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Assignee: Rehm Thermal Systems GmbH


Location: Blaubeuren-Seissen, DE
No. of patents: 2

NumberTitleIssue Date
7753997Cleaning device for cleaning process gas of a reflow soldering system
The present invention is directed to a cleaning device for process gases of a reflow soldering system that includes a plurality of cleaning chambers. The plurality of cleaning chambers contain a cleaning liquid for the process gas, where each of the cleaning chamber...
07/13/2010
7581668Method and device for reflow soldering with volume flow control
According to one aspect of the invention it is possible to rapidly heat a soldering item by reducing an initially larger volume flow at a constant or increasing temperature, effectively preventing small components from overheating. By using the volume flow of a conv...
09/01/2009
 
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