substrate carrier management system includes a pre-diffusion processing apparatus, a carrier cleaner, and a carrier conveyer. The pre-diffusion processing apparatus unloads a substrate from a supplied carrier in which the substrate is stored, performs predetermi... | 11/23/2004 |
| 6815265 | Method of fabricating a semiconductor device with a passivation film An uppermost interlayer isolation film is provided on a semiconductor substrate. An uppermost wire is provided on the uppermost interlayer isolation film. A silicon oxide film is provided to cover the upper surface and the side wall of the uppermost wire. A nitride ... | 11/09/2004 |
| 6802034 | Test pattern generation circuit and method for use with self-diagnostic circuit A test pattern generation circuit for use with a self-diagnostic circuit which produces a test pattern through use of a microinstruction code, which includes a memory device RAM/ROM which temporarily stores the microinstruction code and outputs two different instruc... | 10/05/2004 |
| 6788990 | Process control device and process control method A process control device controls a plurality of processing devices placed in parallel to perform at least two process steps for consecutively processing workpieces in a lot. The process control device includes a device group information for grouping of a plurality ... | 09/07/2004 |
| 6747466 | Substrate testing apparatus and substrate testing method A substrate testing apparatus includes a first rail group made of a plurality of rails disposed in parallel with each other, a second rail group made of a plurality of rails disposed in parallel with each other in a direction that crosses the first rail group, a plu... | 06/08/2004 |
| 6724668 | Semiconductor device provided with memory chips In each of a plurality of memory chips in the semiconductor integrated circuit device, an address signal of a defective memory cell in a memory circuit is obtained by a pattern generation tester circuit and a repair analysis circuit, and stored in a replacement stor... | 04/20/2004 |
| 6716718 | Method of producing a semiconductor device A trench is formed by performing an anisotropic etching treatment on a silicon substrate with the use of a mask pattern including a pad oxide film, a polysilicon film, and a silicon nitride film formed on the silicon substrate, as a mask. Next, the side surface of t... | 04/06/2004 |
| 6714888 | Apparatus for testing semiconductor integrated circuit There is provided an apparatus and method of testing a semiconductor integrated circuit, which apparatus and method enable testing of various semiconductor integrated circuits having different characteristics, fulfillment of the function of generating DAC data, and ... | 03/30/2004 |
| 6708302 | Semiconductor module A semiconductor module that comprises a plurality of semiconductor chips mounted on a single substrate and which readily diagnoses all the semiconductor chips. A plurality of semiconductor chips are mounted on a single substrate. The semiconductor module is provided... | 03/16/2004 |
| 6593063 | Method of manufacturing a semiconductor device having an improved fine structure A first resist layer, capable of generating an acid, is formed on a semiconductor base layer and is developed in a shortened developing time than usual. The first resist pattern is covered with a second resist layer containing a material capable of crossl... | 07/15/2003 |
| 6593154 | Apparatus and method for controlling semiconductor manufacturing system utilizing recycled wafers A method of process control includes the steps of preparing recycling procedure data for each type of film formed on a wafer by diffusion processing, setting a recycle control number for controlling recycling processing based on the recycling procedure da... | 07/15/2003 |
| 6586823 | Semiconductor device that can have a defective bit found during or after packaging process repaired A replacement information storage unit stores additional replacement information determined according to testing carried out during or after assembly. A replacement information addition load unit receives additional replacement information from outside a ... | 07/01/2003 |
| 6577972 | Sampling inspection managing system In a sampling inspection managing system, for each processing step, a setting is made on a processing flow table as to whether the processing step concerned is a step for determining the sampling inspection frequency of a specific inspection step. For a p... | 06/10/2003 |
| 6573603 | Semiconductor device, and method of manufacturing the same There are described a semiconductor device having multilayer wiring and a method for manufacturing the semiconductor device, wherein an interconnection hole for interconnecting an upper wiring layer to a lower wiring layer is formed correctly, thereby imp... | 06/03/2003 |
| 6566040 | Method of manufacturing a semiconductor device and semiconductor device manufactured by the method First, a hole pattern or a separation pattern of a first resist that is capable of supplying acid is formed on a semiconductor substrate. Then, a crosslinked film (organic frame) is formed on the side wall of the first resist pattern to obtain a resist pa... | 05/20/2003 |
| 6563188 | Semiconductor device having multilayer passivation layer formed over memory cell fuse area A semiconductor device of the present invention is provided with a first metal wire formed above a semiconductor substrate with an interlayer insulating film intervened, a fuse formed on interlayer insulating film so as to be spaced at a distance away fro... | 05/13/2003 |
| 6555790 | Semiconductor manufacturing apparatus, method for cleaning the semiconductor manufacturing apparatus, and light source unit There is described a semiconductor manufacturing apparatus for coating the surface of a semiconductor wafer with an organic coating, such as anti-reflective coating, which shortens a down time required in association with removal of compounds that tend to... | 04/29/2003 |
| 6528334 | Semiconductor inspection system, and method of manufacturing a semiconductor device There are described a semiconductor inspection system for inspecting recessed defects formed in a semiconductor wafer and a semiconductor device manufacturing method including an inspection step of inspecting recessed defects formed in a semiconductor waf... | 03/04/2003 |
