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Patent No. 6293874

User-operated amusement apparatus for kicking the user's buttocks

An apparatus including a user-operated and controlled apparatus for self-infliction of repetitive blows to the user's buttocks by a plurality of elongated arms bearing flexible extensions that rotate under the user's control.

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Assignee: Rudolph Technologies, Inc.


Location: Flanders, NJ
No. of patents: 61

1    
NumberTitleIssue Date
8175372Wafer edge inspection and metrology
Some aspects of the present invention relate to a wafer inspection method. A plurality of images is acquired about an edge portion of a wafer. Each of the images comprises a pixel array having a first dimension and a second dimension. A composite image of compressed...
05/08/2012
8139232Multiple measurement techniques including focused beam scatterometry for characterization of samples
A system for monitoring thin-film fabrication processes is herein disclosed. Diffraction of incident light is measured and the results are compared to a predictive model based on at least one idealized or nominal structure. The model and/or the measurement of diffra...
03/20/2012
8130372Wafer holding mechanism
A wafer holding mechanism for holding a wafer of the type used in the manufacture of semiconductor devices is herein described. The mechanism has a first plate having a number of offsets that define at least one lip that extends radially inward of the offsets. A sec...
03/06/2012
8097966Adjustable film frame aligner
A film frame aligner for automatically aligning a film frame includes a film frame support, a film frame pusher for pushing the film frame, and a film frame location mechanism for locating at least one notch in the film frame. ...
01/17/2012
RE42481Semiconductor yield management system and method
A system and method for yield management is disclosed wherein a data set containing one or more prediction variable values and one or more response values is input into the system. The system can pre-process the input data set to remove prediction variables with mis...
06/21/2011
7960981Apparatus for obtaining planarity measurements with respect to a probe card analysis system
A system and method of mitigating the effects of component deflections in a probe card analyzer system may implement three-dimensional comparative optical metrology techniques to model deflection characteristics. An exemplary system and method combine non-bussed ele...
06/14/2011
7903238Combination of ellipsometry and optical stress generation and detection
A method includes selecting one of performing ellipsometry or performing optical stress generation and detection. The method also includes, in response to selecting performing ellipsometry, applying at least one first control signal to a controllable retarder that m...
03/08/2011
7865010Wafer edge inspection and metrology
Some aspects of the present invention relate to a wafer inspection method. A plurality of images is acquired about an edge portion of a wafer. Each of the images comprises a pixel array having a first dimension and a second dimension. A composite image of compressed...
01/04/2011
7835566All surface data for use in substrate inspection
A system for capturing, calibrating and concatenating all-surface inspection and metrology data is herein disclosed. Uses of such data are also disclosed. ...
11/16/2010
7822260Edge inspection
A semiconductor inspection tool comprises an edge top camera for obtaining images of a top edge of a wafer, an edge normal camera for obtaining images of a normal edge of the wafer, and a controller for receiving the images of the top edge of the wafer and the image...
10/26/2010
7813638System for generating camera triggers
A system for generating a camera trigger that causes a camera to capture image data includes a memory for storing a plurality of trigger values. Each trigger value corresponds to a position of a moving stage. The system includes a controller for receiving position i...
10/12/2010
7782071Probe card analysis system and method
A system and method for evaluating wafer test probe cards under real-world wafer test cell condition integrates wafer test cell components into the probe card inspection and analysis process. Disclosed embodiments may utilize existing and/or modified wafer test cell...
08/24/2010
7750622Method of applying the analysis of scrub mark morphology and location to the evaluation and correction of semiconductor testing, analysis and manufacture
By examining scrub mark properties (such as position and size) directly, the performance of a wafer probing process may be evaluated. Scrub mark images are captured, image data measured, and detailed information about the process is extracted through analysis. The i...
07/06/2010
7729528Automated wafer defect inspection system and a process of performing such inspection
An automated defect inspection system has been invented and is used on patterned wafers, whole wafers, broken wafers, partial wafers, sawn wafers such as on film frames, JEDEC trays, Auer boats, die in gel or waffle packs, MCMs, etc. and is specifically intended and...
06/01/2010
7724358Illuminator for darkfield inspection
Light from a single source is divided among several illumination arms, each of which directs light via a multimode fiber bundle from the source to the wafer location. The arms are arranged circumferentially around a common illumination region, so that the region is ...
05/25/2010
7706599Edge normal process
An edge inspection method for detecting defects on a wafer edge normal surface includes acquiring a set of digital images which captures a circumference of the wafer. An edge of the wafer about the circumference is determined. Each digital image is segmented into a ...
04/27/2010
7705974Metrology system with spectroscopic ellipsometer and photoacoustic measurements
An optical system includes both a microspot broadband spectroscopic ellipsometer and a photoacoustic film thickness measurement system that are supplied laser light by the same laser light source. One of the systems makes a measurement, the result of which is used t...
04/27/2010
7703823Wafer holding mechanism
A wafer holding mechanism for holding a wafer of the type used in the manufacture of semiconductor devices is herein described. The mechanism has a first plate having a number of offsets that define at least one lip that extends radially inward of the offsets. A sec...
04/27/2010
7684611Photoresist edge bead removal measurement
An edge bead removal measurement method includes determining an edge of a wafer about a circumference of the wafer. A location of a wafer notch on the edge of the wafer is determined. A location of a center of the wafer is determined. A distance from the edge of the...
03/23/2010
7663382High-speed capacitor leakage measurement systems and methods
