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| Number | Title | Issue Date |
| 7037184 | Polishing pad for use in chemical-mechanical planarization of semiconductor wafers and method of making same A polishing pad for use in chemical mechanical polishing of substrates that being made of a porous structure comprising a matrix consisting of fibers, such as cotton linter cellulose bound with a thermoset resin, such as phenolic resin. The polishing pad surface has... | 05/02/2006 |