| 6529792 | Process equipment selecting system and method for selecting process equipment A process selection system and method enable the automatic control of the specification to equipment most suitable for each lot. Processing using this specific equipment can be performed by further selecting the most suitable equipment from equipment used... | 03/04/2003 |
| 6500675 | Manufacturing method of semiconductor device having capacitive element A dielectric layer for capacitive element is formed on a lower electrode. An interlayer insulating layer is formed on the lower electrode and the dielectric layer for capacitive element. A plug hole reaching the dielectric layer for capacitive element is ... | 12/31/2002 |
| 6492923 | Test system and testing method using memory tester A memory tester including an algorithmic pattern generator (ALPG) for generating a test pattern as a digital signal based on vector data is provided with a digital-to-analog converter built in the memory tester or provided outside the memory tester. Thus,... | 12/10/2002 |
| 6480755 | Process control device and process control method permitting processing order and processing condition to be changed while manufacturing process continues A process control device includes: a change table detection unit to determine existence of a change table corresponding to a progress file; a progress file adjustment unit to change, when the change table detection unit determines that there exists a chan... | 11/12/2002 |
| 6463348 | Process control device and process control method enabling restoration of lot control A process control device for controlling a processing device and a transport apparatus while updating process information of a lot includes: a control information update unit to update control information for controlling the processing device and the tran... | 10/08/2002 |
| 6461977 | Method of manufacturing semiconductor device An improved etching method allowing the formation of a silicon nitride film with an adequate film thickness at the sidewall portion of a pattern is disclosed. A silicon nitride film formed to cover a stepped pattern is dry-etched, employing plasma of mixe... | 10/08/2002 |
| 6458655 | Method of manufacturing semiconductor device and flash memory A semiconductor manufacturing method is mainly contemplated, improved to prevent an altered surface layer of a resist from being removed when a single patterned resist is used to provide dry-etch and wet-etch successively. On a semiconductor substrate an ... | 10/01/2002 |
| 6456102 | External test ancillary device to be used for testing semiconductor device, and method of testing semiconductor device using the device An external test ancillary device (BOST device) analyzes measured information output from a semiconductor integrated circuit and transmits a result of analysis to a semiconductor test apparatus. The external test ancillary device includes a DAC counter fo... | 09/24/2002 |
| 6444515 | Method of fabricating a semiconductor device A hard mask insulating layer is formed on a gate electrode which is formed on a main surface of a silicon substrate with a gate insulating layer interposed. An SiN sidewall spacer is directly formed on a thin SiO2 layer which is formed to cover... | 09/03/2002 |
| 6426533 | Semiconductor device and manufacturing method thereof A structure of a BiCMOS transistor hindering over-etching of source/drain regions of a MOS transistor and a manufacturing method thereof are provided. A polysilicon film that is to be a gate electrode lower layer of a MOS transistor is formed, and thereon... | 07/30/2002 |
| 6397119 | Semiconductor manufacturing system for simultaneous processing of prescribed number of lots A semiconductor manufacturing system having a high processing efficiency and a high product output includes a processing device for simultaneously processing a prescribed number of lots for which it is reserved, and a semiconductor manufacturing system co... | 05/28/2002 |
| 6380058 | Method and apparatus for manufacturing semiconductor device A barrier layer is formed at a bottom portion, for example, of a through hole. The thickness of the barrier layer at an upper area, for example, of the through hole is made uniform. The method of manufacturing a semiconductor device includes the steps of:... | 04/30/2002 |
| 6376157 | Method of manufacturing a semiconductor device, chemical solution to form fine pattern, and semiconductor device In a method of manufacturing a semiconductor device, a first resist pattern, which evolves an acid, is formed on a semiconductor substrate. The first resist pattern is treated with a chemical solution containing a crosslinking agent and a swelling promote... | 04/23/2002 |
| 6345004 | Repair analysis circuit for redundancy, redundant repairing method, and semiconductor device A repair analysis circuit for redundancy, a redundant method for repairing a redundant, and a semiconductor device that can shorten time for testing defective memory cells, that eliminate the need of failure memories having a huge capacity for storing def... | 02/05/2002 |
| 6327021 | Mask inspection system and method of manufacturing semiconductor device There is described a mask inspection system suitable for reliably removing dust particles from a mask. The system is intended for eliminating the necessity of repetition of dust particle inspection by simultaneous removal of dust particles and checking of... | 12/04/2001 |
| 6311300 | Semiconductor testing apparatus for testing semiconductor device including built in self test circuit A program power supply of a tester applies a power supply voltage to an IC to be tested. A pattern generator applies a clock signal and a command signal to a BIST circuit of IC. BIST circuit tests memory IC unit and logic IC unit and serially outputs data... | 10/30/2001 |
| 6281060 | Method of manufacturing a semiconductor device containing a BiCMOS circuit A structure of a BiCMOS transistor hindering over-etching of source/drain regions of a MOS transistor and a manufacturing method thereof are provided. A polysilicon film that is to be a gate electrode lower layer of a MOS transistor is formed, and thereon... | 08/28/2001 |
| 6256875 | Method for manufacturing semiconductor device The minimum spacing between wires disposed on a printed circuit board of a printed circuit board ball grid array package is reduced. Wiring layers are narrower than in the prior art because they are not plated and because only one metal layer is plated on... | 07/10/2001 |