Systems and methods according to aspects of the present invention are described. The systems and methods enable charging, soaking, and measuring of capacitors to be conducted quickly. Charging and soaking typically occurs in parallel and certain embodiments facilita...
02/16/2010
7634129Dual-axis scanning system and method
An image acquisition system and method may employ a non-orthogonal optical axis. The optical axis may be established in such a manner as to position a focal plane of an imaging device in a selected orientation relative to the object space. Such selective positioning...
12/15/2009
7634128Stereoscopic three-dimensional metrology system and method
A stereoscopic three-dimensional optical metrology system and method accurately measure the location of physical features on a test article in a manner that is fast and robust to surface contour discontinuities. Disclosed embodiments may image a test article from tw...
12/15/2009
7633306System and method of measuring probe float
A system and method allow accurate calculation of probe float through optical free-hanging and electrical planarity measurement techniques. In accordance with an examplary embodiment, probe float may be determined by acquiring a free-hanging planarity measurement, o...
12/15/2009
7629993Automated wafer defect inspection system using backside illumination
A defect inspection system for the semiconductor and microelectronics industry. More particularly, the present invention relates to an automated defect inspection system for wafers or other semiconductor or electronic substrates of any kind or type that are transpar...
12/08/2009
7616804Wafer edge inspection and metrology
Some aspects of the present invention relate to a wafer inspection method. A plurality of images is acquired about an edge portion of a wafer. Each of the images comprises a pixel array having a first dimension and a second dimension. A composite image of compressed...
11/10/2009
7616328Method and system for providing a high definition triangulation system
A triangulation system including a laser beam, optics focusing the laser beam on an object, a light detection unit detecting light reflected from the object due to impingement of the beam on the object, and an arrangement for determining, based on the detected light...
11/10/2009
7593565All surface data for use in substrate inspection
A system for capturing, calibrating and concatenating all-surface inspection and metrology data is herein disclosed. Uses of such data are also disclosed. ...
09/22/2009
7589783Camera and illumination matching for inspection system
An inspection tool includes a camera having a gain value and an offset value set to provide a first camera output indicating a first desired average gray value when the camera is illuminated with a precision light source set at a first light level. The inspection to...
09/15/2009
7586607Polarization imaging
A system and method for inspection a substrate for various defects is herein disclosed. Polarizing filters are used to improve the contrast of polarization dependent defects such as defocus and exposure defects, while retaining the same sensitivity to polarization i...
09/08/2009
7579853Apparatus for obtaining planarity measurements with respect to a probe card analysis system
A system and method of mitigating the effects of component deflections in a probe card analyzer system may implement three-dimensional comparative optical metrology techniques to model deflection characteristics. An exemplary system and method combine non-bussed ele...
08/25/2009
7539583Method and system for defect detection
A method for inspecting objects such as semiconductor wafers. A staging platform and an optical platform are arranged so that the object may be staged and its surface scanned by optical equipment situated on the optical platform. During the scanning process, the sur...
05/26/2009
7522272Metrology system with spectroscopic ellipsometer and photoacoustic measurements
An optical system includes both a microspot broadband spectroscopic ellipsometer and a photoacoustic film thickness measurement system that are supplied laser light by the same laser light source. One of the systems makes a measurement, the result of which is used t...
04/21/2009
7461961Fiber optic darkfield ring light
A fiber optic darkfield ring light with many angled fiber optic light lines with direct illumination in a very small package. The fiber optic darkfield ring light includes a base with multiple light heads and multiple light covers attached thereto, a main cover, an ...
12/09/2008
7385409System and method of mitigating effects of component deflection in a probe card analyzer
A system and method of mitigating the effects of component deflections in a probe card analyzer system may implement three-dimensional comparative optical metrology techniques to model deflection characteristics. An exemplary system and method combine non-bussed ele...
06/10/2008
7373275System and method of point matching measured positions to template positions
A system and method of point matching measured positions to template, or reference, positions for various applications may generally comprise creating force field vectors and moments operative to perturb measured point locations into alignment with template point lo...
05/13/2008
7369234Method of performing optical measurement on a sample
The invention relates to a method of performing an optical measurement on a sample, such as an ellipticity measurement. The sample is irradiated with a polarized irradiation beam and a return beam is linearly polarized. The irradiation or return beam is modulated wi...
05/06/2008
7366344Edge normal process
An edge inspection method for detecting defects on a wafer edge normal surface includes acquiring a set of digital images which captures a circumference of the wafer. An edge of the wafer about the circumference is determined. Each digital image is segmented into a ...
04/29/2008
7340087Edge inspection
A semiconductor inspection tool comprises an edge top camera for obtaining images of a top edge of a wafer, an edge normal camera for obtaining images of a normal edge of the wafer, and a controller for receiving the images of the top edge of the wafer and the image...
03/04/2008
7316938Adjustable film frame aligner
A film frame aligner for automatically aligning a film frame includes a film frame support, a film frame pusher for pushing the film frame, and a film frame location mechanism for locating at least one notch in the film frame. ...
01/08/2008
7253887Metrology system with spectroscopic ellipsometer and photoacoustic measurements
A photoacoustic system with ellipsometer, where the ellipsometer includes a laser light source for generating an incident beam, an element for focusing the incident beam on a sample, a unit for measuring the change in amplitude of the incident beam on reflection and...
08/07/2007
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